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公开(公告)号：US10898933B2
公开(公告)日：2021-01-26
申请号：US13905367
申请日：2013-05-30
Applicant: Corning Incorporated
Inventor： Adra Smith Baca , David Eugene Baker , Prantik Mazumder , Mark Alejandro Quesada , Wageesha Senaratne
Abstract: Described herein are glass substrates having oleophobic surfaces that are substantially free of features that form a reentrant geometry. The surfaces can include a plurality of gas-trapping features, extending from the surface to a depth below the surface, that are substantially isolated from each other. The gas-trapping features are capable of trapping gas below any droplets that are contacted with the surface so as to prevent wetting of the surface by the droplets.
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22.发明申请公开(公告)号：US20180138445A1
公开(公告)日：2018-05-17
申请号：US15655194
申请日：2017-07-20
Applicant: CORNING INCORPORATED
Inventor： Leonard Charles Dabich, II , Stephan Lvovich Logunov , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov
IPC: H01L51/52 , B23K26/20 , C03C3/247 , B32B7/04 , B32B17/06 , C03C3/14 , C03C3/16 , C03C3/23 , C03C4/00 , C03C8/24 , C03B23/203 , C03C27/08 , C03C27/06 , C03C23/00 , C03C3/12 , H01L51/00 , B32B37/06
CPC classification number: H01L51/5246 , B23K26/206 , B32B7/04 , B32B17/06 , B32B37/06 , B32B2250/03 , B32B2250/40 , B32B2255/20 , B32B2310/0825 , B32B2310/0831 , B32B2310/0843 , B32B2457/206 , C03B23/203 , C03C3/12 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C4/0071 , C03C8/24 , C03C23/0025 , C03C27/06 , C03C27/08 , C03C2204/00 , C03C2207/00 , C03C2218/32 , H01L51/0024 , H01L2251/301
Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.
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公开(公告)号：US09933587B2
公开(公告)日：2018-04-03
申请号：US14920169
申请日：2015-10-22
Applicant: CORNING INCORPORATED
Inventor： Robert Adam Modavis , Daniel Aloysius Nolan , Mark Alejandro Quesada , Wageesha Senaratne , Dean Michael Thelen
CPC classification number: G02B6/4298 , G02B6/12004 , H01L51/5262 , H01L51/5268
Abstract: An organic light emitting diode (OLED) device having enhanced light extraction is disclosed. The OLED device includes an upper waveguide structure having an organic layer and supports first guided modes, and a lower waveguide structure with a light-extraction waveguide that supports second guided modes substantially matched to the first guided modes. The lower waveguide structure includes a light-extraction waveguide interfaced with a light-extraction matrix. The light-extraction waveguide includes one or more light-redirecting features. The upper and lower waveguide structures are configured to facilitate mode coupling from the first guided modes to the second guide modes while substantially avoiding coupling the first guided modes to surface plasmon polaritons. The light traveling in the second guided modes is redirected to exit the OLED device by light-redirecting features of the light-extraction waveguide.
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公开(公告)号：US20170233289A1
公开(公告)日：2017-08-17
申请号：US15584559
申请日：2017-05-02
Applicant: CORNING INCORPORATED
Inventor： Stephan Lvovich Logunov , Mark Alejandro Quesada
CPC classification number: C03C27/06 , B29C65/1635 , B29C65/1638 , C03C3/247 , C03C4/085 , C03C8/24 , C08K2003/023 , H01L21/02348 , H01L31/048 , H01L33/483 , H01L51/5246 , H01S5/0216
Abstract: Transparent glass-to-glass hermetic seals are formed by providing a low melting temperature sealing glass along a sealing interface between two glass substrates and irradiating the interface with laser radiation. Absorption by the sealing glass and induced transient absorption by the glass substrates along the sealing interface causes localized heating and melting of both the sealing glass layer and the substrate materials, which results in the formation of a glass-to-glass weld. Due to the transient absorption by the substrate material, the sealed region is transparent upon cooling.
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公开(公告)号：US20170218503A1
公开(公告)日：2017-08-03
申请号：US15432453
申请日：2017-02-14
Applicant: Corning Incorporated
Inventor： Robert Alan Bellman , Ta-Ko Chuang , Robert George Manley , Mark Alejandro Quesada , Paul Arthur Sachenik
CPC classification number: C23C14/34 , C23C14/10 , C23C14/35 , C23C14/541
Abstract: A method of forming a hermetic barrier layer comprises sputtering a thin film from a sputtering target, wherein the sputtering target includes a sputtering material such as a low Tg glass, a precursor of a low Tg glass, or an oxide of copper or tin. During the sputtering, the formation of defects in the barrier layer are constrained to within a narrow range and the sputtering material is maintained at a temperature of less than 200° C.
