公开(公告)号：US12261146B2

公开(公告)日：2025-03-25

申请号：US18336067

申请日：2023-06-16

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Ralf Otremba ,  Irmgard Escher-Poeppel ,  Martin Gruber

IPC: H01L23/00

Abstract: A semiconductor package is provided. The semiconductor package may include at least one semiconductor chip including a contact pad configured to conduct a current, a conductor element, wherein the conductor element is arranged laterally overlapping the contact pad and with a distance to the contact pad, at least one electrically conductive spacer, a first adhesive system configured to electrically and mechanically connect the at least one electrically conductive spacer with the contact pad, and a second adhesive system configured to electrically and mechanically connect the at least one electrically conductive spacer with the conductor element, wherein the conductor element is electrically conductively connected to a clip or is at least part of a clip, and wherein the spacer is configured to electrically conductively connect the contact pad with the laterally overlapping portion of the conductor element.

公开(公告)号：US11915999B2

公开(公告)日：2024-02-27

申请号：US18103865

申请日：2023-01-31

Applicant: Infineon Technologies AG

Inventor： Tomasz Naeve ,  Ralf Otremba ,  Thorsten Scharf ,  Markus Dinkel ,  Martin Gruber ,  Elvir Kahrimanovic

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/40 ,  H01L25/065 ,  H01L25/075 ,  H01L25/04 ,  H02P27/06

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4012 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49562 ,  H01L23/49575 ,  H01L25/043 ,  H01L25/0655 ,  H01L25/0756 ,  H01L2924/181 ,  H02P27/06 ,  H02P2201/03

Abstract: A semiconductor device includes: a carrier including an electronic circuit; a plurality of semiconductor chip packages mounted on the carrier, each of the chip packages including an encapsulation encapsulating the semiconductor chip, a plurality of contact structures electrically connecting the semiconductor chip with the electronic circuit, and at least one cooling structure protruding from the encapsulation; and a cooling element thermally conductively connected to at least one cooling structure of each of at least two of the plurality of semiconductor chip packages.

公开(公告)号：US20230187326A1

公开(公告)日：2023-06-15

申请号：US18103865

申请日：2023-01-31

Applicant: Infineon Technologies AG

Inventor： Tomasz Naeve ,  Ralf Otremba ,  Thorsten Scharf ,  Markus Dinkel ,  Martin Gruber ,  Elvir Kahrimanovic

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L25/065

CPC classification number: H01L23/49568 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49524 ,  H01L23/49575 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/49562 ,  H01L23/3107 ,  H01L25/0655 ,  H02P2201/03 ,  H02P27/06

Abstract: A semiconductor device includes: a carrier including an electronic circuit; a plurality of semiconductor chip packages mounted on the carrier, each of the chip packages including an encapsulation encapsulating the semiconductor chip, a plurality of contact structures electrically connecting the semiconductor chip with the electronic circuit, and at least one cooling structure protruding from the encapsulation; and a cooling element thermally conductively connected to at least one cooling structure of each of at least two of the plurality of semiconductor chip packages.

公开(公告)号：US11600558B2

公开(公告)日：2023-03-07

申请号：US16845304

申请日：2020-04-10

Applicant: Infineon Technologies AG

Inventor： Tomasz Naeve ,  Ralf Otremba ,  Thorsten Scharf ,  Markus Dinkel ,  Martin Gruber ,  Elvir Kahrimanovic

IPC: H01L23/48 ,  H01L21/00 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L25/065 ,  H02P27/06

Abstract: A chip package is provided. The chip package includes a semiconductor chip having on a front side a first connecting pad and a second connecting pad, a carrier having a pad contact area and a recess, encapsulation material encapsulating the conductor chip, a first external connection that is free from or extends out of the encapsulation material, an electrically conductive clip, and a contact structure. The semiconductor chip is arranged with its front side facing the carrier with the first connecting pad over the recess and with the second connecting pad contacting the pad contact area. The clip is arranged over a back side of the semiconductor chip covering the semiconductor chip where it extends over the recess. The electrically conductive contact structure electrically conductively connects the first connecting pad with the first external connection.

公开(公告)号：US20210005557A1

公开(公告)日：2021-01-07

申请号：US16917947

申请日：2020-07-01

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Thomas Behrens ,  Martin Gruber ,  Thorsten Scharf ,  Peter Strobel

IPC: H01L23/544 ,  H01L23/00

Abstract: A method of mounting electronic components on one or more carrier bodies is disclosed. The method comprises providing a support body with at least one first alignment mark, mounting the one or more carrier bodies, each having at least one second alignment mark, on the support body by alignment between the at least one first alignment mark and the at least one second alignment mark. Thereafter, the method includes mounting the plurality of electronic components on a respective one of the one or more carrier bodies by alignment using the at least one second alignment mark.

