公开(公告)号：WO2016122404A1

公开(公告)日：2016-08-04

申请号：PCT/SG2016/050033

申请日：2016-01-26

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： ROSSI, Markus ,  HERZIG, Hans Peter ,  MUELLER, Philipp ,  NAQAVI, Ali ,  INFANTE GOMEZ, Daniel ,  DORON, Moshe ,  GLOOR, Matthias ,  YASAN, Alireza ,  RUDMANN, Hartmut ,  BALIMANN, Martin Lukas ,  BOYTARD, Mai-Lan Elodie ,  HALLAL, Bassam ,  CALERO, Daniel Perez ,  BOUCART, Julien ,  VOLKERINK, Hendrik

IPC: G01B11/25 ,  G02B3/00

CPC classification number: G02B3/0056

Abstract: An apparatus for producing structured light comprises a first optical arrangement which comprises a microlens array (L1) comprising a multitude of transmissive or reflective microlenses (2) which are regularly arranged at a lens pitch P and an illumination unit for illuminating the microlens array. The illumination unit comprises an array (S1) of light sources (1) for emitting light of a wavelength L each and having an aperture each, wherein the apertures are located in a common emission plane which is located at a distance D from the microlens array. For the lens pitch P, the distance D and the wavelength L, the following equation applies P 2 = 2LD/N, wherein N is an integer with N ≥ 1. High- contrast high-intensity light patterns can be produced. Devices comprising such apparatuses can be used for depth mapping.

Abstract translation: 一种用于生产结构光的装置包括第一光学装置，其包括微透镜阵列（L1），微透镜阵列（L1）包括以透镜间距P规则排列的多个透射或反射微透镜（2），以及用于照亮微透镜阵列的照明单元。 照明单元包括用于发射波长为L并且各自具有孔径的光源（1）的阵列（S1），其中所述孔位于与微透镜阵列距离D的公共发射平面中 。 对于透镜间距P，距离D和波长L，以下等式应用P2 = 2LD / N，其中N是N≥1的整数。可以产生高对比度高强度光图案。 包括这种装置的装置可用于深度测绘。

公开(公告)号：WO2015038064A3

公开(公告)日：2015-03-19

申请号：PCT/SG2014/000390

申请日：2014-08-20

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： GUBSER, Simon ,  CESANA, Mario ,  ROSSI, Markus ,  RUDMANN, Hartmut

IPC: H01L31/00

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：WO2014168586A1

公开(公告)日：2014-10-16

申请号：PCT/SG2014/000159

申请日：2014-04-11

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： ROSSI, Markus ,  RUDMANN, Hartmut ,  CESANA, Mario

IPC: G02B7/02 ,  G02B27/00 ,  G01C11/00 ,  G03G15/04 ,  G03B41/00

CPC classification number: G02B3/0068 ,  G02B7/021 ,  G02B7/028

Abstract: Various features can be provided to help reduce or alleviate the effects of thermal expansion/contraction of a lens array material. Such features include stress release cuts in the surface(s) of the lens array, a frame having a low constant of thermal expansion (CTE) embedded within the lens array, or polymer fibers wrapped around the lens array or around the lens array housing. The features can be used alone or in conjunction with one or more of the other features for reducing or alleviating the effects of the thermal expansion/contraction. In addition, one or more parts of a housing for the lens array can be composed of a material having a relatively low CTE. The lens array package can be incorporated into a camera or other image capturing device.

Abstract translation: 可以提供各种特征以帮助减少或减轻透镜阵列材料的热膨胀/收缩的影响。 这些特征包括透镜阵列的表面中的应力释放切口，嵌入在透镜阵列内的低常数的热膨胀（CTE）的框架，或缠绕在透镜阵列周围或围绕透镜阵列壳体的聚合物纤维。 特征可以单独使用或与一个或多个其它特征结合使用，以减少或减轻热膨胀/收缩的影响。 此外，用于透镜阵列的壳体的一个或多个部分可以由具有相对较低CTE的材料构成。 透镜阵列封装可以并入相机或其他图像捕获装置中。

