公开(公告)号：US20200227341A1

公开(公告)日：2020-07-16

申请号：US16246311

申请日：2019-01-11

Applicant: Intel Corporation

Inventor： Nicholas Neal ,  Je-Young Chang ,  Jae Kim ,  Ravindranath Mahajan

IPC: H01L23/433 ,  F28F3/12 ,  F28F9/00 ,  F28F9/02 ,  H01L23/367 ,  H01L23/473

Abstract: A heat exchange module, comprising an array of microchannels, where the array of microchannels extends in a first direction, and are separated from one another by a first sidewall. The array of microchannels is over a cold plate. A first array of fluid distribution channels is stacked over the array of microchannels and extend in a second direction that is substantially orthogonal to the first direction. The first array of fluid distribution channels extends from the first manifold and terminate between a first manifold and a second manifold. A second array of fluid distribution channels is stacked over the array of microchannels. The first array of fluid distribution channels and the second array of the fluid distribution channels are fluidically coupled to the microchannel array. A wall extends into the microchannel array below a second sidewall separating ones of the first array and ones of the second array of fluid distribution channels.

公开(公告)号：US10553548B2

公开(公告)日：2020-02-04

申请号：US15635555

申请日：2017-06-28

Applicant: Intel Corporation

Inventor： Nicholas Neal ,  Nicholas S. Haehn

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/18 ,  H01L23/373 ,  H01L23/367 ,  H01L25/065 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56

Abstract: Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a first die disposed on a substrate, a second die disposed on the substrate, a molding compound disposed between the first die and the second die, wherein the molding compound is disposed on a top surface of the substrate. An epoxy material is disposed between a top portion of a sidewall of the first die and the molding compound, and a thermal interface material (TIM) is disposed on top surfaces of the first and second die, wherein the TIM extends over the entire length of the substrate.