Abstract:
In a focal position adjusting method for an inspection apparatus, the inspection apparatus includes an illumination optical system and an imaging optical system configured to perform a defect inspection of a pattern formed in a sample using an image imaged on a first sensor. The focal position adjusting method includes illuminating the light from the first light source on the sample after transmitting the light through a first slit disposed in the illumination optical system. The light from the first light source is condensed into a second sensor disposed in the imaging optical system. A light intensity distribution of a pupil of the illumination optical system is observed. The focal position of the illumination optical system is adjusted by obtaining each light quantity of the front focus and the rear focus of the image of the first slit projected on the sample based on the light intensity distribution.
Abstract:
An inspection apparatus comprising, a light source configured to illuminate a sample, a half-wavelength plate configured to transmit light transmitted through or reflected from the sample, a polarization beamsplitter, a first and second sensor configured to receive the light as a first and second optical image respectively transmitted through the beamsplitter, an image processor configured to obtain a gradation value of each pixel of the first sensor, a defect detector configured to detect a defect of the first optical image, using the gradation value, and a comparator configured to compare the second optical image to a reference image based on design data, and to determine that the second optical image is defective when at least one difference of position and shape between the optical image and the reference image exceeds a predetermined threshold, and an angle adjusting unit configured to adjust an angle of the half-wavelength plate.
Abstract:
A multiple electron beam irradiation apparatus includes a first region setting circuit which sets a first frame region of a plurality of first frame regions which can be irradiated with remaining beams after excluding beams in one row and one column at end; a second region setting circuit which sets a second frame region of a plurality of second frame regions each having four corners equivalent to an irradiation position of the defective beam by using normal beams; and an electron beam irradiation mechanism which performs the first multiple electron beam irradiation processing for the each of the plurality of first frame regions of the target object by using the normal beams, and perform second multiple electron beam irradiation processing for each of the plurality of second frame regions by using at least beams at the four corners.
Abstract:
A charged particle beam inspection method conducted by disposing a sample on a stage and by performing a first scanning in a first beam scanning area on the sample by using one first charged particle beam out of a plurality of charged particle beams while the stage is moved so that a first inspection of a first inspection unit in the first beam scanning area is performed, and by performing a second scanning in a second beam scanning area on the sample by using one second charged particle beam out of the charged particle beams while the stage is moved so that a second inspection of a second inspection unit in the second beam scanning area is performed.
Abstract:
An image capturing device comprising, a light source configured to emit light having a predetermined wavelength, a polarization beamsplitter configured to receive the light from the light source, a Faraday rotator configured to rotate a polarization plane of the light via the polarization beamsplitter by changing the intensity of the magnetic field, an objective lens configured to illuminate an inspection target with the light transmitted through the Faraday rotator and a sensor configured to capture an optical image of the inspection target by causing the light reflected by the inspection target to be incident through the objective lens, the Faraday rotator, and the polarization beamsplitter.
Abstract:
A charged particle beam inspection apparatus includes a first deflector to deflect N×N′ multiple beams collectively to N×N′ small regions having a size p/M in the first direction and arrayed at the pitch p in the first direction, perform tracking deflection, and re-deflect the multiple beams collectively to next N×N′ small regions away from the N×N′ small regions by N small regions in the first direction, by the stage completes a movement of a distance of N/M×p so as to reset the tracking deflection; and a second deflector to deflect the multiple beams collectively to scan the N×N′ small regions concerned while the tracking deflection is performed.
Abstract:
A pattern width deviation measurement method includes measuring width dimensions of a plurality of figure patterns in an optical image from data of gray-scale value profiles of the optical image, using a threshold of a gray-scale value level variably set depending on design dimension information including design width dimension of a corresponding figure pattern of a plurality of figure patterns, and at which influence of a focus position on width dimension becomes smaller, measuring width dimensions of a plurality of corresponding figure patterns in a reference image from data of gray-scale value profiles of the reference image, respectively using the threshold for the corresponding figure pattern of a plurality of figure patterns, and calculating, for each of measured width dimensions of a plurality of figure patterns in the optical image, an amount deviated from a measured width dimension of a corresponding figure pattern in the reference image.
Abstract:
According to one embodiment, a defect inspection device includes a first beam splitter configured to branch light into a first optical path and a second optical path, a first optical system on the first optical path, a second optical system on the second optical path, a first aperture configured to form an illumination field of an inspection sample by light from the first optical system, a second aperture configured to form an illumination field of the inspection sample by light from the second optical system, and a third optical system configured to illuminate, with a first illumination, an image of the first aperture on a first area of the inspection sample, and to illuminate, with a second illumination, an image of the second aperture on a second area of the inspection sample.
Abstract:
An image capturing device comprising, a light source configured to emit light having a predetermined wavelength, a polarization beamsplitter configured to receive the light from the light source, a Faraday rotator configured to rotate a polarization plane of the light via the polarization beamsplitter by changing the intensity of the magnetic field, an objective lens configured to illuminate an inspection target with the light transmitted through the Faraday rotator and a sensor configured to capture an optical image of the inspection target by causing the light reflected by the inspection target to be incident through the objective lens, the Faraday rotator, and the polarization beamsplitter.
Abstract:
An illumination apparatus comprising, a light source that emits a laser beam, a lens array on which the laser beam is illuminated, a plurality of element lenses having a diameter greater than or equal to the laser beam are arranged in the lens array, the lens array being rotatable around an optical axis of the laser beam, wherein the two lens arrays are arrayed in an optical axis direction of the laser beam, andthe element lenses in each lens array are arranged such that a boundary between the element lenses adjacent to each other radiates from a rotation center of the lens array and a direction in which the element lens of one of the lens arrays traverses the optical axis of the laser beam is orthogonal to a direction in which the element lens of the other lens array traverses the optical axis of the laser beam.