公开(公告)号：US07714724B2

公开(公告)日：2010-05-11

申请号：US11790903

申请日：2007-04-27

Applicant: Christophe Halope ,  Anne Le Paih

Inventor： Christophe Halope ,  Anne Le Paih

IPC: G08B13/14 ,  H01L21/00 ,  H01L21/31 ,  H01L21/469

CPC classification number: G06K19/07749 ,  G06K19/02 ,  G06K19/025 ,  G06K19/0775

Abstract: A radio frequency identification device support (2) featuring an antenna (12) screen-printed on a support (20) and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to a main characteristic of the invention, a thermoplastic layer (22) and a top layer of synthetic paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and the three layers (20, 22, and 24) cannot be separated and so that the device is resistant to water and humid environments.

Abstract translation: 射频识别装置（2），其特征在于屏幕印刷在支撑体（20）上的天线（12）和连接到天线的连接端子（17和19）的芯片（10）。 根据本发明的主要特征，在天线支撑件（20）上层叠热塑性层（22）和合成纸（24）的顶层，使得天线和芯片被捕获在热塑性塑料中，并且三层 （20,22和24）不能分离，使得该装置耐水和潮湿的环境。

公开(公告)号：US20070279232A1

公开(公告)日：2007-12-06

申请号：US11790902

申请日：2007-04-27

Applicant: Christophe Halope ,  Anne Paih

Inventor： Christophe Halope ,  Anne Paih

IPC: G08B13/14

CPC classification number: G06K19/07749

Abstract: The invention concerns a radio frequency identification device support (2) featuring an antenna (12) screen-printed on a support (20) and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to a main characteristic of the invention, a thermoplastic layer (22) and a top layer of synthetic paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and the three layers (20, 22, and 24) cannot be separated and so that the device is resistant to water and humid environments.

Abstract translation: 本发明涉及一种射频识别装置支架（2），其特征在于屏幕印刷在支架（20）上的天线（12）和连接到天线的连接端子（17和19）的芯片（10）。 根据本发明的主要特征，在天线支撑件（20）上层叠热塑性层（22）和合成纸（24）的顶层，使得天线和芯片被捕获在热塑性塑料中，并且三层 （20,22和24）不能分离，使得该装置耐水和潮湿的环境。

公开(公告)号：US20070252705A1

公开(公告)日：2007-11-01

申请号：US11790903

申请日：2007-04-27

Applicant: Christophe Halope ,  Anne Le Paih

Inventor： Christophe Halope ,  Anne Le Paih

IPC: G08B13/14 ,  H01L23/02

CPC classification number: G06K19/07749 ,  G06K19/02 ,  G06K19/025 ,  G06K19/0775

Abstract: A radio frequency identification device support (2) featuring an antenna (12) screen-printed on a support (20) and a chip (10) connected to the connection terminals (17 and 19) of the antenna. According to a main characteristic of the invention, a thermoplastic layer (22) and a top layer of synthetic paper (24) are laminated on the antenna support (20) so that the antenna and the chip are trapped in the thermoplastic and the three layers (20, 22, and 24) cannot be separated and so that the device is resistant to water and humid environments.

Abstract translation: 射频识别装置（2），其特征在于屏幕印刷在支撑体（20）上的天线（12）和连接到天线的连接端子（17和19）的芯片（10）。 根据本发明的主要特征，在天线支撑件（20）上层叠热塑性层（22）和合成纸（24）的顶层，使得天线和芯片被捕获在热塑性塑料中，并且三层 （20,22和24）不能分离，使得该装置耐水和潮湿的环境。

公开(公告)号：US20070029391A1

公开(公告)日：2007-02-08

申请号：US10556486

申请日：2004-05-26

Applicant: Christophe Halope

Inventor： Christophe Halope

IPC: G06K19/06

CPC classification number: G06K19/07718 ,  G06K19/07749 ,  G06K19/07779 ,  G06K19/07783 ,  H05K1/0393 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/28 ,  H05K2203/1545

Abstract: A multi-step method for producing contactless tickets or cards, the tickets or cards including a chip (24) which is connected to an antenna (10) on a paper carrier. The method includes: printing the antennae in series on the paper carrier strip using a silkscreen ink; fixing a chip to each ticket by connecting bond pads of the chip to the antennas' bond pads (14, 16); and covering the paper strip, including the silkscreen-printed antenna and the corresponding chip, with an adhesive paper strip. After each step, the paper carrier strip is wound up before the next step is begun. Each of the silkscreen-printed antennae is coated with a protective layer (12) to prevent silkscreen ink from being transferred to the back of the paper carrier strip during the successive winding-up following each step.

