公开(公告)号：JP2007246668A

公开(公告)日：2007-09-27

申请号：JP2006071417

申请日：2006-03-15

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： TAKAHATA YOSHINORI ,  MORI TAKAHIRO ,  SAITO SEIICHI ,  IDE MITSUNORI ,  FUKUDA YOSHIHIRO

IPC: C08J5/24 ,  H05K1/03

CPC classification number: C08J5/24 ,  C08G59/46 ,  C08J2377/00 ,  C08K3/013 ,  C08L63/00 ,  C08L77/00 ,  H05K1/0326 ,  H05K1/0373 ,  Y10S428/901 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31725 ,  C08L2666/22

Abstract: PROBLEM TO BE SOLVED: To provide an epoxy resin curing composition for prepreg having a high glass transition temperature and affording the prepreg having a low coefficient of linear expansion.
SOLUTION: The epoxy resin curing composition for the prepreg comprises the following components (A) to (E). (A) a polyamide compound having a structure derived from a phenolic hydroxy group-containing aromatic diamine having the phenolic hydroxy group at a position adjacent to the amino group, (B) an epoxy resin, (C) an epoxy resin curing agent, (D) a filler and (E) a solvent.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供具有高玻璃化转变温度的预浸料的环氧树脂固化组合物，并提供具有低线膨胀系数的预浸料。 解决方案：预浸料的环氧树脂固化组合物包括以下组分（A）至（E）。 （A）具有衍生自在与氨基相邻的位置处具有酚羟基的含酚羟基的芳族二胺的结构的聚酰胺化合物，（B）环氧树脂，（C）环氧树脂固化剂（ D）填料和（E）溶剂。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2011221226A

公开(公告)日：2011-11-04

申请号：JP2010089378

申请日：2010-04-08

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： ISHIKAWA YOSHIHIRO ,  SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: G02B6/13

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a polymer light guide having an excellent flexibility even when a layer of photosensitive polymer material is formed by DFR method.SOLUTION: A method for manufacturing a light guide 11 comprises a step of forming a core material layer 7 by laminating a dry film 2 comprising photosensitive polymer material formed on a support film 1 onto a surface of a lower cladding layer 5 by thermocompression under reduced pressure, a step of peeling the support film 1 on the core material layer 7, a step of heat-treating the core material layer 7 for smoothing the surface, and a step of pattern-exposing the heat-treated core material layer 7 for forming a core part 9 with a predetermined pattern.

Abstract translation: 要解决的问题：提供一种制造具有优异柔性的聚合物光导的方法，即使通过DFR方法形成感光性聚合物材料层也是如此。 解决方案：制造光导11的方法包括通过将包含形成在支撑膜1上的感光性聚合物材料的干膜2层压到下包层5的表面上的热压缩形成芯材层7的步骤 在减压下，将芯材层7上的支撑膜1剥离的步骤，使芯材层7进行热处理以使表面平滑化的工序，以及使热处理后的芯材层7图案曝光的工序 用于形成具有预定图案的芯部9。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2010252631A

公开(公告)日：2010-11-11

申请号：JP2009102828

申请日：2009-04-21

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： TAKENOUCHI HIROMI ,  TANIOKA ASUKA ,  SAITO SEIICHI ,  KOIKE SEIJI ,  SUMITOMO KEIKO ,  ARAKAWA TAKAHIRO ,  YAMAGUCHI YOSHINORI

IPC: C12M3/00

CPC classification number: C12M23/20 ,  C12M25/06

Abstract: PROBLEM TO BE SOLVED: To provide a cell culture substrate having high cellular adhesiveness, enabling normal-temperature preservation and long-term preservation, and fine processing in a micro- or nano-scale. SOLUTION: The cell culture substrate has a silicone resin having a group represented by general formula (1) and/or a group represented by general formula (2) and formed on the surface. In the formulas, R 1 is 1-10C alkylene which may have substituted hydrocarbon; R 2 is 1-4C alkyl; (a) is a number of 0 or 1-4; (b) is a number of 1-3, with the proviso that (a+b) does not exceed 5; R 3 is 1-10C alkylene which may have substituted hydrocarbon; R 4 is 1-4C alkyl; (c) is a number of 0 or 1-4; and (d) is a number of 1-3, with the proviso that (c+d) does not exceed 5. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供具有高细胞粘附性，能够进行常温保存和长期保存的细胞培养基质，以及微米级或纳米级的精细加工。 解决方案：细胞培养基底具有由通式（1）表示的基团和/或由通式（2）表示的基团的表面形成的基团的有机硅树脂。 在式中，R 1是具有取代烃的1-10C亚烷基; R 2是1-4C烷基; （a）是0或1-4的数字; （b）为1-3，条件是（a + b）不超过5; R 3是具有取代烃的1-10C亚烷基; R 4是烷基; （c）是0或1-4的数; （d）为1-3，条件是（c + d）不超过5.版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2008266484A

