公开(公告)号：US20190218142A1

公开(公告)日：2019-07-18

申请号：US16179377

申请日：2018-11-02

Applicant: CORNING INCORPORATED

Inventor： Stephan Lvovich Logunov ,  Yousef Kayed Qaroush ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov ,  Leo Young Zheng

IPC: C03C23/00 ,  C03C3/14 ,  C03C3/247 ,  C03C17/02 ,  C03C17/06 ,  C03C17/23 ,  C03C27/04 ,  C03C15/00 ,  C03C27/10 ,  C03C27/06 ,  C03C3/16 ,  C01G19/02 ,  C03C3/23 ,  H01L51/52

CPC classification number: C03C23/0025 ,  C01G19/02 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C15/00 ,  C03C17/02 ,  C03C17/06 ,  C03C17/23 ,  C03C27/044 ,  C03C27/06 ,  C03C27/10 ,  H01L51/5246

Abstract: An apparatus including a first substrate, a second substrate, an inorganic film provided between the first substrate and the second substrate and in contact with both the first substrate and the second substrate, a laser welded zone formed between the first and second substrate by the inorganic film, where the laser welded zone has a heat affected zone (HAZ), where the HAZ is defined as a region in which σHAZ is at least 1 MPa higher than average stress in the first substrate and the second substrate, wherein σHAZ is compressive stress in the HAZ, and wherein the laser welded zone is characterized by its σinterface laser weld>σHAZ, wherein σinterface laser weld is peak value of compressive stress in the laser welded zone.

公开(公告)号：US20190047902A1

公开(公告)日：2019-02-14

申请号：US16085779

申请日：2017-03-16

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Nadja Teresia Lonnroth ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov ,  Mark Owen Weller

IPC: C03C4/08 ,  H01L51/52 ,  C03C27/06 ,  B29C65/16 ,  G02F1/161 ,  H01L33/56 ,  H01S5/022

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one bond between the first and second substrates. The inorganic film can comprise about 10-80 mol % B2O3, about 5-60 mol % Bi2O3, and about 0-70 mol % ZnO. Methods for sealing devices using such an inorganic film are also disclosed herein, as well as display and electronic components comprising such sealed devices.

公开(公告)号：US20180138446A1

公开(公告)日：2018-05-17

申请号：US15699337

申请日：2017-09-08

Applicant: CORNING INCORPORATED

Inventor： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: H01L51/52 ,  B23K26/20 ,  C03C3/247 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C4/00 ,  C03C8/24 ,  C03B23/203 ,  C03C27/08 ,  C03C27/06 ,  C03C23/00 ,  C03C3/12 ,  H01L51/00 ,  B32B37/06

CPC classification number: H01L51/5246 ,  B23K26/206 ,  B32B7/04 ,  B32B17/06 ,  B32B37/06 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/20 ,  B32B2310/0825 ,  B32B2310/0831 ,  B32B2310/0843 ,  B32B2457/206 ,  C03B23/203 ,  C03C3/12 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/0071 ,  C03C8/24 ,  C03C23/0025 ,  C03C27/06 ,  C03C27/08 ,  C03C2204/00 ,  C03C2207/00 ,  C03C2218/32 ,  H01L51/0024 ,  H01L2251/301

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

公开(公告)号：US20170327419A1

公开(公告)日：2017-11-16

申请号：US15522198

申请日：2015-10-29

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Leonard Charles Dabich, II ,  David Alan Deneka ,  Jin Su Kim ,  Shari Elizabeth Koval ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: C03C23/00 ,  C03C3/14 ,  C03C3/16 ,  C03C27/10 ,  C01G19/02 ,  C03C3/247 ,  C03C3/23 ,  C03C15/00 ,  C03C27/04 ,  H01L51/52 ,  C03C17/06 ,  C03C17/23

CPC classification number: C03C23/0025 ,  C01G19/02 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C15/00 ,  C03C17/02 ,  C03C17/06 ,  C03C17/23 ,  C03C27/044 ,  C03C27/06 ,  C03C27/10 ,  H01L51/5246

Abstract: A method of forming a sealed device comprising providing a first substrate having a first surface, providing a second substrate adjacent the first substrate, and forming a weld between an interface of the first substrate and the adjacent second substrate, wherein the weld is characterized by ((σtensile stress location)/(σinterface laser weld)) 10 MPa or >1 MPa where σtensile stress location is the stress present in the first substrate and σinterface laser weld is the stress present at the interface. This method may be used to manufacture a variety of different sealed packages.

