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21.发明申请公开(公告)号：US20200235048A1
公开(公告)日：2020-07-23
申请号：US16838556
申请日：2020-04-02
Applicant: Intel Corporation
Inventor： Andrew Collins , Jianyong Xie , Sujit Sharan
IPC: H01L23/498 , H01L25/16 , H01L23/42 , H01L49/02 , H01L21/48
Abstract: A micro-trace containing package substrate provides a low-inductance alternating-current decoupling path between a semiconductive device and a die-side capacitor.
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