公开(公告)号：WO2014093065A1

公开(公告)日：2014-06-19

申请号：PCT/US2013/072916

申请日：2013-12-03

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： SAKARIYA, Kapil V. ,  BIBL, Andreas ,  HU, Hsin-Hua

IPC: G09F9/30

CPC classification number: H01L27/156 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/20 ,  H01L33/42 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管衬底。 像素区域包括阵列开口的阵列和阵列阵列内的底部电极阵列。 接地线位于非像素区域中，并且接地线的阵列在像素区域中的堤开口之间延伸并且电连接到非像素区域中的接地线。

公开(公告)号：WO2014093063A1

公开(公告)日：2014-06-19

申请号：PCT/US2013/072913

申请日：2013-12-03

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： SAKARIYA, Kapil, V. ,  BIBL, Andreas ,  HU, Hsin-Hua

IPC: H01L33/60 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/06 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/92244 ,  H01L2224/95 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.

Abstract translation: 描述了发光器件的反射堤结构。 反射堤结构可以包括衬底，衬底上的绝缘层，以及绝缘层中的堤开口阵列，每个堤开口包括底表面和侧壁。 反射层跨越绝缘层中每个堤开口的侧壁。

公开(公告)号：WO2014062425A1

公开(公告)日：2014-04-24

申请号：PCT/US2013/063929

申请日：2013-10-08

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： SAKARIYA, Kapil V. ,  BIBL, Andreas

IPC: G09G3/32

CPC classification number: G09G5/399 ,  G06F3/14 ,  G09G3/20 ,  G09G3/3216 ,  G09G3/3233 ,  G09G5/005 ,  G09G2300/026 ,  G09G2310/0213 ,  G09G2310/04 ,  G09G2320/0613 ,  G09G2330/021 ,  G09G2340/0435 ,  G09G2350/00 ,  G09G2360/18 ,  G09G2370/08

Abstract: A content-based adaptive refresh technique is implemented in an active matrix display system for reducing power consumption. The active matrix display system includes a display panel having multiple rows of display elements arranged as a display matrix. The display panel is coupled to a scan driver and a data driver. The scan driver selects one row at a time to receive data signals, and the data driver provides the data signals. The active matrix display system also includes a timing controller operable to signal the scan driver to cause a first row of the display panel to be not refreshed in a current data frame and a second row of the display panel to be refreshed in the current data frame.

Abstract translation: 基于内容的自适应刷新技术在有源矩阵显示系统中实现，用于降低功耗。 有源矩阵显示系统包括具有布置为显示矩阵的多行显示元件的显示面板。 显示面板耦合到扫描驱动器和数据驱动器。 扫描驱动器一次选择一行以接收数据信号，数据驱动器提供数据信号。 有源矩阵显示系统还包括一个定时控制器，该时序控制器可用于发信号通知扫描驱动器，使得显示面板的第一行在当前数据帧中不刷新，而在当前数据帧中刷新显示面板的第二行 。

公开(公告)号：WO2014008110A1

公开(公告)日：2014-01-09

申请号：PCT/US2013/048364

申请日：2013-06-27

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： GOLDA, Dariusz ,  BIBL, Andreas

IPC: H01L21/677 ,  B81C1/00

CPC classification number: B81C99/002

Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

Abstract translation: 描述了一种兼容的双极微器件传输头阵列和从SOI衬底形成兼容的双极微器件传输阵列的方法。 在一个实施例中，柔性双极微器件转移头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括第一和第二硅互连以及与第一和第二硅互连电连接并可偏转到基底基板和硅电极之间的一个或多个空腔中的第一和第二硅电极阵列。

公开(公告)号：WO2013074372A1

公开(公告)日：2013-05-23

申请号：PCT/US2012/064220

申请日：2012-11-08

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： HU, Hsin-Hua ,  BIBL, Andreas ,  HIGGINSON, John, A. ,  LAW, Hung-Fai, Stephen

IPC: H01L33/36 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/20 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/405 ,  H01L2224/7598 ,  H01L2224/83191 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

Abstract translation: 描述了将微器件和微器件阵列制造和传送到接收衬底的方法。 在一个实施例中，在蚀刻p-n二极管层以形成多个微p-n二极管期间，电绝缘层被用作蚀刻停止层。 在一个实施例中，在将微器件形成和传送到接收衬底期间，使用导电中间接合层。

公开(公告)号：WO2015171267A3

公开(公告)日：2015-11-12

申请号：PCT/US2015/025611

申请日：2015-04-13

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： PARKS, Paul Argus ,  LIGHT, Nile Alexander ,  BATHURST, Stephen P. ,  HIGGINSON, John A. ,  BIBL, Andreas

IPC: B25J7/00 ,  B25J18/00

Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.