公开(公告)号：US20200328141A1

公开(公告)日：2020-10-15

申请号：US16845304

申请日：2020-04-10

Applicant: Infineon Technologies AG

Inventor： Tomasz Naeve ,  Ralf Otremba ,  Thorsten Scharf ,  Markus Dinkel ,  Martin Gruber ,  Elvir Kahrimanovic

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: A chip package is provided. The chip package includes a semiconductor chip having on a front side a first connecting pad and a second connecting pad, a carrier having a pad contact area and a recess, encapsulation material encapsulating the conductor chip, a first external connection that is free from or extends out of the encapsulation material, an electrically conductive clip, and a contact structure. The semiconductor chip is arranged with its front side facing the carrier with the first connecting pad over the recess and with the second connecting pad contacting the pad contact area. The clip is arranged over a back side of the semiconductor chip covering the semiconductor chip where it extends over the recess. The electrically conductive contact structure electrically conductively connects the first connecting pad with the first external connection.

公开(公告)号：US20200273781A1

公开(公告)日：2020-08-27

申请号：US16282207

申请日：2019-02-21

Applicant: Infineon Technologies AG

Inventor： Thorsten Scharf ,  Martin Gruber ,  Josef Hoeglauer ,  Michael Juerss ,  Josef Maerz ,  Thorsten Meyer ,  Bun Kian Tay

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: A molded semiconductor package includes a lead frame having one or more first leads monolithically formed with a die pad and extending outward from the pad in a first direction. A semiconductor die is attached to the die pad at a first side of the die. A metal clip of a clip frame is attached to a power terminal at a second side of the die. One or more second leads monolithically formed with the metal clip extend outward from the clip in a second direction different than the first direction. A mold compound embeds the die. The first lead(s) and the second lead(s) are exposed at different sides of the mold compound and do not vertically overlap with one another. Within the mold compound, the clip transitions from a first level above the power terminal to a second level in a same plane as the leads.

公开(公告)号：US10685909B2

公开(公告)日：2020-06-16

申请号：US15816090

申请日：2017-11-17

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Martin Gruber

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/11 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package includes a lead frame, a first power semiconductor device mounted on a first part of the lead frame and a second power semiconductor device mounted on a second part of the lead frame. The first power semiconductor device is encapsulated by a first mold compound. The second power semiconductor device is encapsulated by a second mold compound. The first mold compound and the second mold compound are substantially separate from each other. The lead frame includes an intermediate part arranged between the first part and the second part. The intermediate part is not covered by the first mold compound or by the second mold compound.

公开(公告)号：US20200013723A1

公开(公告)日：2020-01-09

申请号：US16453222

申请日：2019-06-26

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Ravi Keshav Joshi ,  Ralf Siemieniec ,  Thomas Basler ,  Martin Gruber ,  Jochen Hilsenbeck ,  Dethard Peters ,  Roland Rupp ,  Wolfgang Scholz

IPC: H01L23/532 ,  H01L29/16 ,  H01L29/45 ,  H01L21/768 ,  H01L23/00

Abstract: A silicon carbide device includes a silicon carbide substrate, a contact layer including nickel, silicon and aluminum, a barrier layer structure including titanium and tungsten, and a metallization layer including copper. The contact layer is located on the silicon carbide substrate. The contact layer is located between the silicon carbide substrate and at least a part of the barrier layer structure. The barrier layer structure is located between the silicon carbide substrate and the metallization layer.

公开(公告)号：US20190333874A1

公开(公告)日：2019-10-31

申请号：US16382866

申请日：2019-04-12

Applicant: Infineon Technologies AG

Inventor： Thomas Bemmerl ,  Martin Gruber ,  Thorsten Scharf

IPC: H01L23/00 ,  H01L23/495 ,  H01L21/48

Abstract: A semiconductor device is disclosed. In one example, the semiconductor device comprises a first semiconductor die comprising a first surface, a second surface opposite to the first surface, and a contact pad disposed on the first surface, a further contact pad spaced apart from the semiconductor die, a clip comprising a first layer of a first metallic material and a second layer of a second metallic material different from the first metallic material, wherein the first layer of the clip is connected with the contact pad, and the second layer of the clip is connected with the further contact pad.