Reduced trace metals contamination ion source for an ion implantation system
    22.
    发明授权
    Reduced trace metals contamination ion source for an ion implantation system 有权
    减少痕量金属污染离子源的离子注入系统

    公开(公告)号:US09543110B2

    公开(公告)日:2017-01-10

    申请号:US14135754

    申请日:2013-12-20

    Abstract: An ion source chamber for ion implantation system includes a housing that at least partially bounds an ionization region through which high energy electrons move from a cathode to ionize gas molecules injected into an interior of the housing; a liner section defining one or more interior walls of the housing interior, wherein each liner section includes a interiorly facing surface exposed to the ionization region during operation the ion implantation system; a cathode shield disposed about the cathode; a repeller spaced apart from the cathode; a plate including a source aperture for discharging ions from the ion source chamber; wherein at least one of the repeller, the liner section, the cathode shield; the plate, or an insert in the plate defining the source aperture comprise silicon carbide, wherein the silicon carbide is a non-stoichiometric sintered material having excess carbon.

    Abstract translation: 用于离子注入系统的离子源室包括壳体,该壳体至少部分地界定电离区域,高能电子通过该电离区域从阴极移动到电离注入壳体内部的气体分子; 限定所述壳体内部的一个或多个内壁的衬里部分,其中每个衬里部分包括在所述离子注入系统的操作期间暴露于所述电离区域的面向内的表面; 围绕阴极设置的阴极屏蔽; 与阴极间隔开的推斥器; 包括用于从离子源室排出离子的源孔的板; 其中所述推斥板,所述衬套部分,所述阴极罩中的至少一个; 该板或限定源孔的板中的插入物包括碳化硅,其中碳化硅是具有过量碳的非化学计量烧结材料。

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