公开(公告)号：US11279859B2

公开(公告)日：2022-03-22

申请号：US16463688

申请日：2017-11-29

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Matthew R. D. Smith ,  Matthew S. Stay ,  Mikhail L. Pekurovsky ,  Daniel J. Theis ,  Thomas J. Metzler ,  Shawn C. Dodds

IPC: C09J7/00 ,  B32B7/00 ,  B32B37/00 ,  B32B38/00 ,  C09J5/00 ,  G01N21/00 ,  C09J7/40 ,  C09J7/38 ,  B32B7/12 ,  B32B37/12 ,  G01N21/64

Abstract: Methods of passivating an adhesive via printing an ink onto a release liner, and adhesive articles or products made by the same are provided. An ink pattern is printed onto a release liner to form a pattern of features. The features are at least partially embedded in an adhesive layer such that when the release liner is peeled from the adhesive layer, the passivation features remain with the layer of adhesive to form selected areas having adjusted adhesive functionality. Articles including the passivated adhesive on a release liner are also disclosed.

公开(公告)号：US11114599B2

公开(公告)日：2021-09-07

申请号：US16498478

申请日：2018-03-22

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Ankit Mahajan ,  Mikhail L. Pekurovsky ,  Matthew S. Stay ,  Shawn C. Dodds ,  Thomas J. Metzler ,  Matthew R. D. Smith ,  Saagar A. Shah ,  Jae Yong Lee ,  James F. Poch ,  Roger W. Barton

IPC: H01L35/04 ,  H01L35/34 ,  H01L35/32 ,  H01L21/762 ,  H01L21/768 ,  H01L21/603

Abstract: Electronic devices including a layer of polymeric material and solid semiconductor dies partially embedded in the layer are provided. The dies have first ends projecting away from the first major surface of the layer. The electronic devices can be formed by sinking the first ends of the dies into a major surface of a liner. A flowable polymeric material is filled into the space between the dies and solidified to form the layer of polymeric material. The first ends of the dies are exposed by delaminating the liner from the first ends of the dies. Electrical conductors are provided on the layer to connect the first ends of the dies.

公开(公告)号：US20180160548A1

公开(公告)日：2018-06-07

申请号：US15580108

申请日：2016-06-23

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Matthew S. Stay ,  Shawn C. Dodds ,  Ann M. Gilman ,  Mikhail L. Pekurovsky ,  Daniel J. Theis ,  Matthew R. D. Smith

IPC: H05K3/40 ,  G06F3/041 ,  H05K3/46 ,  H05K3/00 ,  H05K1/09 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K3/4069 ,  G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  H05K1/0283 ,  H05K1/0393 ,  H05K1/097 ,  H05K3/0091 ,  H05K3/0097 ,  H05K3/4664 ,  H05K3/4679 ,  H05K2201/026 ,  H05K2203/1173 ,  H05K2203/1545 ,  H05K2203/166

Abstract: A composite article includes a conductive layer on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.