Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic device and a manufacturing method of the device. SOLUTION: The lithographic device includes a radiation source designed to provide an illuminating system with the radiation, and is provided with the radiation source designed to provide a radiation in a first wavelength range, and a radiation in a second wavelength range different from the first wavelength range. A support is configured to support a patternizing device designed to impart a pattern onto the cross-section of the radiation. A substrate table is designed to hold the substrate, a projection system is designed to project the patternized radiation on the targeted portions of the substrate. The first wavelength range is a primary wavelength of the lithographic device. The second wavelength range can be used for setting up the lithographic device. The set-up includes one or a plurality out of calibration, approval, performance test and alignment. In addition, the other substrates can be also exposed by using the second wavelength range. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a lithography equipment, comprising measuring means for measuring the displacement of a direction which is orthogonal to the scanning direction in the mask stage or the wafer stage of a scanning-type exposure device. SOLUTION: A beam emitted from a beam source 17, fixed to a frame 15 is divided into two beams by a reflecting slit 26 fixed to a stage. Further, the beams are transmitted through transmission type second slits 18 and 19, third slits 24 and 25, and 1/4 wavelength plates 22 and 23. Then the beams are made into a single beam by the reflecting slit 26. The beam is made to be incident into a sensor. The sensor senses variation in the strength of the interference of the beam and measures the variational amount for the stage. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an interferometric displacement measuring system in which the effects of mirror inclination are removed or improved. SOLUTION: The interferometric displacement measuring system incorporates at least one correction term that is a function of a variable representing beamshear of a measurement beam of the interferometric displacement measuring system. In the interferometric displacement measuring system, a correction for beamshear is made. The correction may be a polynominal of a variable proportional to the length of the optical path traversed by the measurement beam and the angle of the measurement mirror. The correction compensates for errors caused by non-planarity of the wavefront of the measurement beam. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a projecting system which can keep optical elements at correct positions with extremely high accuracy. SOLUTION: In a projecting system using EUV, the position of a mirror is not measured and controlled relative to a reference holder but are measured and controlled relative to each other. A relative position can be measured by an interferometer or a capacitive sensor which is mounted on the fixed/extended portion of the mirror. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To achieve accurate calibration of encoder stage position measurement. SOLUTION: In a calibration method to calibrate an encoder position measurement system of a stage, the encoder position measurement system includes an encoder grid and at least two sensor heads cooperating with the encoder grid, each sensor head providing a sensor head output signal showing position sensitivity in a horizontal and a vertical direction, and the method includes: (a) moving the stage such that the sensor heads are moved with respect to the encoder grid, or vice versa; (b) during the moving, measuring the position of the stage with respect to the encoder grid by the two sensor heads; (c) determining a vertical position data map from the sensor head output signals of the two sensor heads; (d) calculating a horizontal position data map from the vertical position data map; and (e) calibrating the encoder position measurement system by using the calculated horizontal position data map. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a lithographic apparatus which improves the calibration precision of stage position measurement. SOLUTION: A calibration method of a stage system includes moving a stage to an encoder grid in response to a set point signal and measuring the position of the stage by a sensor head cooperating with the encoder grid. The position of the stage is controlled by a stage controller. A signal showing a difference between the position of the state measured by the sensor head and the set point signal is registered. The stage system is calibrated on the basis of the registered signal showing the difference. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a control system for controlling a support structure in a lithographic apparatus. SOLUTION: The control system includes a first measurement system for measuring the position of a substrate supported by the support structure, the position being measured in a first coordinate system. The control system further includes a second measurement system for measuring the position of the support structure in a second coordinate system, the first measurement system having a presumed position in the second coordinate system. The control system further comprises a controller configured to control the position of the support structure based on measurements by the second measurement system, to convert the measured position of the substrate into a converted position of the support structure in the second coordinate system, to position the support structure based on the converted position, to receive a position error signal indicative of a difference between the presumed position and an actual position of the first measurement system in the second coordinate system, and to position the support structure in a manner dependent upon the position error signal. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide lithographic apparatus including a measuring means that measures displacements of a direction which intersects with a scanning direction in a mask stage or wafer stage of a scanning aligner. SOLUTION: A beam irradiated from a beam source 17 fixed to a frame 15 is divided into two beams by a reflective grid 26 fixed to a stage. Further, after each beam penetrates penetration type-second grids 18, 19, third grids 24, 25, and 1/4 wavelength plates 22, 23, the beams are converged at the grid 26 to allow the converged beam to be incident on a sensor. The sensor senses variation in strength with interference of the beam to measure varied amounts of the stage. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an improved precision measuring system hardly causing error, without requiring excessive space. SOLUTION: This system is designed so that a 1st radiant beam input in the measuring system is partitioned into a primary diffraction beam and negative primary diffraction beam by 1st grating, the primary diffraction beam and negative primary diffraction beam are further diffracted by 2nd grating, and then recombined to form a 2nd radiant beam. Additionally, this measuring system determines relative displacement of both the 1st and 2nd gratings based on determination of phase difference between the 1st component of 2nd beam derived from the primary diffraction radiant beam and the 2nd component of 2nd beam derived from the negative primary diffraction radiant beam. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a high-accuracy displacement measuring system of a lithographic apparatus. SOLUTION: A lithographic apparatus comprises: an illumination system IL formed to adjust a radiation beam (B); and a mask supporting structure (MT) formed to support a patterning device (MA) and connected with a first positioning device (PM) that is formed to accurately position the patterning device according to a specific parameter. The lithographic apparatus also comprises a substrate table (e.g. a wafer table) (WT) that is formed to hold a substrate (W) and connected with a second positioning device (PW) formed to accurately position the substrate according to the specific parameter. COPYRIGHT: (C)2008,JPO&INPIT