公开(公告)号：US09741963B2

公开(公告)日：2017-08-22

申请号：US15066704

申请日：2016-03-10

Applicant: Corning Incorporated

Inventor： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: H01L21/00 ,  H01L51/52 ,  C03C3/12 ,  C03C23/00 ,  C03C27/06 ,  C03C27/08 ,  C03B23/203 ,  B23K26/20 ,  B32B37/06 ,  H01L51/00 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/00 ,  C03C8/24

CPC classification number: H01L51/5246 ,  B23K26/206 ,  B32B7/04 ,  B32B17/06 ,  B32B37/06 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/20 ,  B32B2310/0825 ,  B32B2310/0831 ,  B32B2310/0843 ,  B32B2457/206 ,  C03B23/203 ,  C03C3/12 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/0071 ,  C03C8/24 ,  C03C23/0025 ,  C03C27/06 ,  C03C27/08 ,  C03C2204/00 ,  C03C2207/00 ,  C03C2218/32 ,  H01L51/0024 ,  H01L2251/301

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

公开(公告)号：US09714194B2

公开(公告)日：2017-07-25

申请号：US15141647

申请日：2016-04-28

Applicant: CORNING INCORPORATED

Inventor： Leonard Thomas Masters ,  Alexander Mikhailovich Streltsov

IPC: C03C23/00 ,  B23K26/03 ,  B23K26/00 ,  B23K26/354 ,  B32B3/30 ,  B32B17/06 ,  C03B23/02 ,  E06B3/66 ,  E06B3/663 ,  B23K26/352 ,  B23K103/00

CPC classification number: C03C23/0025 ,  B23K26/0006 ,  B23K26/032 ,  B23K26/352 ,  B23K26/354 ,  B23K26/355 ,  B23K2103/54 ,  B32B3/30 ,  B32B17/06 ,  B32B2307/304 ,  B32B2307/412 ,  B32B2419/00 ,  C03B23/02 ,  C03C23/002 ,  E06B3/6612 ,  E06B3/663

Abstract: A method for controlling formation of glass bumps in a glass article with laser-irradiation without the use of a growth-limiting structure. Standard deviation of height between the glass bumps on the article is less than 1 micron by controlling the laser radiation dose provided on the glass article.

公开(公告)号：US09359252B1

公开(公告)日：2016-06-07

申请号：US14808579

申请日：2015-07-24

Applicant: CORNING INCORPORATED

Inventor： Leonard Thomas Masters ,  Alexander Mikhailovich Streltsov

IPC: G03B23/02 ,  C03C23/00

CPC classification number: C03C23/0025 ,  B23K26/0006 ,  B23K26/032 ,  B23K26/352 ,  B23K26/354 ,  B23K26/355 ,  B23K2103/54 ,  B32B3/30 ,  B32B17/06 ,  B32B2307/304 ,  B32B2307/412 ,  B32B2419/00 ,  C03B23/02 ,  C03C23/002 ,  E06B3/6612 ,  E06B3/663

Abstract: A method for controlling formation of glass bumps in a glass article with laser-irradiation without the use of a growth-limiting structure. Standard deviation of height between the glass bumps on the article is less than 1 micron by controlling the laser radiation dose provided on the glass article.

Abstract translation: 一种用于在不使用生长限制结构的情况下用激光照射来控制玻璃制品中的玻璃凸块的形成的方法。 通过控制玻璃制品上提供的激光辐射剂量，制品上的玻璃凸块之间的高度的标准偏差小于1微米。

公开(公告)号：US20150027168A1

公开(公告)日：2015-01-29

申请号：US14271797

申请日：2014-05-07

Applicant: CORNING INCORPORATED

Inventor： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: H01L51/00 ,  B23K26/20 ,  B32B37/06

CPC classification number: H01L51/5246 ,  B23K26/206 ,  B32B7/04 ,  B32B17/06 ,  B32B37/06 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2255/20 ,  B32B2310/0825 ,  B32B2310/0831 ,  B32B2310/0843 ,  B32B2457/206 ,  C03B23/203 ,  C03C3/12 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/0071 ,  C03C8/24 ,  C03C23/0025 ,  C03C27/06 ,  C03C27/08 ,  C03C2204/00 ,  C03C2207/00 ,  C03C2218/32 ,  H01L51/0024 ,  H01L2251/301

Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.

