公开(公告)号：DE102006044045A1

公开(公告)日：2008-03-27

申请号：DE102006044045

申请日：2006-09-20

Applicant: LINDE AG

Inventor： WANDKE ERNST

IPC: H05K3/34 ,  B23K1/015

公开(公告)号：DE102005046199A1

公开(公告)日：2007-03-29

申请号：DE102005046199

申请日：2005-09-27

Applicant: LINDE AG

Inventor： WANDKE ERNST

IPC: B23K1/008

公开(公告)号：DE102005011887A1

公开(公告)日：2006-09-21

申请号：DE102005011887

申请日：2005-03-15

Applicant: LINDE AG

Inventor： WANDKE ERNST

IPC: B08B7/00 ,  B08B1/00

Abstract: The method involves simultaneously cleaning a surface (5) by air plasma or low vacuum plasma using a plasma device, and mechanically stressing the surface by a rotating round brush, a metallic flat brush, a scrubber, a scraper or other cleaning equipment with bristles made of copper, steel, plastic or other material. The brushes are moved on the surface around a plasma flame, by hand or machine. An independent claim is also included for a device for cleaning a surface of a reactor, comprising an atmospheric pressure plasma device.

公开(公告)号：DE10113725A1

公开(公告)日：2002-09-26

申请号：DE10113725

申请日：2001-03-21

Applicant: LINDE AG

Inventor： WANDKE ERNST ,  JURMANN ALEXANDER

IPC: F17C1/02 ,  F17C1/16 ,  F17C13/02

Abstract: The gas storage container (2), with a flexible shape, is of a gas-permeable material e.g. coated rubber or textile-reinforced polyester shrouded by an outer container (4) of a gas-permeable material and/or of a gas-impermeable material. The outer container storage zone (3) is filled with a gas or gas mixture which is free of oxygen, or an inert gas. The inner container has a monitor (5,6) to register a gas concentration. The gas storage container (2), with a flexible shape, is of a gas-permeable material e.g. coated rubber or textile-reinforced polyester shrouded by an outer container (4) of a gas-permeable material and/or of a gas-impermeable material. The gas storage container has a system (7,8) to feed gas or a gas mixture into and out of the storage zones (1,3) within the container. The outer container storage zone (3) is filled with a gas or gas mixture which is free of oxygen, or an inert gas. The inner container has a monitor (5,6) to register a gas concentration, and preferably the level of oxygen present. The pressure and/or volume changes in one of the containers is controlled by adjusting the pressure and/or volume in the other container.

公开(公告)号：DE19823527A1

公开(公告)日：1999-12-02

申请号：DE19823527

申请日：1998-05-26

Applicant: LINDE AG ,  EPM HANDELS AG ZUERICH

Inventor： WANDKE ERNST ,  ISLER HANS

IPC: B23K1/008 ,  H05K3/34 ,  B23K1/20

Abstract: The substrates with electronic components are heated to the soldering temperature and soldered under pressures less than 100 mbar

公开(公告)号：AU3256993A

公开(公告)日：1994-03-29

申请号：AU3256993

申请日：1992-12-17

Applicant: LINDE AG

Inventor： WANDKE ERNST ,  RIEF STEFAN

IPC: B08B7/00 ,  C23G5/00 ,  H05H1/30

公开(公告)号：DE502006004656D1

公开(公告)日：2009-10-08

申请号：DE502006004656

申请日：2006-07-27

Applicant: LINDE AG

Inventor： ASTROEM ANDERS ,  WANDKE ERNST

IPC: C21D1/613 ,  C21D1/667 ,  C21D9/08 ,  F25B9/00 ,  F25B19/00 ,  F25D3/10 ,  F25D3/12

公开(公告)号：DE102007016102A1

公开(公告)日：2008-10-09

申请号：DE102007016102

申请日：2007-04-03

Applicant: LINDE AG

Inventor： GERSTENBERG KLAUS W ,  WANDKE ERNST

IPC: B23K1/08

公开(公告)号：AT402779T

公开(公告)日：2008-08-15

申请号：AT05022154

申请日：2005-10-11

Applicant: LINDE AG ,  EPM HANDELS AG

Inventor： ISLER HANS ,  WANDKE ERNST

IPC: B23K1/08 ,  B23K1/00 ,  B23K3/06 ,  B23K3/08

公开(公告)号：DE102007002777A1

公开(公告)日：2008-07-24

申请号：DE102007002777

申请日：2007-01-18

Applicant: LINDE AG

Inventor： ISLER HANS ,  WANDKE ERNST

IPC: B23K3/06

Abstract: A vessel (10) contains a solder bath (9) with nozzles (4) placed over a solder channel (2). A pump places the liquid solder (1) under pressure in the solder channel (2). The novel features include a hood (5) around the solder channel. The hood can be moved vertically. It dips into the solder bath, or is otherwise sealed-off at the solder bath surface. There is a penetration (7) in the hood for each of the nozzles. An inlet (6) for protective and/or active gas is located under the hood. The upper end of each nozzle (4) is constructed as a solder head, to form a solder wave. Flow guidance baffles (8) are fitted to the hood. The solder channel is terminated by an upper cover sheet (3). Additional metal sheets are included, to cover the penetrations when required. For selective soldering, the prepared circuit board is carried into a soldering zone and positioned over the hood. The circuit board and hood are lowered simultaneously. Alternatively the circuit board is positioned on a previously-lowered hood. During the soldering process, solder is pumped up from the channel to the soldering location, via at least one of the nozzles. At the same time, protective and/or active gas is introduced. On completion of soldering, the board leaves the soldering zone and containment is removed by raising the hood. Protective gas is introduced at one rate for soldering and another rate for protection between soldering. The flow is reduced after soldering. Before soldering is commenced, the hood is lowered. The level reached, matches the component geometry on the underside of the board and is just below the lowest point of the assembly to be soldered. Between soldering operations, the penetrations are covered by additional metal sheets. An independent claim IS INCLUDED FOR the corresponding method of selective soldering.