公开(公告)号：US10756824B2

公开(公告)日：2020-08-25

申请号：US16329694

申请日：2016-09-29

Applicant: Intel Corporation

Inventor： Arvind Sundaram

IPC: G02B6/42 ,  G02B6/032 ,  H04B10/80 ,  H04B10/114 ,  H04B10/43 ,  G02B6/02

Abstract: A system includes a first free-air optical interconnect of a first electrical component, the first free-air optical interconnect configured to mechanically couple to a second free-air optical interconnect of a second electrical component to communicate optical signals between the first and second electrical components. When coupled, an attach mechanism of the first free-air optical interconnect can retain the second free-air optical interconnect a fixed distance from the communication interface of the first free-air communication interface, including separate electrical connectors configured to communicate power and ground using electrical conductors, the communication interface includes a free-air optical interconnect including at least one of a laser emitter configured to transmit laser energy across an air gap to a separate device, or a photodiode configured to detect laser energy received across the air gap from the separate device.

公开(公告)号：US10712779B2

公开(公告)日：2020-07-14

申请号：US15529050

申请日：2015-12-07

Applicant: INTEL CORPORATION

Inventor： Anand V. Reddy ,  Guru Prakash ,  Harish Jagadish ,  Arvind Sundaram

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/3212

Abstract: Embodiments are generally directed to a unified chassis construction for an all in one computer. An embodiment of a computer system includes a computer sub-system to provide computer operation; a display sub-system to provide display operation; a unified plate, components installed in the unified plate including at least one or more computer sub-system components and one or more display sub-system components; and a display screen coupled with the unified plate.

公开(公告)号：US10673536B2

公开(公告)日：2020-06-02

申请号：US16329691

申请日：2016-09-29

Applicant: Intel Corporation

Inventor： Arvind Sundaram

IPC: H04B10/80 ,  H04B10/50 ,  H04B10/69

Abstract: An apparatus comprises a laser emitter configured to transmit laser energy across an air gap to a separate device; a photodiode configured to detect laser energy received across the air gap from the separate device; and logic circuitry configured to initiate recurrent transmission of a laser pulse by the laser emitter; and end the recurrent transmission in response to detecting laser energy received by the photodiode from the separate device.

公开(公告)号：US10608311B2

公开(公告)日：2020-03-31

申请号：US15440983

申请日：2017-02-23

Applicant: Intel Corporation

Inventor： Arvind Sundaram ,  Ramaswamy Parthasarathy ,  Ranjul Balakrishnan ,  Vikas Mishra

IPC: H01P3/10 ,  H01R13/7193 ,  H01R43/24 ,  H01Q13/26 ,  H01R13/6477 ,  H01P5/08 ,  H01P1/36 ,  H01P11/00 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/48 ,  H01Q13/02 ,  H01R4/18 ,  H01R13/24 ,  H05K1/18

Abstract: Embodiments of the present disclosure provide techniques and configurations for a cable assembly for single wire communications (SWC). In one instance, the cable assembly may comprise a wire having a wire end to couple with a signal launcher of an electronic device, and a first cover portion to house a first portion of the wire that extends from the wire end. The first cover portion may comprise a shape to conform to a shape of the signal launcher, and may be fabricated of a material with a dielectric constant above a threshold. The assembly may further comprise a second cover portion coupled with the first cover portion to house a second portion of the wire that extends from the first wire portion and protrudes from the first cover portion. The second cover portion may be fabricated of a ferrite material. Other embodiments may be described and/or claimed.

公开(公告)号：US10381310B2

公开(公告)日：2019-08-13

申请号：US15457102

申请日：2017-03-13

Applicant: Intel Corporation

Inventor： Arvind Sundaram

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L29/778 ,  H01L29/20

Abstract: The present disclosure relates to devices and techniques for an interconnect bridge to communicatively couple two or more dies. In an example, the interconnect bridge can include a base element having a first material. A first layer, including a second material, can be attached to the base element. A second layer, including a third material, can be disposed on the first layer. A two-dimensional electron gas (2DEG) can be located between the first layer and the second layer. A first contact, adapted to electrically couple to the first die, can be disposed in a first side of the 2DEG. A second contact, adapted to electrically couple to the second die, can be disposed in a second side of the 2DEG. Accordingly, the first die can be electrically coupled to the second die through the 2DEG.