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Patent Agency Ranking
公开(公告)号：US09666763B2
公开(公告)日：2017-05-30
申请号：US13841391
申请日：2013-03-15
Applicant: CORNING INCORPORATED
Inventor： Stephan Lvovich Logunov , Mark Alejandro Quesada
IPC: H01L21/00 , H01L51/52 , H01L33/48 , C03C3/247 , C03C4/08 , C03C8/24 , C03C27/06 , B29C65/16 , H01L31/048
CPC classification number: C03C27/06 , B29C65/1635 , B29C65/1638 , C03C3/247 , C03C4/085 , C03C8/24 , C08K2003/023 , H01L21/02348 , H01L31/048 , H01L33/483 , H01L51/5246 , H01S5/0216
Abstract: Transparent glass-to-glass hermetic seals are formed by providing a low melting temperature sealing glass along a sealing interface between two glass substrates and irradiating the interface with laser radiation. Absorption by the sealing glass and induced transient absorption by the glass substrates along the sealing interface causes localized heating and melting of both the sealing glass layer and the substrate materials, which results in the formation of a glass-to-glass weld. Due to the transient absorption by the substrate material, the sealed region is transparent upon cooling.
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27.发明授权Laser welding transparent glass sheets using low melting glass or thin absorbing films 有权使用低熔点玻璃或薄吸收膜的激光焊接透明玻璃板公开(公告)号：US09515286B2
公开(公告)日：2016-12-06
申请号：US14271797
申请日：2014-05-07
Applicant: CORNING INCORPORATED
Inventor： Leonard Charles Dabich, II , Stephan Lvovich Logunov , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov
IPC: H01L21/00 , H01L51/52 , C03C3/12 , C03C23/00 , C03C27/06 , C03C27/08 , C03B23/203 , B23K26/20 , B32B37/06 , H01L51/00 , B32B7/04 , B32B17/06 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C4/00 , C03C8/24
CPC classification number: H01L51/5246 , B23K26/206 , B32B7/04 , B32B17/06 , B32B37/06 , B32B2250/03 , B32B2250/40 , B32B2255/20 , B32B2310/0825 , B32B2310/0831 , B32B2310/0843 , B32B2457/206 , C03B23/203 , C03C3/12 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C4/0071 , C03C8/24 , C03C23/0025 , C03C27/06 , C03C27/08 , C03C2204/00 , C03C2207/00 , C03C2218/32 , H01L51/0024 , H01L2251/301
Abstract: A method of sealing a workpiece comprising forming an inorganic film over a surface of a first substrate, arranging a workpiece to be protected between the first substrate and a second substrate wherein the inorganic film is in contact with the second substrate; and sealing the workpiece between the first and second substrates as a function of the composition of impurities in the first or second substrates and as a function of the composition of the inorganic film by locally heating the inorganic film with a predetermined laser radiation wavelength. The inorganic film, the first substrate, or the second substrate can be transmissive at approximately 420 nm to approximately 750 nm.
Abstract translation: 一种密封工件的方法，包括在第一基板的表面上形成无机膜，将待保护的工件布置在第一基板和第二基板之间，其中无机膜与第二基板接触; 并且通过以预定的激光辐射波长局部加热无机膜，作为第一或第二基板中的杂质组成的函数，并且作为无机膜的组成的函数，将工件密封在第一和第二基板之间。 无机膜，第一衬底或第二衬底可以在大约420nm至大约750nm处是透射的。
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公开(公告)号：US20160268541A1
公开(公告)日：2016-09-15
申请号：US15066704
申请日：2016-03-10
Applicant: Corning Incorporated
Inventor： Leonard Charles Dabich, II , Stephan Lvovich Logunov , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov
IPC: H01L51/52 , B32B17/06 , C03C8/24 , C03C4/00 , C03C3/247 , C03C3/16 , C03C3/14 , B32B7/04 , C03C3/23
CPC classification number: H01L51/5246 , B23K26/206 , B32B7/04 , B32B17/06 , B32B37/06 , B32B2250/03 , B32B2250/40 , B32B2255/20 , B32B2310/0825 , B32B2310/0831 , B32B2310/0843 , B32B2457/206 , C03B23/203 , C03C3/12 , C03C3/14 , C03C3/16 , C03C3/23 , C03C3/247 , C03C4/0071 , C03C8/24 , C03C23/0025 , C03C27/06 , C03C27/08 , C03C2204/00 , C03C2207/00 , C03C2218/32 , H01L51/0024 , H01L2251/301
Abstract: Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.
