公开(公告)号：US20200279815A1

公开(公告)日：2020-09-03

申请号：US16289072

申请日：2019-02-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wen Hung HUANG ,  Yan Wen CHUNG ,  Huei-Shyong CHO

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L21/48 ,  H01L21/66 ,  H01L21/683 ,  H01L23/66

Abstract: A wiring structure includes a conductive structure, a surface structure and at least one through via. The conductive structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The surface structure is disposed adjacent to a top surface of the conductive structure. The through via extends through the surface structure and extending into at least a portion of the conductive structure.

公开(公告)号：US20200153081A1

公开(公告)日：2020-05-14

申请号：US16730411

申请日：2019-12-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01Q1/22 ,  H01L23/367 ,  H01L23/498 ,  H01Q1/02 ,  H01Q1/24 ,  H01Q21/06 ,  H01L23/66

Abstract: A semiconductor package device includes a substrate having an upper surface; an antenna disposed on the upper surface of the substrate; a conductor disposed on the upper surface of the substrate and surrounding the antenna; and a package body covering the conductor and the upper surface of the substrate.

公开(公告)号：US20180342471A1

公开(公告)日：2018-11-29

申请号：US15604545

申请日：2017-05-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-En HSU ,  Huei-Shyong CHO ,  Shih-Wen LU

IPC: H01L23/66 ,  H01L23/31 ,  H01P3/08 ,  H01L23/498 ,  H01Q1/22 ,  H01Q13/08

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/49838 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01P3/08 ,  H01Q1/2283 ,  H01Q13/08

Abstract: An antenna semiconductor package device includes a first conductive layer, a second conductive layer, a first conductive element and a first directing element. The second conductive layer is over the first conductive layer and separated from the first conductive layer. The first conductive element connects the first conductive layer to the second conductive layer. The first directing element is adjacent to the first conductive layer and separated from the first conductive layer by a first gap. The first conductive element, the first conductive layer and the second conductive layer define a waveguide cavity and a radiation opening.