公开(公告)号：US20250102923A1

公开(公告)日：2025-03-27

申请号：US18716117

申请日：2022-11-18

Applicant: ASML Netherlands B.V.

Inventor： Lingling PU ,  Zijian DU

IPC: G03F7/00

Abstract: A method for processing images for metrology using a charged particle beam tool may include obtaining, from the charged particle beam tool, an image of a portion of a sample. The method may further include processing the image using a first image processing module to generate a processed image. The method may further include determining image quality characteristics of the processed image and determining whether the image quality characteristics of the processed image satisfy predetermined imaging criteria. The method may further include in response to the image quality characteristics of the processed image not satisfying the imaging criteria, updating a tuning condition of the charged-particle beam tool, acquiring an image of the portion of the sample using the charged-particle beam tool that has the updated tuning condition, and processing the acquired image using the first image processing module to enable the processed acquired image to satisfy the predetermined imaging criteria.

公开(公告)号：US20250003899A1

公开(公告)日：2025-01-02

申请号：US18708929

申请日：2022-10-14

Applicant: ASML Netherlands B.V.

Inventor： Tim HOUBEN ,  Maxim PISARENCO ,  Thomas Jarik HUISMAN ,  Lingling PU ,  Jian ZHOU ,  Liangjiang YU ,  Yi-Hsin CHANG ,  Yun-Ling YEH

IPC: G01N23/2251 ,  G06T7/00

Abstract: Systems and methods for image analysis include obtaining a plurality of simulation images and a plurality of non-simulation images both associated with a sample under inspection, at least one of the plurality of simulation images being a simulation image of a location on the sample not imaged by any of the plurality of non-simulation images; and training an unsupervised domain adaptation technique using the plurality of simulation images and the plurality of non-simulation images as inputs to reduce a difference between first intensity gradients of the plurality of simulation images and second intensity gradients of the plurality of non-simulation images.

公开(公告)号：US20230117237A1

公开(公告)日：2023-04-20

申请号：US17799576

申请日：2021-01-27

Applicant: ASML Netherlands B.V.

Inventor： Lingling PU ,  Wei FANG

IPC: G06T5/00 ,  G06V10/44 ,  G06V10/26 ,  G06T5/50 ,  G06T7/00

Abstract: An improved apparatus and method for extracting pattern contour information from an inspection image in a multiple charged-particle beam inspection system are disclosed. An improved method for extracting pattern contour information from an inspection image comprises identifying, from an inspection image obtained from a charged-particle beam inspection system, a first pattern and a second pattern that partially overlap in the inspection image. The method also comprises generating a first separation image by removing an image area corresponding to the second pattern from the inspection image. The first separation image includes the first pattern of which a first part is removed when removing the image area corresponding to the second pattern. The method also comprises updating the first separation image to include image data representing the removed first part of the first pattern based on a first reference image corresponding to the first pattern.

公开(公告)号：US20230012946A1

公开(公告)日：2023-01-19

申请号：US17786190

申请日：2020-12-17

Applicant: ASML NETHERLANDS B.V.

Inventor： Wei FANG ,  Zhengwei ZHOU ,  Lingling PU

IPC: H01J37/28 ,  H01J37/24 ,  H01J37/26 ,  H01J37/244

Abstract: A system and method for defect inspection using voltage contrast in a charged particle system are provided. Some embodiments of the system and method include positioning the stage at a first position to enable a first beam of the plurality of beams to scan a first surface area of the wafer at a first time to generate a first image associated with the first surface area; positioning the stage at a second position to enable a second beam of the plurality of beams to scan the first surface area at a second time to generate a second image associated with the first surface area; and comparing the first image with the second image to enable detecting whether a defect is identified in the first surface area of the wafer.

公开(公告)号：US20220319805A1

公开(公告)日：2022-10-06

申请号：US17639322

申请日：2020-08-20

Applicant: ASML Netherlands B.V.

Inventor： Wei FANG ,  Lingling PU

IPC: H01J37/26 ,  H01J37/28

Abstract: Systems and methods for image enhancement are disclosed. A method for enhancing an image may include receiving records of a performance metric for beams of the multi-beam system in an imaging process, each record associated with a beam. The method may also include determining whether an abnormality of a beam occurs based on a baseline value determined using a portion of the records. The method may further include providing an abnormality indication in response to the determination that the abnormality has occurred.

公开(公告)号：US20200074610A1

公开(公告)日：2020-03-05

申请号：US16554110

申请日：2019-08-28

Applicant: ASML Netherlands B.V.

Inventor： Lingling PU ,  Wei FANG ,  Nan ZHAO ,  Wentian ZHOU ,  Teng WANG ,  Ming XU

IPC: G06T7/00 ,  G06T7/60

Abstract: Systems and methods for optimal electron beam metrology guidance are disclosed. According to certain embodiments, the method may include receiving an acquired image of a sample, determining a set of image parameters based on an analysis of the acquired image, determining a set of model parameters based on the set of image parameters, generating a set of simulated images based on the set of model parameters. The method may further comprise performing measurement of critical dimensions on the set of simulated images and comparing critical dimension measurements with the set of model parameters to provide a set of guidance parameters based on comparison of information from the set of simulated images and the set of model parameters. The method may further comprise receiving auxiliary information associated with target parameters including critical dimension uniformity.