公开(公告)号：WO2014070107A1

公开(公告)日：2014-05-08

申请号：PCT/SG2013/000459

申请日：2013-10-31

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： RUDMANN, Hartmut ,  CESANA, Mario ,  ALASIRNIO, Jukka ,  BOUCHILLOUX, Philippe ,  WESTENHÖFER, Susanne ,  GEIGER, Jens

IPC: G02B6/12

CPC classification number: H05K3/4697 ,  H01L23/49833 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L31/0203 ,  H01L2224/04026 ,  H01L2224/24227 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/97 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K1/182 ,  H05K1/183 ,  H05K2201/10121 ,  H05K2203/063 ,  H01L2224/83 ,  H01L2924/00

Abstract: Opto-electronic modules include conductive wiring and connections that can facilitate integrating the modules into an external device. Some opto-electronic modules include an opto-electronic stack that includes at least one lens and an opto-electronic element. Conductive paths can extend from the bottom to the top of the module. The conductive paths can include conductive pads on the surface of the opto-electronic element, as well as wiring at least partially embedded in a substrate and walls of a housing for the opto-electronic stack. Conductive connections can be disposed between a top surface of the substrate and the bottom surface of the walls such that the conductive connections electrically connect the second wiring to the first wiring and to the conductive pads on the surface of the opto-electronic element. The modules can be fabricated, for example, in wafer-level processes so that multiple opto-electronic modules can be manufactured at the same time.

Abstract translation: 光电模块包括导电布线和连接，可以方便将模块集成到外部设备中。 一些光电模块包括包括至少一个透镜和光电元件的光电堆叠。 导电路径可以从模块的底部延伸到顶部。 导电路径可以包括在光电子元件的表面上的导电焊盘，以及至少部分地嵌入基板的布线和用于光电叠层的壳体的壁。 导电连接可以设置在基板的顶表面和壁的底表面之间，使得导电连接将第二布线电连接到第一布线和光电元件表面上的导电垫。 模块可以例如在晶片级处理中制造，从而可以同时制造多个光电模块。

公开(公告)号：WO2013151507A1

公开(公告)日：2013-10-10

申请号：PCT/SG2013/000131

申请日：2013-04-03

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： RUDMANN, Hartmut ,  BIETSCH, Alexander ,  WESTENHOEFER, Susanne ,  GUBSER, Simon

IPC: G01V8/10 ,  G01B11/00

CPC classification number: H01L31/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/02325 ,  H01L31/02327 ,  H01L31/12 ,  H01L31/173

Abstract: An optical proximity sensor module includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, of a non-transparent polymer material containing a pigment, such as carbon black.

Abstract translation: 光学接近传感器模块包括基板，安装在基板的第一表面上的光发射器，该光发射器可操作以发射第一波长的光;以及光检测器，安装在基板的第一表面上，光检测器 可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如碳黑等含有颜料的不透明聚合物材料构成。

公开(公告)号：WO2013091830A1

公开(公告)日：2013-06-27

申请号：PCT/EP2012/005224

申请日：2012-12-18

Applicant: HEPTAGON MICRO OPTICS PTE. LTD. ,  HEPTAGON OY

Inventor： ROSSI, Markus ,  RUDMANN, Hartmut ,  HEIMGARTNER, Stephan ,  BIETSCH, Alexander ,  LENART, Robert

IPC: H01L27/146 ,  H01L27/148

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/14683 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H01L27/14818 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The optical device comprises a first substrate (SI) comprising at least one optical structure (1) comprising a main portion (2) and a surrounding portion (3) at least partially surrounding said main portion. The device furthermore comprises non-transparent material (5, 5a, 5b) applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate. The method for manufacturing an optical device comprises the steps of • a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and • b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.

