公开(公告)号：US20220336423A1

公开(公告)日：2022-10-20

申请号：US17633100

申请日：2019-08-07

Applicant: LG ELECTRONICS INC.

Inventor： Jungsub KIM ,  Yongdae KIM ,  Yoonchul KIM ,  Changseo PARK ,  Jina JEON

IPC: H01L25/075 ,  H01L23/00 ,  H01L33/62

Abstract: Disclosed in the present specification are a substrate for transferring, with high reliability, a semiconductor light emitting element, and a method for manufacturing a display device by using same. Particularly, when a semiconductor light emitting element is self-assembled on an assembly substrate by using an electromagnetic field, an assembly groove in which a semiconductor light emitting element for alignment is assembled is formed in the assembly substrate. The semiconductor light emitting element for alignment, assembled in the assembly groove, is used for alignment in a step of being transferred to a final wiring substrate. Unlike conventional alignment keys, the semiconductor light emitting element for alignment reflects an alignment error of semiconductor light emitting elements that occurs during a transfer process after assembly. Therefore, when semiconductor light emitting elements are transferred to a wiring substrate on the basis of the semiconductor light emitting element for alignment, transfer accuracy can be improved.