公开(公告)号：JP2008252148A

公开(公告)日：2008-10-16

申请号：JP2008188492

申请日：2008-07-22

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： KURAMOTO MASAFUMI ,  TSUKIOKA TOMOYA ,  HAYASHI MASAKI ,  MIKI MICHIHIDE ,  TAMAOKI HIROTO ,  KISHIMOTO TOMOHISA

IPC: H01L33/32 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a surface mount type light-emitting device having excellent light resistance and mass productivity.
SOLUTION: The surface mount type light-emitting device has: a light-emitting element 10; a circuit board 20 on which the light-emitting element 10 is placed; a wall section 50 that is formed on the circuit board 20 and reflects light from the light-emitting element 10; and a light-transmitting sealing member 70 for covering the light-emitting element 10. The wall section 50 is formed of a thermosetting resin, adheres to the circuit board 20, and is formed by transfer molding.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决的问题：提供具有优异的耐光性和批量生产率的表面安装型发光装置的制造方法。 表面安装型发光装置具有：发光元件10; 其上放置有发光元件10的电路板20; 形成在电路板20上并反射来自发光元件10的光的壁部50; 以及用于覆盖发光元件10的透光密封构件70.壁部50由热固性树脂形成，粘附到电路板20上，并通过传递成型形成。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008252136A

公开(公告)日：2008-10-16

申请号：JP2008182469

申请日：2008-07-14

Applicant: Nichia Corp ,  日亜化学工業株式会社

Inventor： KURAMOTO MASAFUMI ,  KISHIMOTO TOMOHISA

IPC: H01L33/32 ,  H01L33/50 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC classification number: H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a long-life surface mount type light-emitting device having excellent mass productivity, and to provide a forming body used for the surface mount type light-emitting device. SOLUTION: The surface mount type light-emitting device has: a GaN-based light-emitting element 10 emitting blue light; a first resin forming body 40, where a first lead 20 for placing the light-emitting element 10 and a second lead 30 electrically connected to the light-emitting element 10 are formed integrally; and a second resin forming body 50 containing a YAG-based phosphor 80 for covering the light-emitting element 10. The first resin forming body 40 forms a recess 40c having a bottom surface 40a and a side 40b. The second resin forming body 50 is arranged in the recess 40c. In the first resin forming body 40, a thermosetting resin, such as an epoxy resin, is formed by transfer molding. The second forming body 50 uses a thermosetting resin, such as a silicone resin. COPYRIGHT: (C)2009,JPO&INPIT