公开(公告)号：US09393645B2

公开(公告)日：2016-07-19

申请号：US13700294

申请日：2011-07-28

Applicant: Takuto Yamaguchi ,  Masahide Okamoto ,  Osamu Ikeda ,  Hiromitsu Kuroda ,  Kazuma Kuroki ,  Shohei Hata ,  Yuichi Oda

Inventor： Takuto Yamaguchi ,  Masahide Okamoto ,  Osamu Ikeda ,  Hiromitsu Kuroda ,  Kazuma Kuroki ,  Shohei Hata ,  Yuichi Oda

IPC: B21B3/00 ,  B23K35/00 ,  B23K35/02 ,  B23K1/00 ,  B23K35/28 ,  B23K35/30 ,  B23K35/38 ,  B32B15/01 ,  C22C5/02 ,  C22C9/00 ,  C22F1/00 ,  C22F1/04 ,  C22F1/08 ,  C22F1/16 ,  H01L21/50 ,  H01L23/06 ,  H01L23/10 ,  H01L23/373 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31

CPC classification number: B23K35/0238 ,  B21B3/00 ,  B23K1/0016 ,  B23K35/282 ,  B23K35/286 ,  B23K35/302 ,  B23K35/38 ,  B23K35/383 ,  B23K2101/40 ,  B32B15/017 ,  B32B15/018 ,  C22C5/02 ,  C22C9/00 ,  C22F1/00 ,  C22F1/04 ,  C22F1/08 ,  C22F1/165 ,  H01L21/50 ,  H01L23/06 ,  H01L23/10 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/2784 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2224/8382 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/013 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12792 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/83205

Abstract: The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Abstract translation: 所公开的连接材料，其制造方法和接合结构的制造方法利用无铅材料，并确保半导体元件与框架或基板之间或者金属板与另一金属板之间的接合部的高可靠性。 对于半导体元件和框架或基板之间的接合，通过使用作为连接材料的层叠材料，其包含Zn基金属层（101），其两侧上的Al基金属层（102a，102b）和X- 即使在富含氧的环境下，Al基金属层（102a，102b）外侧的金属基金属层（103a，103b）（X = Cu，Au，Ag或Sn），表面的X系金属 层保护Zn和Al免于氧化，直到所述接合材料熔化，保持所述接合材料作为焊料的润湿性和粘合性，并确保接合部的高可靠性。

公开(公告)号：US20130274002A1

公开(公告)日：2013-10-17

申请号：US13851871

申请日：2013-03-27

Applicant: Osamu Ikeda

Inventor： Osamu Ikeda

IPC: A63F13/12

CPC classification number: A63F13/85 ,  A63F13/12 ,  A63F13/75 ,  A63F2300/575

Abstract: One object is to provide a game system that can technically restrain real money trade. In accordance with one aspect, a game system according to an embodiment of the present invention includes: a bid data generating unit configured to generate bid data including game medium information related to a bid game medium and not including player specifying information that specifies a bidder player; and a second display control unit configured to allow a bid screen generated based on bid data to be displayed in the game being played by an exhibitor player.

Abstract translation: 一个目标是提供一个可以在技术上限制实际货币交易的游戏系统。 根据一个方面，根据本发明的实施例的游戏系统包括：投标数据生成单元，被配置为生成包括与投标游戏介质相关的游戏介质信息的投标数据，并且不包括指定投标人的玩家指定信息 ; 以及第二显示控制单元，被配置为允许在由参展者播放的游戏中显示基于投标数据生成的投标屏幕。

公开(公告)号：US20130256390A1

公开(公告)日：2013-10-03

申请号：US13700294

申请日：2011-07-28

Applicant: Takuto Yamaguchi ,  Masahide Okamoto ,  Osamu Ikeda ,  Hiromitsu Kuroda ,  Kazuma Kuroki ,  Shohei Hata ,  Yuichi Oda

Inventor： Takuto Yamaguchi ,  Masahide Okamoto ,  Osamu Ikeda ,  Hiromitsu Kuroda ,  Kazuma Kuroki ,  Shohei Hata ,  Yuichi Oda

