Abstract:
PROBLEM TO BE SOLVED: To provide a process for producing a metallic-pattern material having excellent insulating reliability on the non-formation region of a metallic-pattern. SOLUTION: A process for producing a metallic-pattern material comprises: a step of (a1) forming on a substrate a polymer layer made of a polymer which has a functional group interacting with a plating catalyst or a precursor therefor and is directly chemically bonded to the substrate, a step of (a2) imparting the plating catalyst or precursor therefor to the polymer layer, a step of (a3) plating the plating catalyst or precursor therefor, and a step of (a4) pattern-wise etching the deposit film formed. The polymer layer satisfies all of the following requirements 1 to 4: requirement 1: to have a saturation water absorption as measured at 25°C and 50% of 0.01 to 10 mass%; requirement 2: to have a saturation water absorption as measured at 25°C and 95% of 0.05 to 20 mass%; requirement 3: to have a water absorption after 1 hour immersion in 100°C boiling water of 0.1 to 30 mass%; and requirement 4: to have a contact angle, as measured after dropping of 5 μL of distilled water thereonto and standing for 15 seconds of 50 to 150 degrees at 25°C and 50%. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing process of a film with metal films on the both sides by which a film with metal films having different functions on the both sides and having an excellent versatility in application is manufactured in a simple and easy way, and a film with metal films on the both sides manufactured by the manufacturing process. SOLUTION: The manufacturing process of a film with metal films on the both sides comprises (A) a step of forming a metal film on one side of a resin film by a casting, a metalizing or a lamination process, (B) a step of forming one or more resin layers having metal ion adsorption ability on the other side of the resin film, (C) a step of making the resin film having metal ion adsorption ability adsorb metal ions and (D) a step of reducing the metal ions, to form a plated metal film. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of producing a coated copper particle used in formation of a conductive film showing excellent conductivity.SOLUTION: A method of forming a coated copper particle includes a step A of mixing, in a solution, a polymer which has basic functional groups and a property of dissolving a copper oxide film 14 with a copper particle 12 to obtain a coated copper particle coated with a polymer copper complex 16 containing a polymer and a copper ion and a step B of removing the polymer remaining in the solution and taking out the coated copper particle. The steps A and B are carried in an atmosphere of an oxygen concentration of 1% or lower. The polymer is at least one of polyallylamine and polyethyleneimine.
Abstract:
PROBLEM TO BE SOLVED: To provide an ink composition having excellent discharge properties at the time of recording an image by an inkjet method, with the recorded image having excellent water resistance, solvent resistance and adhesion to a substrate.SOLUTION: An ink composition comprises: (component a) a compound having at least two partial structures each represented by general formula (A) per molecule; (component b) a compound selected from the group consisting of a compound represented by general formula (B1) and a compound represented by general formula (B2); and (component c) a coloring material.
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming a layer to be plated, which is developable with an aqueous solution and with which a layer to be plated excellent in adsorptivity to a plating catalyst or a precursor thereof is formed, to provide a method of producing a metal pattern material, by which a metal pattern excellent in adhesion with a substrate is easily formed by using development with an aqueous solution; and to provide a new polymer useful for the composition for forming a layer to be plated. SOLUTION: The composition for forming a layer to be plated includes a polymer having a non-dissociative functional group that interacts with a plating catalyst or a precursor thereof, a radical polymerizable group, and an ionic polar group. The method of producing a metal pattern material uses the composition for forming a layer to be plated. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for plating, useful in forming a plated film excellent in adhesiveness with a resin layer, to achieve high adhesiveness with the plated film formed in a surface thereof in spite of the surface smoothness, a surface metal film material using the same, and a method or the like for producing the same. SOLUTION: The photosensitive resin composition for plating includes: a polymer having a functional group forming a coordinate bond interaction with a plating catalyst or a precursor thereof and polymerizable group; and at least one selected from the group consisting of a synthetic rubber, epoxy acrylate monomer, and polymerizable monomer having a benzyl alcohol group. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for producing a material of a surface metal film and a method for producing a material of a patterned metal, which can simply form the metal film and the patterned metal superior in adhesiveness to a substrate with low energy. SOLUTION: The method for producing the material of the surface metal film includes the steps of: (1) bringing the substrate in contact with a polymer which has a functional group that forms an interaction with a catalyst for plating or a precursor thereof, a polymerizable radical group and a radical-generated part, and subsequently exposing the polymer to light to form a polymer layer on the substrate; (2) applying the catalyst for plating or the precursor thereof to the polymer layer; and (3) plating the catalyst for plating or the precursor thereof with a metal. The method for producing the material of the patterned metal includes the step of (4) etching the plated film of the material of the surface metal film obtained by the above production method to form the pattern. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a metal-film-coated substrate which has a metal film having excellent adhesion to the substrate and which has a small dependence on temperature and humidity, and a process for producing the substrate; and also to provide a metallic-pattern material which has a metallic pattern having excellent adhesion to the substrate, a small dependence on temperature and humidity, and excellent insulation reliability in the regions not covered by the metallic pattern, and a process for producing the material. SOLUTION: The process for producing a metal-film-coated substrate is characterized by including: a step (a1) in which a polymer layer is formed on a substrate, the polymer layer being made of a polymer which has a non-dissociable functional group interacting with a plating catalyst or a precursor therefor and capable of multidentate coordination and which is directly and chemically bonded to the substrate; a step (a2) in which a plating catalyst or precursor therefor capable of multidentate coordination is imparted to the polymer layer; a step (a3) in which a metal different from the plating catalyst or precursor therefor capable of multidentate coordination is incorporated into the polymer layer, and a step (a4) in which the plating catalyst or precursor therefor capable of multidentate coordination is plated. COPYRIGHT: (C)2009,JPO&INPIT