Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor acceleration sensor capable of exactly measuring displacement gap dimensions between a bob of the semiconductor acceleration sensor and a plate without depending on the transparency of the plate, and its inspection method. SOLUTION: The semiconductor acceleration sensor comprises a thin bridge part 12 whose one end is made into one body with a frame 11 formed by etching on a semiconductor substrate inside the frame 11, a sensor chip 1 having a bob part 13 thicker than the bridge part 12 formed in one body at the other end of the bridge part 12, separately from the frame 11 and provided with a strain gauge resistor 14 varying its resistance according to the impressed displacement at the bridge part 12, and a plate 2 contacted to both sides of the sensor chip 1 and regulating the displacement of the bob 13 by covering the bob 13. A penetration hole 23 is provided at the position facing the bob 13 of the plate 2 to measure the displacement gap dimension 3 between the bob 13 and the plate 2.
Abstract:
PROBLEM TO BE SOLVED: To provide a flip-chip mounting method for making the quantity of flux transferred in plural solder bumps to be uniform, stabilizing the wettability of solder on an electrode for bump connection at reflow and surely mounting a semiconductor substrate on a substrate. SOLUTION: Recessed parts 14 are formed in the tip parts of plural solder bumps 3, and a prescribed quantity of flux 4 is individually supplied to the recessed parts 14. Thus, the quantity of flux 4 supplied can individually be controlled/managed for the respective solder bumps 3. Then, flux 4 can be held in the recessed parts 14 of the solder bumps 3, after it is transferred to the solder bumps 3. Consequently, the quantity of flux 4 transferred to the solder bumps 3 can be made uniform. Thus, wettability of solder to an electrode for bump connection 5 at reflow can be stabilized, and a semiconductor device 1 can be mounted surely on a substrate.
Abstract:
PROBLEM TO BE SOLVED: To provide a highly reliable mounting structure of a surface mounting electronic part which surely fixes and electrically connects a surface mounting electronic part on a substrate. SOLUTION: In a mounting structure of a surface mounting electronic part for mounting a surface mounting electronic part 1 such as a chip provided with an electrode 11 at both ends thereof on a substrate 2 wherein a specified conductor pattern is formed, a recessed part 22 to contain the surface mounting electronic part 1 is formed in a specified place of the substrate 2, elastic resin 4 is injected to the recessed part 22, the surface mounting electronic part 1 is contained in the recessed part 22 and an electrode 11 at both ends of the surface mounting electronic part 1 is pressed from above by a conductive elastic jig 5 connected to a connection electrode 21 whose one end is connected to a conductor pattern. As a result, the connection electrode 21 provided near the recessed part 22 and the electrode 11 at both ends of the surface mounting electronic part 1 are electrically connected and the surface mounting electronic part 1 is fixed to the substrate 2.
Abstract:
PROBLEM TO BE SOLVED: To obtain a mounting structure with which a surface mounting-type electronic component can surely be fixed and electrically connected to a board. SOLUTION: In this mounting structure for a surface mounting-type electronic component, the surface mounting-type electronic component 1, such as a chip component or the like in which an electronic 11a and an electrode 11b are formed on both ends, is mounted on a board 2 on which a prescribed conductor pattern is formed. A recessed part 22, in which a connecting electrode 21a is formed at least one place on the inner wall, is formed on the board 2. The surface mounting-type electronic component 1 is housed in the recessed part 22. The connecting electrode 21a and the electrode 11a on one side of the surface mounting-type electronic component 1 are connected and fixed, by pressing the surface mounting-type electronic component 1 from the side of the electrodes 11a, 11b on both ends, while a conductive elastic body 4 is interposed therebetween.
Abstract:
PROBLEM TO BE SOLVED: To provide an information transmission device capable of arousing attention to a weather state surely, by transmitting information based on weather related information to a person just going out at the front door. SOLUTION: In this information transmission device A, a display 8 comprising an organic EL light-emitting element is provided on a facility around the front door, such as a fitting or furniture, arranged near the front door, for example, an umbrella stand 7, and a light-emitting state of the display 8 is changed, based on the weather information from an external weather information server 8, to thereby transmit the weather information to the person who is about to go outside. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a digital pet system with full reality by allowing a user to come in contact with a digital pet in a plurality of places and at a same time allowing a plurality of users to use it. SOLUTION: This digital pet system is provided with a plurality of digital pet devices 8a each having a display part 250d for displaying a character, and a control part 250a for controlling the display movement of the character; the respective digital pet devices 8a are mutually connected via home networking; and the control part 250a displays the character as if the character moves among digital pet devices 8a on a single display part 250d. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an article position detection system capable of detecting the location of an article in a house efficiently. SOLUTION: The article position detection system comprises: a plurality of radio communication modules 8b arranged in the house; an ID tag 200 that is provided in an article 300 in the house for communicating with the radio communication module 8b by radio; and a communication control monitoring module 8a for controlling and monitoring the plurality of radio communication modules 8b. The plurality of radio communication modules 8b transmit radio signals to mutually different ranges and communicate with the IC tag 200 provided in the article 300 existing in the different ranges by radio, thus detecting the position of the article 300. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a functional device capable of establishing a system having various functions only by being connected to a gate device. SOLUTION: The functional device establishes a wiring system comprising a basic function module 8 supplied with power from a power line L1 via the gate device 3, by connecting a connector to a power route connection port and an information route connection port provided on the front face of the gate device 3 attached on a switch box 2 with an attaching frame 4, and exchanging an information signal to be transmitted to the information line L2 with the gate device 3; an extended function module 9 1 connected to the basic function module 8 and arranged along a wall surface; and an extended function module 9 2 to be successively as necessary in a side direction from the extended function module 9 1 . COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an apparatus for evaluating the effectiveness of base isolation and capable of measuring the magnitude of oscillations which base isolation buildings received from earthquakes etc. and evaluating the effectiveness of base isolation of base isolation bearing devices, an oscillation measuring system for measuring oscillations of each building through the use of the same, and a control system capable of suppressing damage due to oscillations by controlling facilities when the buildings receive large oscillations. SOLUTION: The apparatus 1 for evaluating the effectiveness of base isolation is provided with acceleration sensors 10a and 10b and an arithmetic processing part 11 for determining the difference between detection output of both acceleration sensors 10a and 10b by comparison. One acceleration sensor 10a is installed to the side of foundation ground X to detect the magnitude of oscillations of the foundation ground X, and the other acceleration sensor 10b is installed to the side of a house H to detect the magnitude of oscillations of the house H. The arithmetic processing part 11 computes the difference between the magnitudes of both oscillations. The state of oscillations indicated by operation data of the arithmetic processing part 11 is displayed on a monitoring device 40 of a base unit 4 of an intercom device. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an acceleration sensor that has small decrease in the detection accuracy of acceleration to the temperature change in external environment, and especially can accurately detect acceleration in a three-dimensional direction. SOLUTION: The acceleration sensor has a thin section and a fixed section located at the outer periphery of the thin section, has a distortion detection element such as piezo resistance in the thin section while acceleration sensor chips 2a and 2b where a pressure reception medium is sealed into a recess formed by the thin section are fixed to a support member 1 having a plurality of fixation surfaces. By fixing acceleration sensor chips one by one to the fixation surface of the support member, acceleration in a three-directional direction can be detected with high accuracy. The acceleration sensor chip may be fixed to the support member 1 through substrates 3a and 3b, or may be directly fixed to the support member where an electric circuit is formed. COPYRIGHT: (C)2003,JPO