公开(公告)号：US10932393B2

公开(公告)日：2021-02-23

申请号：US16370918

申请日：2019-03-30

Applicant: Intel Corporation

Inventor： Juha Tapani Paavola ,  Mikko Antero Makinen ,  Columbia Mishra ,  Mark Carbone

IPC: H05K7/20 ,  F28D15/02 ,  G06F1/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.

公开(公告)号：US10254178B2

公开(公告)日：2019-04-09

申请号：US14229805

申请日：2014-03-28

Applicant: Intel Corporation

Inventor： Mark Carbone ,  Paul Karayacoubian

IPC: G01K7/42 ,  G01K1/20

Abstract: Techniques for estimating ambient temperature are described herein. Temperature data may be received from a first sensor of a computing device. Temperature data may be received from a second sensor of a computing device. The ambient temperature may be estimated based on the first temperature data in relation to the second temperature data.