公开(公告)号：US20190363485A1

公开(公告)日：2019-11-28

申请号：US16533723

申请日：2019-08-06

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader

IPC: H01R13/62 ,  H05K7/20 ,  H01R13/52 ,  H01R25/14

Abstract: Example implementations relate to a magnetic fluid connector. For example, a magnetic fluid connector can include a magnet, an internal fluid path defined by a first portion and a second portion when the first portion and the second portion are coupled together, and a movable member that is movable to seal the internal fluid path, where the magnet provides at least a portion of a force sufficient to seal the internal fluid path.

公开(公告)号：US10458724B2

公开(公告)日：2019-10-29

申请号：US15717313

申请日：2017-09-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F27/00 ,  F28F1/40 ,  H05K7/20 ,  H01L23/473

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US10330395B2

公开(公告)日：2019-06-25

申请号：US15819463

申请日：2017-11-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F7/00 ,  F28F1/40 ,  H05K7/20 ,  H01L23/473

Abstract: An assembly for liquid cooling is provided herein. The assembly 8 includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US20190074239A1

公开(公告)日：2019-03-07

申请号：US15774293

申请日：2016-01-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P. Franz ,  Charles R. Hanna ,  Brian T. Purcell

IPC: H01L23/40

Abstract: Example implementations relate to a heat transfer adapter plate. For example, a heat transfer adapter plate can comprise a first retention mechanism to couple a heat transfer device to the heat transfer adapter plate and a second retention mechanism to couple the heat transfer adapter plate to an electronic component. The heat transfer adapter plate can accept a plurality of heat transfer device types, including but not limited to, a passive heat exchanger, an active heat exchanger, and a heat pipe.

公开(公告)号：US20190037734A1

公开(公告)日：2019-01-31

申请号：US15665334

申请日：2017-07-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Matthew Richard Slaby

IPC: H05K7/20 ,  G05B15/02

CPC classification number: H05K7/20836 ,  G01L13/00 ,  G05B15/02 ,  H05K7/20772 ,  H05K7/20781

Abstract: Example implementations relate to a chassis cooling resource. In some examples, a chassis cooling resource includes a controller, comprising instructions to detect a failure corresponding to a first cooling system of a first chassis coupled to a server rack, and alter settings of a second cooling system of a second chassis coupled the server rack to provide additional cooling resources to the first cooling system in response to the detected failure.

公开(公告)号：US20180017341A1

公开(公告)日：2018-01-18

申请号：US15717313

申请日：2017-09-27

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John P. Franz ,  Tahir Cader ,  Michael L. Sabotta ,  David A. Moore

IPC: F28F1/40 ,  H01L23/473 ,  H05K7/20

CPC classification number: F28F1/40 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20254 ,  H05K7/20781 ,  H01L2924/00

Abstract: An assembly for liquid cooling is provided herein. The assembly 8includes a thermal member, a support member, and a gasket. The thermal member includes an array of cooling pins formed of a thermally conductive material to extend from the thermal member. The support member includes an inlet channel and an outlet channel. The inlet channel to provide a fluid to the array of cooling pins. The outlet channel to receive the fluid from the array of cooling pins. The gasket between the thermal member and the support member to form a cooling channel with a fluid tight seal therebetween.

公开(公告)号：US20250024582A1

公开(公告)日：2025-01-16

申请号：US18350190

申请日：2023-07-11

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P. Franz ,  Ernesto Juan Ferrer ,  Laura Lester

IPC: H05K1/02 ,  H05K1/14 ,  H05K7/20

Abstract: Auxiliary module includes attachment elements, cooling component, and auxiliary PCA having a circuit board, an electrical connector, and electronic components. The attachment elements are configured to attach the auxiliary module to supporting arms protruding from the PCA such that the electrical connector is coupled to a complementary electrical connector of the PCA, and the attachment elements extend through apertures in the supporting arms. The cooling component is attached to the auxiliary PCA and includes a first portion thermally coupled to cooling conduit in an installed state of the auxiliary module and a second portion thermally coupled to the electronic components in an attached state of the cooling component to the auxiliary PCA. In an attached state of the auxiliary module to the supporting arms and a coupled state of the electrical connector with the complementary electrical connector, the auxiliary module is movable along multiple directions relative to the supporting arms.

公开(公告)号：US20250012296A1

公开(公告)日：2025-01-09

申请号：US18887165

申请日：2024-09-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P. Franz ,  Steven J. Dean ,  Ernesto J. Ferrer

IPC: F04D29/64 ,  F04D29/042 ,  H05K7/20

Abstract: An example axial pump for delivering liquid coolant to cool an electronic device comprises a conduit defining a flow path from an inlet of the conduit to an outlet of the conduit and an impeller in the conduit. The impeller is rotatable about an axis of rotation parallel to the flow path. The pump also has a motor stator configured to drive rotation of the impeller body about the axis of rotation. In addition, the pump comprises an adjustment mechanism coupling the impeller to the conduit. The adjustment mechanism is actuatable to cause translation of the impeller relative to the conduit. This may allow for adjustment of a clearance between a blade tip of a blade of the impeller and a wall of the conduit.

公开(公告)号：US20240376917A1

公开(公告)日：2024-11-14

申请号：US18782418

申请日：2024-07-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P. Franz ,  Robert E. Mascia ,  Michael Dustin Scott

IPC: F16B5/02 ,  F16B35/04

Abstract: A screw-latching assembly is provided. The assembly includes a screw with a head, a tip, and a body between the head and tip. The body includes a threaded portion adjacent to the tip and an unthreaded portion adjacent to the head, and the unthreaded portion includes a built-in collar with an outer diameter larger than that of the body. The assembly includes a supporting bracket supporting and partially encompassing a first portion of the screw. The supporting bracket includes a base and multiple sidewalls, with a first sidewall comprising a first opening to allow a second portion of the screw to extend out of the supporting bracket and a second sidewall comprising a second opening to allow access to the head by a torquing tool. The assembly includes a spring surrounding at least a portion of the body, with the spring positioned between the built-in collar and the first sidewall.

公开(公告)号：US20240102490A1

公开(公告)日：2024-03-28

申请号：US18537547

申请日：2023-12-12

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P. Franz ,  Tahir Cader

IPC: F04D29/58 ,  F04D3/00 ,  F04D13/12 ,  F04D15/00 ,  F04D29/52

CPC classification number: F04D29/586 ,  F04D3/00 ,  F04D13/12 ,  F04D15/0088 ,  F04D29/528

Abstract: One aspect described in this application provides an apparatus that includes an external tray hose with an integrated booster pump for cooling a computing device. The booster pump can boost fluid flow and fluid pressure of coolant fluid pumped toward the computing device on a server tray. The booster pump includes a stator mounted around a booster pump housing with a bore. The stator includes one or more C-shaped lamination stacks for supporting coil windings. Energized coil windings generate a varying magnetic field for rotating an impeller within a housing bore to pump fluid along the housing bore of the booster pump. The apparatus includes a monitor module to monitor a set of sensors to obtain information about one or more of fluid temperature, fluid pressure, and device temperature; and a control module to adjust performance of the booster pump based on the information obtained from the set of sensors.