Abstract translation: 光学装置包括包括至少一个光学结构（1）的第一基板（S1），该至少一个光学结构（1）包括主要部分（2）和至少部分地围绕所述主要部分的环绕部分（3）。 该装置还包括施加到所述周围部分上的不透明材料（5,5a，5b）。 所述光电模块包括包含在所述第一衬底中的多个这些光学器件。 制造光学器件的方法包括以下步骤。 a）提供包括至少一个光学结构的第一基板，所述至少一个光学结构包括主要部分和至少部分地围绕所述主要部分的环绕部分; 和。 b）将不透明材料施加到至少所述周围部分上。 所述不透明材料存在于仍在最终光学装置中的至少所述周围部分上。

公开(公告)号：WO2013026174A2

公开(公告)日：2013-02-28

申请号：PCT/CH2012/000200

申请日：2012-08-24

Applicant: HEPTAGON MICRO OPTICS PTE. LTD. ,  RUDMANN, Hartmut ,  MALUCK, Matthias ,  BIETSCH, Alexander ,  ROENTGEN, Peter ,  HEIMGARTNER, Stephan

Inventor： RUDMANN, Hartmut ,  MALUCK, Matthias ,  BIETSCH, Alexander ,  ROENTGEN, Peter ,  HEIMGARTNER, Stephan

IPC: H01L27/146

CPC classification number: G02B13/0085 ,  B23K26/361 ,  G01J1/42 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2924/0002 ,  Y10T29/49748 ,  Y10T83/04 ,  H01L2924/00

Abstract: The device (50) comprises an optics member (60) and a spacer member (70), said optics member comprising N ≥ 2 sets of passive optical components (65) comprising one or more passive optical components each. The spacer member (70) comprises N light channels (77), each of said N light channels being associated with one of said N sets of passive optical components. All of said N light channels (77) have an at least substantially identical geometrical length (g), and an optical path length of a first of said N light channels is different from an optical path length of at least one second of said N light channels. Methods for manufacturing such devices are described, too. The invention can allow to mass produce high-precision devices (50) at a high yield.

Abstract translation: 所述装置（50）包括光学构件（60）和间隔构件（70），所述光学构件包括N = 2组无源光学组件（65），每个无源光学组件包括一个或多个无源光学组件。 间隔构件（70）包括N个光通道（77），所述N个光通道中的每一个与所述N组无源光学部件中的一个相关联。 所有所述N个光通道（77）具有至少基本上相同的几何长度（g），并且所述N个光通道中的第一个的光路长度不同于所述N个光的至少一秒的光路长度 通道。 还描述了制造这种装置的方法。 本发明可以以高产率批量生产高精度装置（50）。

公开(公告)号：WO2013010285A1

公开(公告)日：2013-01-24

申请号：PCT/CH2012/000160

申请日：2012-07-10

Applicant: HEPTAGON MICRO OPTICS PTE. LTD. ,  RUDMANN, Hartmut ,  WESTENHOEFER, Susanne ,  TESANOVIC, Bojan

Inventor： RUDMANN, Hartmut ,  WESTENHOEFER, Susanne ,  TESANOVIC, Bojan

IPC: H01L27/146 ,  B29D11/00

CPC classification number: G02B3/0031 ,  B29D11/00307 ,  B29D11/00375 ,  B29D11/0074 ,  B29D11/00932 ,  B29K2063/00 ,  B29L2011/00 ,  G02B3/00 ,  G02B5/20 ,  G02B13/0085 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The device comprises at least one optics member (O) comprising at least one transparent portion (t) and at least one blocking portion (b). The at least one transparent portion (t) is made of one or more materials substantially transparent for light of at least a specific spectral range, referred to as transparent materials, and the at least one blocking portion (b) is made of one or more materials substantially non-transparent for light of said specific spectral range, referred to as non-transparent materials. The transparent portion (t) comprises at least one passive optical component (L). The at least one passive optical component (L) comprises a transparent element (6) having two opposing at least approximately flat surfaces substantially perpendicular to a vertical direction in a distance at least approximately equal to a thickness of said at least one blocking portion (b) measured along said vertical direction, and, attached to said transparent element (6), at least one optical structure (5). The method for manufacturing a device comprising at least one passive optical component (L) comprises providing a wafer comprising at least one blocking portion (b) and a multitude of transparent elements (6).

