Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor photo-detector, in which silicon is used and which has sufficient spectral sensitivity characteristics in the near-infrared wavelength band.SOLUTION: A semiconductor photo-detector SP1 is a surface-illuminated type and includes: a silicon substrate 21 that is composed of a first-conductivity-type semiconductor, has first and second primary surfaces 21a and 21b facing to each other, and in which a second-conductivity-type semiconductor layer 23 is formed on the first primary surface side 21a; and charge transfer electrodes 25 that are provided on the first primary surface 21a and transfer generated charges. A first-conductivity-type accumulation layer 31 having a higher impurity concentration than the silicon substrate 21 is formed on the second primary surface 21b side of the silicon substrate 21, and irregular unevenness 10 is formed in at least a region of the second primary surface 21b facing the semiconductor region 23. The region in which the irregular unevenness 10 is formed on the second primary surface 21b of the silicon substrate 21 is optically exposed.
Abstract:
PROBLEM TO BE SOLVED: To provide photodiode arrays that are silicon photodiode arrays and have sufficient spectral sensitivity characteristics in near-infrared wavelength bands. SOLUTION: The photodiode array PDA1 includes a substrate S, where a plurality of light detection channels CH include an n-type semiconductor layer 32. The photodiode array PDA1 includes: a p - -type semiconductor layer 33 formed on an n-type semiconductor layer 32; a resistor 24 that is provided for each light detection channel CH and has one edge connected to a signal conductor 23; and an n-type isolation section 40 formed among the plurality of light detection channels CH. The p - -type semiconductor layer 33 composes a pn junction on an interface to the n-type semiconductor layer 32, and includes a plurality of multiplication regions AM for performing avalanche multiplication of a carrier generated by incidence of light to be detected corresponding to the light detection channels. Irregularities 10 is formed on the surface of the n-type semiconductor layer 32, and the surface is exposed optically. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor photodetector that uses silicon and has sufficient spectral sensitivity characteristics in near-infrared wavelength bands. SOLUTION: The semiconductor photodetector SP includes: a silicon substrate 21 that includes a first conductivity type semiconductor and has first and second main surfaces 21a, 21b opposing to each other and a second conductivity type semiconductor layer 23 formed at the side of the first main surface 21a; and a charge transfer electrode 25 that is provided on the first main surface 21a and transfers generated charges. On the silicon substrate 21, a first conductivity type accumulation layer 31, which has an impurity concentration higher than that of the silicon substrate 21, is formed at the side of the second main surface 21b, and irregularities 10 are formed in a region opposite to at least the semiconductor region 23 on the second main surface 21b. A region with the irregularities 10 formed on the second main surface 21b of the silicon substrate 21 is exposed optically. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor photodetection element using silicon and having spectral sensitivity characteristics sufficient for the near-infrared wavelength band.SOLUTION: A photodiode PD3 includes an n-type semiconductor substrate 1, and is back-illuminated type. The n-type semiconductor substrate 1 has a first principal surface 1a and a second principal surface 1b facing each other, and a P-type semiconductor region 3 is formed on the first principal surface 1a side. Irregular protrusions and recesses 10 are formed in at least a region facing the P-type semiconductor region 3 in the second principal surface 1b of the n-type semiconductor substrate 1. On the second principal surface 1b of the n-type semiconductor substrate 1, an accumulation layer 11 having an impurity concentration higher than that of the n-type semiconductor substrate 1 is formed. The region in the second principal surface 1b of the n-type semiconductor substrate 1 where the irregular protrusions and recesses 10 are formed is exposed optically.
Abstract:
PROBLEM TO BE SOLVED: To provide a light detection device which can restrain temporal resolution from becoming different between pixels and also can further improve temporal resolution.SOLUTION: A semiconductor photodetector 10 includes a plurality of avalanche photodiodes APD operating in Geiger mode and formed in a semiconductor substrate 1N, a quenching resistor R1 connected in series to each of the avalanche photodiodes APD and disposed on a principal plane 1Na side of the semiconductor substrate 1N, and a plurality of through electrodes TE electrically connected to the quenching resistor R1 and formed through the semiconductor substrate 1N from the principal plane 1Na side to a principal plane 1Nb side. A mounting substrate 20 includes a plurality of electrodes E9 which are disposed on a principal plane 20a side corresponding one for one to each of the through electrodes TE. The through electrodes TE and the electrodes E9 are electrically connected via a bump electrode BE. A side face 1Nc of the semiconductor substrate 1N and a side face 30c of a glass substrate 30 are made to be flush with each other.
Abstract:
PROBLEM TO BE SOLVED: To provide a photodiode and a photodiode array, which are a silicon photodiode and a silicon photodiode array respectively and have sufficient spectral response characteristics in a near-infrared wavelength band.SOLUTION: A photodiode PD5 includes a Ptype semiconductor substrate 20 and is a back-illuminated type. The Ptype semiconductor substrate 20 includes first and second principal surfaces 20a, 20b which face each other and a light sensitive region 21. The light sensitive region 21 includes an Ntype impurity region 23, a Ptype impurity region 25 and a region depleted when a bias voltage is applied in the Ptype semiconductor substrate 20. On the second principal surface 20b of the Ptype semiconductor substrate 20, an irregular convexoconcave shape 10 is formed. On the second principal surface 20b side of the Ptype semiconductor substrate 20, an accumulation layer 37 is formed and a region in the accumulation layer 37, which faces the light sensitive region 21 is optically exposed.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor optical detecting element which uses silicon and has practically sufficient spectral sensitivity characteristics only in a narrow wavelength band including the near infrared range, and to provide a method of manufacturing the semiconductor optical detecting element. SOLUTION: A photodiode PD1 includes a silicon substrate 1. The silicon substrate 1 has an n - -type semiconductor region 3 on the side of a first principal surface 1a and an n + -type semiconductor region 5 on the side of a second principal surface 1b. A p + -type semiconductor region 7 is provided in the n - -type semiconductor region 3, and a pn junction is formed between the n - -type semiconductor region 3 and p + -type semiconductor region 7. Irregular unevenness 11 is formed on the surface of the p + -type semiconductor region 7 (the first principal surface 1a of the silicon substrate 1). The surface of the p + -type semiconductor region 7 is optically exposed. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide photodiodes and photodiode arrays that are silicon photodiodes and silicon photodiode arrays and have sufficient spectral sensitivity characteristics in near-infrared wavelength bands. SOLUTION: A P - -type semiconductor substrate 20 includes first and second main surfaces 20a, 20b opposing each other, and a light sensitive region 21. The light sensitive region 21 includes an N + -type impurity region 23, a P + -type impurity region 25, and a region depleted when a bias voltage is applied in the P - -type semiconductor substrate 20. Irregularities 10 are formed on the second main surface 20b of the P - -type semiconductor substrate 20. An accumulation layer 37 is formed at the side of the second main surface 20b of the P - -type semiconductor substrate 20. A region opposite to the light sensitive region 21 in the accumulation layer 37 is exposed optically. COPYRIGHT: (C)2011,JPO&INPIT