Abstract:
PROBLEM TO BE SOLVED: To obtain a resin for forming an upper layer antireflection film and a composition for forming an upper layer antireflection film and to provide a method for forming a resist pattern. SOLUTION: The resin for forming an upper layer antireflection film comprises at least one of repeating units represented by formulas (1) and (2) and is soluble in an alkali development solution. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive composition capable of attaining a good pattern shape in lithography process for a high reflective substrate or a stepped substrate.SOLUTION: A radiation sensitive composition comprises: a polymer [A1] that includes a structural unit (HS1) derived from hydroxystyrene and a structural unit (a1) having a group represented by formula (a-1) and includes substantially no acid-dissociable group for producing an acidic functional group through dissociation caused by a function of an acid; and a polymer [A2] including a structural unit (HS2) derived from hydroxystyrene and the acid-dissociable group.
Abstract:
PROBLEM TO BE SOLVED: To provide an upper-layer film forming composition that forms an upper-layer film which has a small bubble defect while having large receding contact angle and small advancing contact angle, i.e. having a higher scanning speed. SOLUTION: The upper-layer film forming composition is used to form the upper-layer film on a surface of a photoresist film, and contains (A) a polymer having a repeating structure unit expressed by formula (1), (B) a polymer other than (A) and having a sulfonic acid group, and (C) a solvent. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a positive radiation-sensitive resin composition that is superior in sensitivity and resolution, small in an optical proximity effect, and ensures a sufficient focus margin for an isolated line pattern. SOLUTION: The radiation-sensitive resin composition contains (A) a low molecular weight compound obtained by substituting one hydrogen atom or more of a compound comprising an amino group where the hydrogen atom is combined with a nitrogen atom by a t-butoxy carbonyl group, (B) a radiation-sensitive acid generator, and (C) an acid dissociation group-containing resin. The compound having the amino group where the hydrogen atom is combined with the nitrogen atom is selected from among groups of a compound of formula (1), 1-adamanthylamine, nitrogen-containing heterocyclic compound, or the like. The (B) constituent is selected from among a bis(cyclohexane sulfonyl)diazomethane, N-(triflouromethanesulfonyloxy)bicyclo[2.2.1]hepto-5-ene-2, 3-dicarboximide, or the like. In the formula, R 1 and R 2 represent the hydrogen atom, alkyl group, or the like. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition capable of remarkably decreasing development defects while keeping good properties of polysiloxane and sufficient principal resist performance as a chemical amplification resist and provide a polysiloxane useful as a constituent component of the radiation-sensitive resin composition. SOLUTION: The invention provides a polysiloxane obtained by polycondensation of a silane compound expressed by general formula (I) and SiR 4 3 H (R 1 groups are each independently 1-20C alkoxy, 2-7C acyloxy or a halogen atom; R 2 is 1-20C bivalent hydrocarbon group which may have substituents; and R 3 is univalent acid-dissociable group) in the presence of water, and a radiation-sensitive resin composition containing the polysiloxane and a radiation-sensitive acid generator. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a pattern forming method, capable of suppressing development defects by using a defect removing agent in formation of a fine resist pattern by liquid immersion exposure or the like. SOLUTION: The pattern forming method comprises steps of (1) applying a radiation-sensitive resin composition containing a resin (a) which becomes alkali-soluble by the effect of acid and (b) a radiation-sensitive acid generator (b) onto a substrate to form a coating film followed by exposing; (2) applying a defect removing agent onto the coating film to form a coating layer; and (3) performing development. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for antireflection film formation having excellent coating property, forming an antireflection film capable of sufficiently reducing standing-wave effect, and capable of suppressing generation of microbubbles. SOLUTION: The composition for antireflection film formation contains (A) a copolymer (salt) of a sulfonic acid group-containing acrylamide derivative typified by 2-(meth)acrylamide-2-methylpropanesulfonic acid and a fluoroalkyl group-containing acrylic ester derivative typified by 2,2,3,3,3-pentafluoropropyl (meth)acrylate and (B) an acetylene compound typified by 2,5,8,11-tetramethyl-6-dodecyne-5,8-diol, 5,8-dimethyl-6-dodecyne-5,8-diol or ethylene oxide addition derivatives of these. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a composition for forming an antireflection film, the composition having excellent coating property, significantly suppressing generation of fine microbubbles, sufficiently decreasing a standing wave effect in a formed antireflection film, and having excellent dissolving property with water and an alkali developing solution. SOLUTION: The composition for forming an antireflection film contains a polymer having at least one kind of repeating unit expressed by formula (1). In formula (1), each of R 1 and R 2 independently represents a hydrogen atom, a fluorine atom, or a monovalent organic group; Y represents a divalent bond; Z represents a trivalent organic group; and n represents an integer of 1 to 20. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To obtain a radiation sensitive resin compsn. excellent in sensitivity, resolution and pattern shape and capable of stably forming a high precision fine resist pattern by incorporating a specified copolymer and a radiation sensitive acid generating agent. SOLUTION: This radiation sensitive resin compsn. contains a copolymer having repeating units represented by formula I and repeating units represented by formula II and a radiation sensitive acid generating agent. In the formula I, R is H or methyl. In the formula II, each of R -R is H or methyl, R is 1-6C alkylene or 2-6C alkylidene, R is 1-10C straight chain or branched alkyl, 1-10C straight chain or branched haloalkyl, 3-11C cycloalkyl, 6-10C aryl or 7-11C aralkyl and (n) is an integer of 0-5. A mixture of two or more kinds of copolymers may be used.