Abstract translation: 一种密封工件的方法，包括在第一基板的表面上形成无机膜，将待保护的工件布置在第一基板和第二基板之间，其中无机膜与第二基板接触; 并且通过以预定的激光辐射波长局部加热无机膜，作为第一或第二基板中的杂质组成的函数，并且作为无机膜的组成的函数，将工件密封在第一和第二基板之间。 无机膜，第一衬底或第二衬底可以在大约420nm至大约750nm处是透射的。

公开(公告)号：US20140202209A1

公开(公告)日：2014-07-24

申请号：US14221851

申请日：2014-03-21

Applicant: CORNING INCORPORATED

Inventor： Richard Robert Grzybowski ,  Daniel Ralph Harvey ,  Stephan Lvovich Logunov ,  Daniel Louis Gabriel Ricoult ,  Alexander Mikhailovich Streltsov

IPC: E06B3/663 ,  C03B23/00 ,  E06B3/66

CPC classification number: E06B3/66304 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/53 ,  B23K26/57 ,  C03B23/0086 ,  C03B23/02 ,  C03B2215/414 ,  C03C23/0025 ,  E06B3/6612 ,  Y02A30/25 ,  Y02B80/24 ,  Y10T428/24182

Abstract: Vacuum-insulated glass (VIG) windows (10) that employ glass-bump spacers (50) and two or more glass panes (20) are disclosed. The glass-bump spacers are formed in the surface (24) of one of the glass panes (20) and consist of the glass material from the body portion (23) of the glass pane. Thus, the glass-bump spacers are integrally formed in the glass pane, as opposed to being discrete spacer elements that need to be added and fixed to the glass pane. Methods of forming VIG windows are also disclosed. The methods include forming the glass-bump spacers by irradiating a glass pane with a focused beam (112F) from a laser (110). Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. The process is repeated at different locations in the glass pane to form an array of glass-bump spacers. A second glass pane is brought into contact with the glass-bump spacers, and the edges (28F, 28B) sealed. The resulting sealed interior region (40) is then evacuated to a vacuum pressure of less than one atmosphere.

Abstract translation: 公开了采用玻璃凸块间隔件（50）和两个或更多个玻璃板（20）的真空绝热玻璃（VIG）窗（10）。 玻璃凸块间隔件形成在一个玻璃板（20）的表面（24）中并由来自玻璃板的主体部分（23）的玻璃材料组成。 因此，玻璃凸块间隔件一体地形成在玻璃板中，而不是需要添加并固定到玻璃板上的离散间隔元件。 还公开了形成VIG窗的方法。 所述方法包括通过用来自激光器（110）的聚焦光束（112F）照射玻璃板来形成玻璃凸块间隔物。 玻璃中的加热效应导致玻璃局部膨胀，从而形成玻璃凸块间隔物。 在玻璃板中的不同位置处重复该过程以形成玻璃凸起间隔物的阵列。 第二玻璃板与玻璃凸块间隔件接触，边缘（28F，28B）被密封。 然后将得到的密封内部区域（40）抽真空至小于一个大气压的真空压力。

公开(公告)号：US20230329033A1

公开(公告)日：2023-10-12

申请号：US18204789

申请日：2023-06-01

Applicant: CORNING INCORPORATED

Inventor： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: H10K50/842 ,  C03C3/12 ,  C03C23/00 ,  C03C27/06 ,  C03C27/08 ,  H10K71/50 ,  C03B23/203 ,  B23K26/20 ,  B32B37/06 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/00 ,  C03C8/24

CPC classification number: H10K50/8426 ,  H10K2102/00 ,  C03C23/0025 ,  C03C27/06 ,  C03C27/08 ,  H10K71/50 ,  C03B23/203 ,  B23K26/206 ,  B32B37/06 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C3/247 ,  C03C4/0071 ,  C03C8/24 ,  C03C2218/32 ,  C03C3/12

Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.