公开(公告)日：2008-11-06

申请号：JP2007112738

申请日：2007-04-23

Applicant: Adeka Corp ,  Kansai Electric Power Co Inc:The ,  株式会社Adeka ,  関西電力株式会社

Inventor： SUEYOSHI TAKASHI ,  HIWATARI KENICHIRO ,  SHANADO TADASHI ,  SHOJI YOSHIKAZU ,  SAITO SEIICHI ,  SUGAWARA YOSHITAKA

IPC: C08G77/44 ,  C08L83/05 ,  C08L83/07

CPC classification number: C08G77/50 ,  C08L83/14 ,  C08L83/00

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition excellent in a handling property and a curing property in which an obtained cured article is excellent in heat-resistance and flexibility.
SOLUTION: The curable composition comprises a silicon-containing compound represented by general formula (1), the compound in which Z is a hydrogen atom in general formula (1), the compound in which Z is a 2-4C alkenyl group or an alkynyl group in general formula (1), and a hydrosilylated reaction catalyst. In the formula, R
a -R
g are a 1-12C saturated aliphatic hydrocarbon group or a 6-12C aromatic hydrocarbon group (however, R
e and R
f do not simultaneously become the 1-12C saturated aliphatic hydrocarbon group), Y is a 2-4C alkylene group, Z is a hydrogen atom or a 2-4C alkenyl group or an alkynyl group, K is an integer of 2-7, T is an integer of 1-7, and P is an integer of 0-3. M and N are N:M=1:1 to 1:100, are the number in which total of all Ms and all Ns becomes 15 or higher, and are the number in which a mass average molecular weight of the compound is made to 3,000-1,000,000.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种处理性能和固化性能优异的含硫可固化组合物，其中获得的固化物具有优异的耐热性和柔软性。 解决方案：可固化组合物包含通式（1）表示的含硅化合物，其中Z为通式（1）中的氢原子的化合物，其中Z为2-4C烯基的化合物 或通式（1）中的炔基和氢化硅烷化反应催化剂。 在该式中，R 16是具有1-12个碳原子的饱和脂族烃基或6-12个碳芳族烃基（然而，R“ SP>和R f 不同时成为1-12C饱和脂族烃基），Y为2-4C亚烷基，Z为氢原子或2-4C烯基或炔基 组，K为2-7的整数，T为1-7的整数，P为0-3的整数。 M和N为N:M = 1:1至1:100，是所有Ms和全部Ns的总和变为15或更高的数，并且是化合物的质均分子量为 3,000-1,000,000。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2013092633A

公开(公告)日：2013-05-16

申请号：JP2011234285

申请日：2011-10-25

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： TAKENOUCHI HIROMI ,  OMI JUNICHI ,  SAITO SEIICHI

IPC: G03F7/039 ,  C08G77/14 ,  G03F7/075 ,  H01L21/027

Abstract: PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition, which is suitable for the formation of an interlayer insulating film having high heat resistance, high solvent resistance, high transmittance and a low dielectric constant, and which has a large development margin capable of forming a favorable pattern even over the optimal developing time.SOLUTION: The positive photosensitive composition comprises a polysiloxane compound obtained by hydrolysis condensation of a compound (1) and a compound (2) of the formulae, a photoacid generator and an organic solvent. In the formulae, Rrepresents a 1-4C alkyl group or a 6-10C aryl group; Rrepresents a 2-10C divalent hydrocarbon group; Rrepresents a 2-10C divalent saturated aliphatic hydrocarbon group; and Xand Xrepresent an acid dissociable dissolution inhibiting group.

