公开(公告)号：EP3105636A1

公开(公告)日：2016-12-21

申请号：EP15700059.7

申请日：2015-01-07

Applicant: ASML Netherlands B.V.

Inventor： HUNSCHE, Stefan ,  VELLANKI, Venugopal

IPC: G03F7/20

CPC classification number: G06F17/5009 ,  G03F7/705 ,  G03F7/70525 ,  H01L22/20

Abstract: Disclosed herein is a computer-implemented defect prediction method for a device manufacturing process involving processing a pattern onto a substrate, the method comprising: identifying a processing window limiting pattern (PWLP) from the pattern; determining a processing parameter under which the PWLP is processed; and determining or predicting, using the processing parameter, existence, probability of existence, a characteristic, or a combination thereof, of a defect produced from the PWLP with the device manufacturing process.

公开(公告)号：EP4356201A1

公开(公告)日：2024-04-24

申请号：EP22732013.2

申请日：2022-05-20

Applicant: ASML Netherlands B.V.

Inventor： PU, Lingling ,  LIN, Yuzhang ,  WANG, Teng ,  WANG, Bo ,  LA GRECA, Raphael, Eric ,  HUNSCHE, Stefan

IPC: G03F7/20 ,  G06T7/12

CPC classification number: G03F7/70616 ,  G06T7/12 ,  G06T7/0004 ,  G06T2207/3014820130101 ,  G06T2207/1006120130101