公开(公告)号：US20190215080A1

公开(公告)日：2019-07-11

申请号：US16326732

申请日：2016-09-29

Applicant: Arvind Sundaram ,  Intel Corporation

Inventor： Arvind Sundaram

IPC: H04B10/80 ,  H04B10/50 ,  H04B10/11 ,  H04B10/69

Abstract: An apparatus comprises a laser emitter configured to transmit laser energy across an air gap to a separate device, and a driver circuit electrically coupled to the laser emitter and to an electrical interface. The driver circuit is configured to detect voltage levels at the electrical interface including a first voltage level, a second voltage level, and a third voltage level, and drive the laser emitter at a first power level when detecting the first voltage level, drive the laser emitter at a second power level when detecting the second voltage level, and drive the laser emitter at a third power level intermediate the first and second power levels when detecting the third voltage level.

公开(公告)号：US10187982B2

公开(公告)日：2019-01-22

申请号：US15486174

申请日：2017-04-12

Applicant: Intel Corporation

Inventor： Arvind Sundaram

IPC: H05K7/00 ,  H05K1/05 ,  H05K3/44 ,  H05K3/30 ,  H05K1/18 ,  G06F1/16

Abstract: Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

公开(公告)号：US10148365B2

公开(公告)日：2018-12-04

申请号：US15476651

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Arvind Sundaram

IPC: H04B10/11 ,  H04B10/80

Abstract: A communication interface apparatus can include a free-air optical transceiver for communicating signals at a first speed and an electrical contact for communicating at least one of: signals at a second speed or power. The communication interface can include a substrate having a plurality of electrical circuits. The optical transceiver can be electrically coupled to the substrate and configured to transceive an optical signal in free air. In an example, the optical transceiver can convert the optical signal to the signal at the first speed, such as an electrical signal. In an example, the electrical contact can be communicatively coupled to the substrate. The electrical contact and the free-air optical transceiver can be attached to the substrate in fixed relation with respect to one another.

公开(公告)号：US12261318B2

公开(公告)日：2025-03-25

申请号：US17213386

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Prasanna Pichumani ,  Jagadish Vasudeva Singh ,  Prakash Kurma Raju ,  Vinay Kumar Chandrasekhara ,  Arvind Sundaram ,  Naoki Matsumura

IPC: H01M50/264 ,  H01M50/242 ,  H01M50/244 ,  H01M50/247

Abstract: Techniques for battery retention are disclosed. In the illustrative embodiment, a thin polyurethane strap is used to hold a battery in place. The strap only requires a small amount of volume, allowing for a higher volume (and higher capacity) for the battery. In order to accommodate swelling, a computing device that has a battery held in place with such a strap can have an open area above the battery. The strap may have ridges to contact the battery and the component above the battery beyond the open area. If the battery swells, the ridges may be pressed down, accommodating the swelling battery.

公开(公告)号：US11895803B2

公开(公告)日：2024-02-06

申请号：US16914311

申请日：2020-06-27

Applicant: INTEL CORPORATION

Inventor： Krishnakumar Varadarajan ,  Arvind Sundaram ,  Srinivasarao Konakalla ,  Yogesh Channaiah ,  Satyajit Siddharay Kamat ,  Raghavendra N

IPC: H05K7/20 ,  F04D25/06 ,  F04D29/58 ,  F04D17/16 ,  G06F1/20 ,  F04D29/28

CPC classification number: H05K7/20172 ,  F04D17/16 ,  F04D25/0606 ,  F04D29/281 ,  F04D29/5806 ,  F04D29/5813 ,  G06F1/203

Abstract: Particular embodiments described herein provide for an electronic device that includes a fan. The fan can include a center shaft, fan blades that extend from the center shaft, and a plurality of magnets on an outside portion of at least two of the fan blades, where stator coils interact with the magnets to drive the blades around the center shaft. The center shaft and fan blades are a single component from the same material. In some examples, the center shaft and fan blades were created using a metal injection molding process.