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    AN ELECTRICALLY CONDUCTIVE ARTICLE CONTAINING SHAPED PARTICLES AND METHODS OF MAKING SAME
    21.
    发明申请
    AN ELECTRICALLY CONDUCTIVE ARTICLE CONTAINING SHAPED PARTICLES AND METHODS OF MAKING SAME 审中-公开
    包含形状颗粒的电导体制品及其制造方法

    公开(公告)号：US20160249495A1

    公开(公告)日：2016-08-25

    申请号：US15027496

    申请日：2014-11-10

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Dipankar Ghosh ,  Jeffrey W. McCutcheon ,  Scott R. Culler

    IPC: H05K9/00 ,  H01B1/24 ,  H01B1/20 ,  H01B1/22

    Abstract: Electrically conductive articles are provided, including a composite including (a) a resin, and (b) electrically conductive shaped particles distributed in the resin, the particles having a monosized distribution. Each particle has a shape including at least a first surface and a second surface intersecting the first surface at an angle a between about 5 degrees and about 150 degrees. The composite has a thickness and often each of the electrically conductive shaped particles distributed in the resin is oriented within the resin such that the particle does not extend beyond the thickness of the composite. A method for making an electrically conductive article is also provided, including (a) providing electrically conductive shaped particles having a monosized distribution, and (b) distributing the particles into a resin to form a composite.

    Abstract translation: 提供导电制品，包括包含（a）树脂的复合材料和（b）分布在树脂中的导电成形颗粒，颗粒具有单一分布。 每个颗粒具有至少第一表面和第二表面的形状，该第一表面和第二表面以大约5度至大约150度之间的角度α与第一表面交叉。 复合材料具有厚度，并且通常将分布在树脂中的每个导电成形颗粒定向在树脂内，使得颗粒不超过复合材料的厚度。 还提供了制造导电制品的方法，包括（a）提供具有单一分布的导电成形颗粒，和（b）将颗粒分散在树脂中以形成复合材料。

    ELECTROMAGNETIC ABSORBING COMPOSITES
    23.
    发明公开
    ELECTROMAGNETIC ABSORBING COMPOSITES 审中-公开

    公开(公告)号：US20240098950A1

    公开(公告)日：2024-03-21

    申请号：US18256979

    申请日：2021-12-16

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Adam D. Miller ,  Dipankar Ghosh

    IPC: H05K9/00

    CPC classification number: H05K9/003 ,  H05K9/0083 ,  H05K9/0084

    Abstract: A composite comprising a polymeric matrix and EM absorbers dispersed within the polymeric matrix. Each EM absorber comprises a ceramic particle having a surface, and a magnetic coating on at least a portion of the surface of the ceramic particle. The EM absorbers function as dielectric and magnetic absorbers in the 1-100 GHz frequency range. The composite can be used as an electromagnetic shielding article to mitigate electromagnetic interference in, for example, high speed, high frequency (HSHF) consumer electronics.

    Waveguide and communication system
    24.
    发明授权
    Waveguide and communication system 有权

    公开(公告)号：US11677130B2

    公开(公告)日：2023-06-13

    申请号：US17508341

    申请日：2021-10-22

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Jaewon Kim ,  Dipankar Ghosh ,  Craig W. Lindsay ,  Matthew S. Stay

    IPC: H01P3/16

    CPC classification number: H01P3/16

    Abstract: A waveguide for receiving an incident electromagnetic wave (EMW) having an operating frequency Γ includes an array of spaced apart unit cells arranged along the waveguide. The unit cells are configured to resonantly couple to the incident EMW and radiate an EMW at the operating frequency propagating inside and along the waveguide. Each unit cell is configured to couple to the incident EMW with a first coupling efficiency and includes a dielectric body configured to couple to the incident EMW with a second coupling efficiency and one or more metal layers disposed on and partially covering the dielectric body. The second coupling efficiency is substantially smaller than the first coupling efficiency. A communication system includes the waveguide and a transceiver configured to emit an EMW having the operating frequency Γ.

    High frequency electromagnetic interference (EMI) composites
    25.
    发明授权
    High frequency electromagnetic interference (EMI) composites 有权

    公开(公告)号：US11369050B2

    公开(公告)日：2022-06-21

    申请号：US15579077

    申请日：2016-06-02

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Dipankar Ghosh

    IPC: H05K9/00

    Abstract: Electromagnetic interference (EMI) shielding composites and methods of producing the same are described. Carbon nanostructure (CNS) fillers including cross-linked carbon nanotubes (CNTs) and a polymeric encapsulation material are provided, where the carbon nanotubes are encapsulated by the polymeric encapsulation material. The CNS fillers are treated to remove at least a portion of the polymeric encapsulation material. After removing the polymeric encapsulation material, the CNS fillers are mixed with a curable matrix material to obtain EMI shielding composites. In some cases, the removal of the polymeric encapsulation material results in diminished dielectric polarization characteristics for the composites.

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