公开(公告)号：EP1435118B1

公开(公告)日：2011-11-02

申请号：EP02767077.7

申请日：2002-08-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  BOGNER, Georg ,  WAITL, Günter

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

Abstract: The invention relates to a conductor frame for a surface-mounted radiation-emitting component, preferably a light-emitting diode component comprising at least one chip connecting zone and at least one external connecting strip. The conductor frame is planar and between the chip connecting zone and the external connecting strip a deformation element, preferably a spring element, is disposed that allows for an elastic or plastic deformation of the conductor frame in the plane of the conductor frame. The invention further relates to a housing, a surface-mounted component and a system comprising a plurality of said components.

公开(公告)号：EP2132789B1

公开(公告)日：2010-11-10

申请号：EP08734436.2

申请日：2008-03-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  PETERSEN, Kirstin

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/44 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2933/0091 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An optoelectronic component is specified that emits a useful radiation. It comprises a housing having a housing base body with a housing cavity, and a light-emitting diode chip arranged in the housing cavity. At least one base body material of the housing base body has radiation-absorbing particles admixed in a targeted manner to reduce its reflectivity. According to another embodiment of the component, the housing additionally or alternatively has a housing material transmissive for the useful radiation that has radiation-absorbing particles admixed in a targeted manner to reduce its reflectivity. In addition, a method for manufacturing such a component is specified.

公开(公告)号：EP2132789A1

公开(公告)日：2009-12-16

申请号：EP08734436.2

申请日：2008-03-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  PETERSEN, Kirstin

IPC: H01L33/00 ,  H01L25/075

CPC classification number: H01L33/44 ,  H01L24/73 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2933/0091 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An optoelectronic component is specified that emits a useful radiation. It comprises a housing having a housing base body with a housing cavity, and a light-emitting diode chip arranged in the housing cavity. At least one base body material of the housing base body has radiation-absorbing particles admixed in a targeted manner to reduce its reflectivity. According to another embodiment of the component, the housing additionally or alternatively has a housing material transmissive for the useful radiation that has radiation-absorbing particles admixed in a targeted manner to reduce its reflectivity. In addition, a method for manufacturing such a component is specified.

公开(公告)号：EP1216266B1

公开(公告)日：2007-06-06

申请号：EP00963869.3

申请日：2000-08-04

Applicant: Osram Opto Semiconductors GmbH & Co. OHG

Inventor： HÖHN, Klaus ,  WAITL, Günter ,  ARNDT, Karlheinz

IPC: C08G59/42 ,  C08G59/38 ,  C08L63/04 ,  H01L33/00

CPC classification number: C08G59/38 ,  C08G59/42 ,  H01L23/293 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2933/0091 ,  H01L2924/00

Abstract: The invention relates to a cast resin material which can be used as a material for assembling and encapsulating electronic and optoelectronic parts, modules and components. The inventive resin material can be used to cast optoelectronic parts made from epoxy compounds which are acid-anhydride curable, especially bisphenol-A-diglycidylether, and is characterized in that it contains poly-functional epoxynovolac resins, especially one epoxycresolnovalac. Said cast resin material exhibits a significantly higher glass transition temperature, is suitable for mass production processes, is not harmful to health and yields SMT-enabled products which can be used in car production.

公开(公告)号：EP1751806B1

公开(公告)日：2019-09-11

申请号：EP05748711.8

申请日：2005-05-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz

IPC: H01L33/00

公开(公告)号：EP1886359B1

公开(公告)日：2019-07-03

申请号：EP06722836.1

申请日：2006-05-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： BOGNER, Georg ,  ARNDT, Karlheinz

IPC: H01L23/498 ,  H01L31/0203 ,  H01L33/48 ,  H01L33/62 ,  H01L23/00

公开(公告)号：EP1588436A1

公开(公告)日：2005-10-26

申请号：EP04706121.3

申请日：2004-01-29

Applicant: Osram Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  BOGNER, Georg ,  BRAUNE, Bert ,  WAITL, Günter

IPC: H01L33/00 ,  H01L31/0203

CPC classification number: H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip ( 1 ), which is disposed in a recess ( 2 ) of a housing base body ( 3 ) and is there encapsulated with an encapsulant ( 4 ) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip ( 1 ). The recess ( 2 ) comprises a chip well ( 21 ) in which the semiconductor chip ( 1 ) is secured, and a trench ( 22 ) that runs at least partway around the chip well ( 21 ) inside the recess ( 2 ), such that between the chip well ( 21 ) and the trench ( 22 ) the housing base body ( 3 ) comprises a wall ( 23 ) whose apex, viewed from a bottom face of the chip well ( 21 ), lies below the level of the surface of the housing base body ( 3 ) from which the recess ( 2 ) leads into the housing base body ( 3 ), and the encapsulant ( 4 ) extends outward from the chip well ( 21 ) over the wall into the trench ( 22 ). A corresponding housing base body is also disclosed.

公开(公告)号：EP1435118A2

公开(公告)日：2004-07-07

申请号：EP02767077.7

申请日：2002-08-02

Applicant: Osram Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  BOGNER, Georg ,  WAITL, Günter

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

Abstract: The invention relates to a conductor frame for a surface-mounted radiation-emitting component, preferably a light-emitting diode component comprising at least one chip connecting zone and at least one external connecting strip. The conductor frame is planar and between the chip connecting zone and the external connecting strip a deformation element, preferably a spring element, is disposed that allows for an elastic or plastic deformation of the conductor frame in the plane of the conductor frame. The invention further relates to a housing, a surface-mounted component and a system comprising a plurality of said components.

公开(公告)号：EP1312117A1

公开(公告)日：2003-05-21

申请号：EP01971631.5

申请日：2001-08-22

Applicant: Osram Opto Semiconductors GmbH

Inventor： ARNDT, Karlheinz ,  BOGNER, Georg ,  BRUNNER, Herbert ,  WAITL, Günter

IPC: H01L25/075 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to a component (1) comprising a large number of light-emitting-diode chips (5) in a reflector (3), the latter being configured in such a way that the direct line of vision between the light-emitting-diode chips (5) is interrupted by an intermediate wall (11). This significantly improves the effectiveness of the component (1).

公开(公告)号：EP0852816B1

公开(公告)日：2002-06-19

申请号：EP96942999.2

申请日：1996-09-13

Applicant: Osram Opto Semiconductors GmbH & Co. OHG

Inventor： ARNDT, Karlheinz ,  BRUNNER, Herbert ,  SCHELLHORN, Franz ,  WAITL, Günther

IPC: H01L31/0232 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/024 ,  H01L33/60 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: In a radiation-emitting and/or receiving semiconductor component, a radiation-emitting and/or receiving semiconductor chip (1) is secured on a chip carrier (2) in a conductor frame. The chip carrier (2) forms a trough (4) in the area in which the semiconductor chip (1) is secured. The inner surface (5) of the trough (4) is designed to form a reflector for the radiation emitted and/or received by the semiconductor chip (1).