Abstract:
PROBLEM TO BE SOLVED: To provide a method of forming resist patterns for highly precisely and stably forming fine patterns having excellent nano-edge roughness. SOLUTION: The method of forming the resist patterns includes selectively exposing resist films formed on a substrate and having a film thickness of ≤50 nm and developing the resist film by using a developing agent for forming the resist patterns being tetra-methyl ammonium hydroxide aqueous solution having concentration of ≤1.2 mass%. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition or the like for highly precisely and stably forming fine patterns and forming a chemical amplification positive type resist film by responding to active light or radiation and having excellent nano-edge roughness, sensitivity and resolution. SOLUTION: The composition contains a resin, an acid generating agent expressed by formula (b1), and a low molecular compound. The low molecular compound contains a compound expressed by formula (c1), a compound having two nitrogen atoms, and one of compounds or the like having three or more nitrogen atoms. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method by which a pattern excellent in sensitivity, resolution and nanoscale edge roughness can be formed and a high-accuracy fine pattern can stably be formed. SOLUTION: The pattern forming method includes: a process of forming a resist film on a substrate using a positive radiation-sensitive resin composition; a process of exposing the resist film by irradiation with radiation via a mask having a predetermined pattern; a process of forming an upper layer film on the resist film; and a process of forming a resist pattern by development, wherein the resin composition comprises a radiation-sensitive acid generator and a resin containing a repeating unit having an acid-dissociable group. The repeating unit having an acid-dissociable group is contained in the resin in an amount of 30-80 mol%. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method suitable for fine pattern formation with an electron beam, X-ray or extreme ultraviolet radiation, and a radiation-sensitive resin composition and a radiation-sensitive acid generation group-containing resin for use in the same. SOLUTION: In this pattern forming method, a resist pattern is formed by generating an acid from a radiation-sensitive acid generation group-containing resin contained as a resin component in a radiation-sensitive resin composition by irradiation with an actinic ray or radiation to increase the solubility of the radiation-sensitive acid generation group-containing resin in a developer. This radiation-sensitive resin composition contains as a resin component only an acid generation group-containing resin which comprises a repeating unit containing an acid generation group capable of generating an acid upon irradiation with an actinic ray or radiation and a non-acid-dissociative repeating unit. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a chemically amplified positive radiation-sensitive resin composition that is superior in roughness, etching resistance, sensitivity and resolution, capable of stably forming a fine pattern with high accuracy, and suitable for use as a resin composition for EB or EUV, effectively sensitive to an electron beam or extreme-ultraviolet radiation. SOLUTION: The positive radiation-sensitive resin composition contains a radiation-sensitive acid generator (A), capable of generating an acid upon irradiation with radiation, an acid-dissociable group-containing resin (B) which is alkali-insoluble or slightly alkali-soluble and becomes readily alkali-soluble by the action of an acid; an acid propagator (C) capable of generating an acid in a chain reaction by the action of an acid; and a photosensitive basic compound (D), which loses its basicity upon irradiation with radiation, wherein the acid propagator (C) is a compound, having a sulfonate group represented by Formula (1) on a carbon-ring skeleton. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin excellent in the resolution performance, sensitivity and latitude of exposure. SOLUTION: The copolymer concerned is obtained by copolymerizing a monomer expressed by formula (1) (wherein, R 1 is a hydrogen atom or a methyl group; and R 2 and R 3 are each a saturated hydrocarbyl group) and monomers containing a monomer having a specific tertiary ether group and then by hydrolyzing with an acid perfectly an acid-dissociative group of the monomer expressed by formula (1) and besides by hydrolyzing a part of the acid-dissociative group of the monomer. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a resist composition suitable for use in fine pattern formation with an electron beam or extreme-ultraviolet radiation. SOLUTION: The positive radiation sensitive resin composition contains a radiation-sensitive acid generator (A) which is at least one compound selected from among a sulfonyloxyimide compound, a sulfonium salt compound, an iodonium salt compound and a diazonium salt compound, an acid dissociable group-containing resin (B) which is alkali-insoluble or slightly alkali-soluble but becomes readily alkali-soluble by the action of acid, and an acid diffusion control agent (C), and the composition is patterned with EB, X-rays or EUV wherein the acid generator (A) is contained in an amount of 20-80 pts.wt. and the acid diffusion control agent (C) in an amount of 0.1-1 pt.wt., based on 100 pts.wt. of the acid dissociable group-containing resin (B). COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive composition satisfying high sensitivity, high resolution, good pattern form, and good line edge roughness at the same time.SOLUTION: A radiation-sensitive composition comprises: (A) a low-molecular-weight compound having, per molecule, one or more acid-dissociable groups which decompose by action of acid to enhance solubility in alkaline developing solution and one or more radiation-sensitive acid-generating groups which generate the acid by irradiation with actinic rays or a radiation and having a number-average molecular weight (Mn) of 500 to 4,000 expressed in terms of polystyrene measured by gel permeation chromatography (GPC); and (B) a solvent. The low-molecular-weight compound (A) is a compound shown by the following formula (1).
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition capable of forming a chemically amplified negative resist film, which composition is effectively sensitive to EB (electron beam) or EUV (extreme ultraviolet radiation) and excellent in roughness, etching resistance, and sensitivity and which composition stably forms a highly precise fine pattern. SOLUTION: The negative radiation-sensitive resin composition comprises an arene-based compound (A) represented by general formula (1) or (2) (wherein R is mutually independently a hydrogen atom or a 1-8C alkyl group, X is mutually independently a 1-8C alkylene group, and at least any of Rs is a 1-8C alkyl group), a crosslinking agent (B), an acid generator (C), an acid-diffusion controller (D), and a solvent (E). COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming resist patterns capable of highly precisely and stably forming fine patterns having excellent nano-edge roughness. SOLUTION: The method for forming the resist patterns includes selectively exposing resist films formed on a substrate and having a film thickness of ≤50 nm and developing the resist film by using a developing agent for forming the resist patterns being aqueous solution containing an organic solvent. COPYRIGHT: (C)2010,JPO&INPIT