IPC: B23K35/02 ,  B21B3/00

CPC classification number: B23K35/0238 ,  B21B3/00 ,  B23K1/0016 ,  B23K35/282 ,  B23K35/286 ,  B23K35/302 ,  B23K35/38 ,  B23K35/383 ,  B23K2101/40 ,  B32B15/017 ,  B32B15/018 ,  C22C5/02 ,  C22C9/00 ,  C22F1/00 ,  C22F1/04 ,  C22F1/08 ,  C22F1/165 ,  H01L21/50 ,  H01L23/06 ,  H01L23/10 ,  H01L23/3107 ,  H01L23/3735 ,  H01L23/49513 ,  H01L23/49582 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/2784 ,  H01L2224/29101 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/838 ,  H01L2224/8382 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/013 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12792 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/83205

Abstract: The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Abstract translation: 所公开的连接材料，其制造方法和接合结构的制造方法利用无铅材料，并确保半导体元件与框架或基板之间，或金属板与另一金属板之间的接合部的高可靠性。 对于半导体元件和框架或基板之间的接合，通过使用作为连接材料的层叠材料，其包含Zn基金属层（101），其两侧上的Al基金属层（102a，102b）和X- 即使在富含氧的环境下，Al基金属层（102a，102b）外侧的金属基金属层（103a，103b）（X = Cu，Au，Ag或Sn），表面的X系金属 层保护Zn和Al免于氧化，直到所述接合材料熔化，保持所述接合材料作为焊料的润湿性和粘合性，并确保接合部的高可靠性。

公开(公告)号：US20120105700A1

公开(公告)日：2012-05-03

申请号：US13243535

申请日：2011-09-23

Applicant: MASAHIRO JUEN ,  Kenji Toyoda ,  Osamu Ikeda ,  Hisato Ide

Inventor： MASAHIRO JUEN ,  Kenji Toyoda ,  Osamu Ikeda ,  Hisato Ide

IPC: H04N5/222 ,  G09G5/00 ,  G06F3/041

CPC classification number: G06F3/033 ,  G06F3/04845 ,  G06T1/00 ,  H04N1/00352 ,  H04N1/00397 ,  H04N1/00411 ,  H04N2101/00

Abstract: An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection.

Abstract translation: 操作具有用于显示操作画面的显示单元的图像处理设备，显示与多个图像处理功能对应的控制标记（例如，图标），以在外部显示设备上显示操作画面。 操作者通过操作诸如设备的触摸屏或遥控器的输入设备来指示所需的一个标记的位置来选择外部显示设备上所示的一个标记。 因此，操作者能够快速，可靠地选择要执行的图像处理功能，而不需要在进行选择时在显示单元上观看操作画面。

公开(公告)号：US20120098134A1

公开(公告)日：2012-04-26

申请号：US13382633

申请日：2010-08-30

Applicant: Masahide Okamoto ,  Osamu Ikeda ,  Yuki Murasato

Inventor： Masahide Okamoto ,  Osamu Ikeda ,  Yuki Murasato

IPC: H01L23/532 ,  B23K20/12 ,  B23P11/00 ,  H01L21/50 ,  B32B15/01

CPC classification number: C22C18/04 ,  B22F2998/00 ,  B23K1/0016 ,  B23K2101/42 ,  B32B15/017 ,  C22C21/00 ,  C22C21/06 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29147 ,  H01L2224/29211 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29347 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49826 ,  Y10T428/12736 ,  B22F7/062 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01013 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01014 ,  H01L2924/01083 ,  H01L2924/01031 ,  H01L2924/01082 ,  H01L2924/01049 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

Abstract: When connecting with a conventional Zn/Al/Zn cladding material, thickness of a connecting part needs to be less than double an existing high-lead solder (about 100 μm) in order to make heat resistance in the connecting part at least equivalent to a level of the existing solder. Moreover, thickness of an Al layer needs to make as thick as possible in order to fully exhibit stress relaxation performance of the Al layer.Provided is a semiconductor device including a semiconductor element, a frame, and a connecting part which connects the semiconductor element and the frame to each other, in which an interface between the connecting part and the semiconductor element and an interface between the connecting part and the frame respectively have the area of Al oxide film which is more than 0% and less than 5% of entire area of the respective interfaces.