Abstract translation: 要解决的问题：提供一种正型感光性树脂组合物，其适于形成具有高耐热性，高耐溶剂性，高透射率和低介电常数的层间绝缘膜，并且具有大的显影性 即使在最佳开发时间内，边缘也能形成有利的格局。 解决方案：正型光敏组合物包含通过化合物（1）和式（2）的化合物（2），光酸产生剂和有机溶剂的水解缩合得到的聚硅氧烷化合物。 在该式中，R 1表示1-4C烷基或6-10C芳基; R 2 表示2-10C二价烃基; R 3 表示2-10C二价饱和脂族烃基; 并且X 1 和X 2 表示酸解离溶解抑制基团。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2011079917A

公开(公告)日：2011-04-21

申请号：JP2009231970

申请日：2009-10-05

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： HARA KENJI ,  KOBAYASHI JUN ,  YOKOTA HIROO ,  MORITA HIROSHI ,  SAITO SEIICHI

IPC: C08G77/62 ,  C08L83/16 ,  C09D5/25 ,  C09D7/12 ,  C09D183/16 ,  H01L21/314 ,  H01L21/316

CPC classification number: C08G77/62 ,  C08G77/12 ,  C08L83/16 ,  C09D1/00 ,  C09D183/16 ,  H01B3/02 ,  H01L21/02164 ,  H01L21/02222 ,  H01L21/02282 ,  Y10T428/24008

Abstract: PROBLEM TO BE SOLVED: To provide a coating liquid for forming an insulating film in which shrinkage in a baking step in steam is small and crack of a silica film and detachment thereof from a semiconductor substrate is hard to occur, an insulating film using the same, and a method for producing a compound used for the same. SOLUTION: The coating liquid for forming an insulating film includes: inorganic polysilazane having a ratio of a peak area of 4.5-5.3 ppm derived from an SiH 1 group and an SiH 2 group to a peak area of 4.3-4.5 ppm derived from an SiH 3 group of 4.2-50 in 1 H-NMR spectrum; and an organic solvent. The insulating film is obtained by using the coating liquid for forming an insulating film. The inorganic polysilazane is obtained by reacting a dihalosilane compound, a trihalosilane compound, or a mixture thereof with a base to form adducts, and subsequently by reacting ammonia with a solution or a dispersion of the adducts at -50 to -1°C. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种用于形成绝缘膜的涂布液，其中蒸汽中的烘烤步骤的收缩率小，并且难以发生二氧化硅膜的裂纹和与半导体衬底的分离，绝缘膜 使用它们的方法及其制备方法。 解决方案：用于形成绝缘膜的涂布液包括：由SiH 1 基团衍生的具有4.5-5.3ppm的峰面积比和SiH 2 的无机聚硅氮烷， / SB>组合，得到4.3-5.5ppm的峰，由4.2％的SiH 3 SBR 3 H-NMR光谱得到; 和有机溶剂。 通过使用用于形成绝缘膜的涂布液来获得绝缘膜。 无机聚硅氮烷是通过使二卤代硅烷化合物，三卤代硅烷化合物或其混合物与碱反应形成加合物，随后通过使氨与加合物的溶液或分散体在-50至-1℃反应而获得的。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2009280747A

公开(公告)日：2009-12-03

申请号：JP2008136155

申请日：2008-05-26

Applicant: Adeka Corp ,  株式会社Adeka

Inventor： SUEYOSHI TAKASHI ,  SAITO SEIICHI

IPC: C08L83/05 ,  C08K5/56 ,  C08L83/07

Abstract: PROBLEM TO BE SOLVED: To provide a silicon-containing curable composition which scarcely causes discoloration due to light deterioration and thermal deterioration, is rigid, has less dust attachment, and is useful as a sealant for electric or electronic materials, and, inter alia, light emitting devices.
SOLUTION: The silicon-containing curable composition contains: (A) a prepolymer having not less than two Si-H groups in one molecule obtained by hydrosilylating (a-1) a compound having not less than two Si-H groups in the molecule and (a-2) an unsaturated compound having an alicyclic structure, an ether group, and not less than two carbon-carbon double bonds in one molecule reactive with the Si-H groups in the compound (a-1) in a ratio at which not less than two Si-H groups are left in one molecule after the reaction; (B) a cyclic siloxane compound having not less than two carbon-carbon double bonds in one molecule reactive with the Si-H groups; and (C) a hydrosilylating catalyst.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了提供几乎不会由于光劣化和热劣化而引起变色的含硅可固化组合物，是刚性的，具有较少的粉尘附着，并且可用作电气或电子材料的密封剂， 尤其是发光器件。 解决方案：含硅可固化组合物包含：（A）在一个分子中具有不少于两个Si-H基团的预聚物，其通过将（a-1）具有不少于两个Si-H基团的化合物氢化 该分子和（a-2）具有脂环结构，醚基和在一个分子中具有不少于两个碳 - 碳双键的不饱和化合物与化合物（a-1）中的Si-H基反应，在 反应后一分子中不少于两个Si-H基团的比例; （B）一个分子中具有不少于2个碳 - 碳双键的环硅氧烷化合物与Si-H基团反应; 和（C）氢化硅烷化催化剂。 版权所有（C）2010，JPO＆INPIT