公开(公告)号：WO2015138102A1

公开(公告)日：2015-09-17

申请号：PCT/US2015/016696

申请日：2015-02-19

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： HU, Hsin-Hua ,  BIBL, Andreas

IPC: H01L25/075 ,  H01L33/08 ,  H01L33/16 ,  H01L33/24 ,  H01L33/00

CPC classification number: H01L27/153 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L29/0669 ,  H01L29/0676 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/08 ,  H01L33/16 ,  H01L33/18 ,  H01L33/24

Abstract: A nanowire device (250) and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device (250) includes a base layer (208) and a plurality of nanowires on and protruding away from a first surface of the base layer. An encapsulation material (234) laterally surrounds the plurality of nanowires in the nanowire device, such that the nanowires are embedded within the encapsulation material.

Abstract translation: 描述了纳米线器件（250）和形成用于拾取和转移到接收衬底的纳米线器件的方法。 在一个实施例中，纳米线器件（250）包括基底层（208）和在基底层的第一表面上并远离基底层突出的多个纳米线。 封装材料（234）横向地围绕纳米线装置中的多个纳米线，使得纳米线嵌入封装材料内。

公开(公告)号：WO2015099944A1

公开(公告)日：2015-07-02

申请号：PCT/US2014/067501

申请日：2014-11-25

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： MCGRODDY, Kelly ,  HU, Hsin-Hua ,  BIBL, Andreas ,  CHAN, Clayton Ka Tsun ,  HAEGER, Daniel Arthur

IPC: H01L33/14 ,  H01L25/075 ,  G02F1/1335 ,  G09G3/32 ,  H01L33/16 ,  H01L33/20 ,  H01L27/15 ,  H01L27/12 ,  H01L23/00

CPC classification number: H01L33/145 ,  G09G3/32 ,  H01L24/75 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/016 ,  H01L27/156 ,  H01L33/0016 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/06 ,  H01L33/14 ,  H01L33/16 ,  H01L33/20 ,  H01L33/30 ,  H01L33/42 ,  H01L2224/75305 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/82203 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.

Abstract translation: 公开了用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括内部限制的电流注入区域，以减少由于边缘效应引起的非辐射复合。 限制电流的几种方式可以包括电流分布层的蚀刻去除，电流分布层和有源层的蚀刻去除，随后的台面再生长，通过离子注入或扩散的分离，量子阱混合和氧化物隔离。

公开(公告)号：WO2015006000A1

公开(公告)日：2015-01-15

申请号：PCT/US2014/041493

申请日：2014-06-09

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： HU, Hsin-Hua ,  CHANG, Kevin K.C. ,  BIBL, Andreas

IPC: H01L33/00 ,  H01L25/075 ,  H01L23/00 ,  H01L27/15

CPC classification number: H01L33/62 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/04 ,  H01L33/06 ,  H01L33/08 ,  H01L33/32 ,  H01L33/60 ,  H01L2224/83005 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

Abstract translation: 公开了一种稳定微器件阵列的方法和结构。 稳定层包括稳定腔阵列和稳定柱阵列。 每个稳定腔包括围绕稳定柱的侧壁。 微型设备阵列位于稳定柱阵列上。 微器件阵列中的每个微器件包括比直接在底表面下方的相应的稳定柱更宽的底表面。

公开(公告)号：WO2014099499A1

公开(公告)日：2014-06-26

申请号：PCT/US2013/074156

申请日：2013-12-10

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： SAKARIYA, Kapil V. ,  BIBL, Andreas ,  MCGRODDY, Kelly

IPC: H05B37/02

CPC classification number: G09G3/3426 ,  G09G3/2088 ,  G09G3/32 ,  G09G3/3216 ,  G09G3/3233 ,  G09G3/3266 ,  G09G2300/0828 ,  G09G2300/0842 ,  G09G2300/0857 ,  G09G2310/08 ,  G09G2320/029 ,  G09G2330/028 ,  H01L25/0753 ,  H01L25/167 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.

Abstract translation: 描述发光组件。 在一个实施例中，一个或多个发光二极管（LED）器件和一个或多个微控制器被结合到衬底的同一侧，一个或多个微控制器用于切换和驱动一个或多个LED器件。