MICRO-ELECTRO-MECHANICAL SYSTEM STRUCTURES

    公开(公告)号:CA2787161A1

    公开(公告)日:2011-12-29

    申请号:CA2787161

    申请日:2011-06-15

    Applicant: IBM

    Abstract: A method of forming at least one Micro-Electro-Mechanical System(MEMS) cavity includes forming a first sacrificial cavity layer over a lower wiring layer. The method further includes forming a layer. The method further includes forming a second sacrificial cavity layer over the first sacrificial layer and in contact with the layer. The method further includes forming a lid on the second sacrificial cavity layer. The method further includes forming at least one vent hole in the lid, exposing a portion of the second sacrificial cavity layer. The method further includes venting or stripping the second sacrificial cavity layer such that a top surface of the second sacrificial cavity layer is no longer touching a bottom surface of the lid, before venting or stripping the first sacrificial cavity layer thereby forming a first cavity and second cavity, respectively.

    MICRO-ELECTRO-MECHANICAL SYSTEM
    22.
    发明专利

    公开(公告)号:CA2787130A1

    公开(公告)日:2011-12-29

    申请号:CA2787130

    申请日:2011-06-15

    Applicant: IBM

    Abstract: A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.

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