Abstract translation: 用于生产非接触式票据或卡片的多步骤方法，票据或卡片包括连接到纸张载体上的天线（10）的芯片（24）。 该方法包括：使用丝网印刷将天线串联印刷在纸载带上; 通过将芯片的接合焊盘连接到天线的接合焊盘（14,16）来将芯片固定到每个票据上; 并用粘合纸条覆盖包括丝网印刷天线和相应的芯片的纸条。 在每一步之后，在下一步骤开始之前，将纸载带剥去。 丝网印刷天线中的每一个涂覆有保护层（12），以防止丝网印刷油墨在每个步骤之后的连续卷绕期间被转移到纸载带的背面。

公开(公告)号：US07116231B2

公开(公告)日：2006-10-03

申请号：US10498914

申请日：2003-09-12

Applicant: Georges Kayanakis ,  Pierre Benato ,  Christophe Halope

Inventor： Georges Kayanakis ,  Pierre Benato ,  Christophe Halope

IPC: G08B13/14

CPC classification number: B32B37/02 ,  B32B37/04 ,  B32B37/203 ,  B32B2305/342 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2425/00 ,  B32B2519/02 ,  G06K19/07749 ,  Y10T29/49002

Abstract: Method of manufacturing a chip card having an antenna support, two card bodies and an electronic module or a chip linked to the antenna. This method has a first lamination step which includes fusing two thermoplastic sheets (32, 34 or 62, 64) on each side of antenna support (10 or 40) at a temperature sufficient for the thermoplastic sheet material to soften and to flow wholly so as to eliminate any differences in thickness from the support, and a second lamination step carried out after a period of time necessary for the thermoplastic sheets (32, 34 or 62, 64) to be solidified, the second step including fusing by hot pressing two plastic layers (36, 38 or 66, 68) making up the card bodies onto the plasticised and even faces of uniformly thick antenna support (30 or 60) plasticised by the thermoplastic sheets.

Abstract translation: 制造具有天线支架，两个卡体以及与天线连接的电子模块或芯片的芯片卡的制造方法。 该方法具有第一层压步骤，其包括在足以使热塑性片材软化并完全流动的温度下将天线支撑件（10或40）的每一侧上的两个热塑性片材（32,34或62,64） 以消除与支撑体的厚度的任何差异，以及在热塑性片材（32,34或62,64）固化所需的时间段之后进行的第二层压步骤，第二步骤包括通过热压两个塑料 层（36,38或66,68）将卡体组合到由热塑性片材塑化的均匀厚的天线支撑（30或60）的塑性均匀面上。

公开(公告)号：US20050066513A1

公开(公告)日：2005-03-31

申请号：US10498914

申请日：2003-09-12

Applicant: Georges Kayanakis ,  Pierre Benato ,  Christophe Halope

Inventor： Georges Kayanakis ,  Pierre Benato ,  Christophe Halope

IPC: B42D15/10 ,  B32B37/00 ,  B32B37/02 ,  B32B37/20 ,  G06K19/07 ,  G06K19/077 ,  H01S4/00

CPC classification number: B32B37/02 ,  B32B37/04 ,  B32B37/203 ,  B32B2305/342 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2425/00 ,  B32B2519/02 ,  G06K19/07749 ,  Y10T29/49002

Abstract: Method of manufacturing a chip card having an antenna support, two card bodies and an electronic module or a chip linked to the antenna. This method has a first lamination step which includes fusing two thermoplastic sheets (32, 34 or 62, 64) on each side of antenna support (10 or 40) at a temperature sufficient for the thermoplastic sheet material to soften and to flow wholly so as to eliminate any differences in thickness from the support, and a second lamination step carried out after a period of time necessary for the thermoplastic sheets (32, 34 or 62, 64) to be solidified, the second step including fusing by hot pressing two plastic layers (36, 38 or 66, 68) making up the card bodies onto the plasticised and even faces of uniformly thick antenna support (30 or 60) plasticised by the thermoplastic sheets.

Abstract translation: 制造具有天线支架，两个卡体以及与天线连接的电子模块或芯片的芯片卡的制造方法。 该方法具有第一层压步骤，其包括在足以使热塑性片材软化并完全流动的温度下将天线支撑件（10或40）的每一侧上的两个热塑性片材（32,34或62,64） 以消除与支撑体的厚度的任何差异，以及在热塑性片材（32,34或62,64）固化所需的时间段之后进行的第二层压步骤，第二步骤包括通过热压两个塑料 层（36,38或66,68）将卡体组合到由热塑性片材塑化的均匀厚的天线支撑（30或60）的塑性均匀面上。