Abstract translation: 当与常规的Zn / Al / Zn包层材料连接时，连接部件的厚度需要小于现有的高铅焊料（约100μm）的两倍，以便使连接部件中的耐热性至少等于 现有焊料的水平。 此外，为了充分发挥Al层的应力松弛性，需要使Al层的厚度尽可能地厚。 提供一种半导体器件，包括半导体元件，框架和将半导体元件和框架彼此连接的连接部分，其中连接部分和半导体元件之间的界面以及连接部分和半导体元件之间的界面 框分别具有比各界面的整个面积大于0％且小于5％的Al氧化物膜的面积。

公开(公告)号：US20100224926A1

公开(公告)日：2010-09-09

申请号：US12563287

申请日：2009-09-21

Applicant: Masanori HATAKEYAMA ,  Osamu Ikeda

Inventor： Masanori HATAKEYAMA ,  Osamu Ikeda

IPC: H01L27/112

CPC classification number: H01L27/11519 ,  H01L27/11521 ,  H01L27/11524

Abstract: A plurality of NAND cells are arranged in a cell array. In each of the NAND cells, a pair of selection gate transistors is connected in series to a plurality of memory cell transistors. An inter-gate connection trench is formed in an insulating film between layers of stacked gates of the selection gate transistors. The stacked gates are electrically connected to each other. At an end part of the cell array in the row direction, an STI area is formed, and dummy NAND cells are formed at an end part in the row direction. A dummy selection gate transistor is connected in series to a plurality of dummy memory cell transistors. No inter-gate connection trench is present in an insulating film between layers of stacked gates of the dummy selection gate transistor, and the stacked gates of the dummy selection gate transistor are not electrically connected to each other.

Abstract translation: 多个NAND单元被布置在单元阵列中。 在每个NAND单元中，一对选择栅极晶体管串联连接到多个存储单元晶体管。 在选择栅极晶体管的堆叠栅极的层之间的绝缘膜中形成栅极间连接沟槽。 堆叠的栅极彼此电连接。 在行方向的单元阵列的端部，形成STI区域，并且在行方向的端部形成虚拟NAND单元。 虚设选择栅极晶体管与多个虚设存储单元晶体管串联连接。 在虚拟选择栅极晶体管的堆叠栅极的层之间的绝缘膜中不存在栅极间连接沟槽，并且虚设选择栅极晶体管的堆叠栅极彼此不电连接。

公开(公告)号：US20080240672A1

公开(公告)日：2008-10-02

申请号：US12153980

申请日：2008-05-28

Applicant: Osamu Ikeda ,  Norikazu Yokonuma

Inventor： Osamu Ikeda ,  Norikazu Yokonuma

IPC: H04N5/93

CPC classification number: G11B27/034 ,  G11B27/102 ,  G11B27/34 ,  G11B2220/2525 ,  H04N5/772 ,  H04N5/85 ,  H04N5/9261

Abstract: An image reproduction apparatus sequences and reproduces multiple moving pictures while eliminating linking and editing operations. A list display unit lists on a screen thumbnails corresponding to each of multiple moving pictures recorded on recording media. A selection unit selects and orders, according to selection operations, multiple thumbnails displayed by the list display unit. Based on the multiple thumbnails selected and ordered by the selection unit, a reproduction unit reproduces the moving pictures corresponding to each of the thumbnails by reproducing them in that order. A display displays moving pictures sequenced in order by the reproduction unit on a screen.

Abstract translation: 图像再现装置在消除链接和编辑操作的同时对多个运动图像进行排序和再现。 列表显示单元列出对应于记录在记录介质上的多个运动图像中的每一个的屏幕缩略图。 选择单元根据选择操作选择并排序由列表显示单元显示的多个缩略图。 基于由选择单元选择和排序的多个缩略图，再现单元通过以该顺序再现它们来再现对应于每个缩略图的运动图像。 显示器通过再现单元在屏幕上显示顺序排列的运动图像。

公开(公告)号：US20080206590A1

公开(公告)日：2008-08-28

申请号：US11943632

申请日：2007-11-21

Applicant: Osamu Ikeda ,  Masahide Okamoto

Inventor： Osamu Ikeda ,  Masahide Okamoto

IPC: B32B15/01 ,  B32B15/00 ,  B23K20/04

CPC classification number: H01L23/49582 ,  B23K20/02 ,  B23K20/04 ,  B23K35/0238 ,  B32B15/017 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/12736 ,  Y10T428/31678 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt. % or a Zn content of the Zn series alloy layer is 90 to 100 wt. %. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, when an Al series alloy layer is left after the connection, since the soft Al functions as a stress buffer material, the high connection reliability can be achieved.