Abstract translation: 该装置包括至少一个包括至少一个透明部分（t）和至少一个阻挡部分（b）的光学元件（O）。 所述至少一个透明部分（t）由对于至少一个特定光谱范围的光基本上透明的一种或多种材料制成，称为透明材料，并且所述至少一个阻挡部分（b）由一个或多个 对于所述特定光谱范围的光，材料基本上不透明，被称为不透明材料。 透明部分（t）包括至少一个无源光学部件（L）。 所述至少一个无源光学部件（L）包括透明元件（6），所述透明元件（6）具有至少近似等于所述至少一个阻挡部分（b）的厚度的距离的两个相对的至少近似平坦的表面，所述至少近似平坦的表面基本上垂直于垂直方向 ），并且附接到所述透明元件（6）上的至少一个光学结构（5）。 用于制造包括至少一个无源光学部件（L）的器件的方法包括提供包括至少一个阻挡部分（b）和多个透明元件（6）的晶片。

公开(公告)号：WO2012100356A1

公开(公告)日：2012-08-02

申请号：PCT/CH2012/000015

申请日：2012-01-23

Applicant: HEPTAGON MICRO OPTICS PTE. LTD. ,  RUDMANN, Hartmut

Inventor： RUDMANN, Hartmut

IPC: B29D11/00

CPC classification number: G02B7/02 ,  B29D11/00307

Abstract: A method for manufacturing a plurality of optical devices comprising the steps of: - Providing a replication tool (1), the replication tool comprising a replication surface defining an array of replication cells, each replication cell comprising a lens replication portion (2) and a spacer replication portion ( 3 ), wherein the spacer replication portion on the replication tool is more indented than the lens replication portion, - Bringing the replication tool and a support (6) in contact with each other with replication material (11) between the replication surface and the support, - Causing the replication material to harden, - Wherein the lens replication sections are caused to be kept at a distance from the support when the support rests against the replication tool, - Removing the replication tool, and - Separating the hardened replication material into individual optical devices, each device having a replicated surface portion with a structure corresponding to a negative of a replication cell and comprising a spacer portion and a lens portion, wherein the lens portion is recessed with respect to the spacer portion.

Abstract translation: 一种用于制造多个光学器件的方法，包括以下步骤： - 提供复制工具（1），所述复制工具包括限定复制细胞阵列的复制表面，每个复制细胞包括透镜复制部分（2）和 间隔复制部分（3），其中所述复制工具上的间隔物复制部分比透镜复制部分更凹下; - 使复制工具和支撑体（6）彼此接触，其中复制材料（11）在复制 表面和支撑， - 导致复制材料硬化， - 当支架靠在复制工具上时，使透镜复制部分与支撑件保持一定距离， - 移除复制工具，和 - 分离硬化 复制材料到各个光学器件中，每个器件具有复制表面部分，其具有与复制品的负片对应的结构 并且包括间隔部分和透镜部分，其中透镜部分相对于间隔部分凹陷。

公开(公告)号：WO2016163953A1

公开(公告)日：2016-10-13

申请号：PCT/SG2016/050167

申请日：2016-04-05

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： ALASIRNIÖ, Jukka ,  HWANG, Kyu Won ,  RUDMANN, Hartmut

IPC: H04N5/225 ,  G03B13/36

CPC classification number: G02B7/09 ,  G02B7/023 ,  G03B3/10 ,  G03B17/12 ,  H04N5/2253 ,  H04N5/2254

Abstract: The present disclosure describes image sensor modules that can include auto focus control. The modules also include features that can help reduce or eliminate tilt of the module's optical sub-assembly with respect to the plane of the image sensor. In some instances, the modules include features to facilitate highly precise positioning of the optical sub-assembly, and also can result in modules having a very small z height.

Abstract translation: 本公开描述了可以包括自动对焦控制的图像传感器模块。 这些模块还包括可以帮助减少或消除模块的光学子组件相对于图像传感器平面的倾斜的特征。 在一些情况下，模块包括促进光学子组件的高精度定位的特征，并且还可以导致具有非常小的z高度的模块。