Abstract translation: 本文公开了包括第一基板，第二基板，第一和第二基板之间的无机膜以及包括第一和第二基板之间的接合的至少一个焊接区域的密封装置。 焊接区域可以包括与无机膜和第一或第二基板不同的化学组成。 密封装置还可以包括包围至少焊接区域的应力区域，其中装置的一部分处于比装置的剩余部分更大的应力下。 这里还公开了包括这种密封装置的显示器和电子部件。
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公开(公告)号：US08946754B2
公开(公告)日：2015-02-03
申请号：US14305314
申请日：2014-06-16
Applicant: Corning Incorporated
Inventor： Jacques Gollier , Glenn Eric Kohnke , Mark Alejandro Quesada , James Andrew West
IPC: H01L21/00
CPC classification number: H01L51/5253 , H01L51/5268
Abstract: A protected organic light emitting diode includes an organic light emitting diode structure formed on a substrate, a hermetic barrier layer formed over at least part of the organic light emitting diode structure, and a light extraction layer. The barrier layer may include a glass material such as a tin fluorophosphate glass, a tungsten-doped tin fluorophosphate glass, a chalcogenide glass, a tellurite glass, a borate glass or a phosphate glass. The light extraction layer, which may be formed over the barrier layer, includes a high refractive index matrix material and at least one of scattering particles dispersed throughout the matrix material and a roughened surface.
Abstract translation: 受保护的有机发光二极管包括形成在衬底上的有机发光二极管结构，在至少部分有机发光二极管结构上形成的气密阻挡层和光提取层。 阻挡层可以包括玻璃材料，例如氟磷酸锡玻璃，掺杂钨的锡氟磷酸盐玻璃，硫族化物玻璃，碲酸盐玻璃，硼酸盐玻璃或磷酸盐玻璃。 可以形成在阻挡层上的光提取层包括高折射率基体材料和分散在整个基体材料中的散射粒子和粗糙化表面中的至少一种。
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30.发明申请METHOD FOR INHIBITING OXYGEN AND MOISTURE DEGRADATION OF A DEVICE AND THE RESULTING DEVICE 审中-公开用于抑制装置和结果装置的氧气和水分降解的方法公开(公告)号：US20140234542A1
公开(公告)日：2014-08-21
申请号：US14223380
申请日：2014-03-24
Applicant: CORNING INCORPORATED
Inventor： Bruce Gardiner Aitken , Mark Alan Lewis , Mark Alejandro Quesada
IPC: B05D5/00
CPC classification number: B05D5/00 , C03C3/122 , C03C3/14 , C03C3/247 , H01L51/5253
Abstract: A method for inhibiting oxygen and moisture degradation of a device and the resulting device are described herein. To inhibit the oxygen and moisture degradation of the device, a low liquidus temperature (LLT) material which typically has a low low liquidus temperature (or in specific embodiments a low glass transition temperature) is used to form a barrier layer on the device. The LLT material can be, for example, tin fluorophosphate glass, chalcogenide glass, tellurite glass and borate glass. The LLT material can be deposited onto the device by, for example, sputtering, evaporation, laser-ablation, spraying, pouring, frit-deposition, vapor-deposition, dip-coating, painting or rolling, spin-coating or any combination thereof. Defects in the LLT material from the deposition step can be removed by a consolidation step (heat treatment), to produce a pore-free, gas and moisture impenetrable protective coating on the device. Although many of the deposition methods are possible with common glasses (i.e. high melting temperature glasses like borate silicate, silica, etc.), the consolidation step is only practical with the LLT material where the consolidation temperature is sufficiently low so as to not damage the inner layers in the device.
Abstract translation: 本文描述了一种用于抑制装置和所得装置的氧气和水分降解的方法。 为了抑制器件的氧气和水分降解，通常使用通常具有低液相线温度（或在特定实施方案中为低玻璃化转变温度）的低液相线温度（LLT）材料以在器件上形成阻挡层。 LLT材料可以是例如氟磷酸铁玻璃，硫族化物玻璃，碲化物玻璃和硼酸盐玻璃。 通过例如溅射，蒸发，激光烧蚀，喷涂，浇注，玻璃料沉积，气相沉积，浸涂，喷涂或轧制，旋涂或其任何组合，可将LLT材料沉积到器件上。 来自沉积步骤的LLT材料的缺陷可以通过固结步骤（热处理）去除，以在器件上产生无孔隙的气体和湿气不透明的保护涂层。 虽然许多沉积方法可能用普通玻璃（即，高熔点玻璃像硼酸硅酸盐，二氧化硅等），但固结步骤仅适用于LLT材料，其中固结温度足够低以免损坏 设备内层。
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