Abstract translation: 在本发明的连接材料中，在Al系合金层的最表面上形成Zn系合金层。 特别地，在连接材料中，Al系合金层的Al含量为99〜100重量％。 Zn系合金层的％或Zn含量为90〜100重量％。 ％。 通过使用该连接材料，可以抑制在连接时在连接材料的表面上形成Al氧化膜，并且可以获得优选的用Zn-Al合金不能获得的湿度。 此外，当在连接之后留下Al系合金层时，由于软Al用作应力缓冲材料，所以可以实现高连接可靠性。

公开(公告)号：US07274103B2

公开(公告)日：2007-09-25

申请号：US11272063

申请日：2005-11-14

Applicant: Osamu Ikeda ,  Masahide Okamoto ,  Yukihiro Satou

Inventor： Osamu Ikeda ,  Masahide Okamoto ,  Yukihiro Satou

IPC: H01L23/52

CPC classification number: H05K3/3463 ,  B23K35/0238 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  H01L23/3128 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32507 ,  H01L2224/371 ,  H01L2224/3754 ,  H01L2224/40225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/8381 ,  H01L2224/8382 ,  H01L2224/83825 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10329 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2924/01049 ,  H01L2924/3512 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: In a semiconductor module connecting a semiconductor element and a passive element to a printed board, each of connection portions between the semiconductor element and the printed board and between the passive element and the printed board includes a metal with a melting point of 260° C. or higher and an intermetallic compound with a melting point of 260° C. or higher. Specifically, by connecting them using Pb-free solder with a melting point of 260° C. or lower, the printed board capable of lowering in cost, lightening, and reducing back height can be applied to a module board.

Abstract translation: 在将半导体元件和无源元件连接到印刷电路板的半导体模块中，半导体元件和印刷电路板之间以及无源元件和印刷电路板之间的每个连接部分包括熔点为260℃的金属。 以上，熔点260℃以上的金属间化合物。 具体来说，通过使用熔点为260℃以下的无铅焊料进行连接，能够将成本降低，降低后退高度的印刷电路板应用于模块基板。

公开(公告)号：US07154173B2

公开(公告)日：2006-12-26

申请号：US10855972

申请日：2004-05-28

Applicant: Osamu Ikeda ,  Toshiyuki Ohkoda

Inventor： Osamu Ikeda ,  Toshiyuki Ohkoda

IPC: H01L23/10 ,  H01L23/12

CPC classification number: B81B7/007 ,  B81C2203/0118 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14806 ,  H01L2924/16235 ,  Y10S257/924

Abstract: This invention miniaturizes a package of a semiconductor device and simplifies a manufacturing procedure to reduce a manufacturing cost. A semiconductor wafer formed of a plurality of semiconductor chips formed with MEMS devices and wiring thereof on front surface thereof and a cap arrayed wafer disposed with a plurality of sealing caps are attached to seal the MEMS devices in cavities between them. Then, a plurality of via-holes is provided penetrating through the semiconductor wafer to form embedded electrodes therein, and bump electrodes are formed thereon. After this procedure, this structure is cut along scribe lines to be divided into each of packages.

Abstract translation: 本发明使半导体器件的封装小型化并且简化制造程序以降低制造成本。 由形成有MEMS器件的多个半导体芯片及其前表面上的布线形成的半导体晶片和设置有多个密封盖的盖阵列晶片被连接以将MEMS器件密封在它们之间的空腔中。 然后，穿过半导体晶片提供多个通孔，以在其中形成嵌入电极，并在其上形成凸起电极。 在该过程之后，沿着划线切割该结构以分成每个包装。