公开(公告)号：EP3345075A1

公开(公告)日：2018-07-11

申请号：EP16760851.2

申请日：2016-08-09

Applicant: Qualcomm Incorporated

Inventor： RAHIM, Emil ,  SAEIDI, Mehdi ,  MITTAL, Arpit ,  MITTAL, Rajat

IPC: G06F3/01 ,  G06F1/20 ,  G06F1/16

CPC classification number: G06F1/163 ,  G02B27/0176 ,  G06F1/203 ,  G06F3/011 ,  H05K7/20127 ,  H05K7/20509

Abstract: Systems and methods relate to thermal management of electronic headsets, such as virtual reality headsets. An electronic headset includes a body which can hold a processing system. A heat spreader is attached to the body, wherein the heat spreader includes a chimney. The chimney is designed to dissipate heat generated by the processing system. The heat spreader can be controlled to extend the chimney based on the heat perceived on external surfaces of the electronic headset which can come in contact with a user's skin. The chimney includes an air gap and provides a passive cooling system.

公开(公告)号：EP2956843A1

公开(公告)日：2015-12-23

申请号：EP14711329.4

申请日：2014-02-12

Applicant: Qualcomm Incorporated

Inventor： MITTAL, Arpit ,  MACIOCCI, Giuliano ,  TUNMER, Michael L. ,  MABBUTT, Paul

IPC: G06F3/01 ,  G06T19/00

CPC classification number: G06F3/011 ,  G02B27/0093 ,  G02B27/017 ,  G02B2027/0138 ,  G02B2027/014 ,  G02B2027/0178 ,  G02B2027/0187 ,  G06F3/017 ,  G06F3/0304 ,  G06F3/04842 ,  G06T19/006

Abstract: Methods, systems, computer-readable media, and apparatuses for selecting an Augmented Reality (AR) object on a head mounted device (HMD) are presented. In some embodiments, an HMD may define a Region-of-Interest (ROI) based on a gesture formed by at least one hand of a user. Subsequently the HMD may display to the user a shape on the HMD. In at least one arrangement, the shape outlines the ROI. Additionally, the HMD may display to the user a plurality of AR objects, each of the plurality of AR objects being associated with a target inside the ROI. Furthermore, the HMD may reduce the size of the ROI based on a first movement of the at least one hand of the user to form a reduced-sized ROI. In at least one arrangement, the reduced-sized ROI is used to select a specific AR object from the plurality of AR objects.

公开(公告)号：EP3345075B1

公开(公告)日：2019-07-03

申请号：EP16760851.2

申请日：2016-08-09

Applicant: Qualcomm Incorporated

Inventor： RAHIM, Emil ,  SAEIDI, Mehdi ,  MITTAL, Arpit ,  MITTAL, Rajat

IPC: G06F3/01 ,  G06F1/20 ,  G06F1/16

公开(公告)号：EP3353624A1

公开(公告)日：2018-08-01

申请号：EP16770130.9

申请日：2016-09-07

Applicant: Qualcomm Incorporated

Inventor： MITTAL, Arpit ,  SAEIDI, Mehdi ,  MAHMOUDI, Farsheed

IPC: G06F1/32

CPC classification number: G06F1/206 ,  G05B15/02 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/172

Abstract: A method for temperature mitigation includes receiving a signal from a temperature sensor that is disposed within a computing device. A processor chip within the computing device produces heat. The signal from the temperature sensor is converted to temperature data. The method further includes processing the temperature data to generate an estimate of a temperature of an external surface of the device. The processing includes applying a low pass filter to the temperature data, applying an amplitude attenuation to the temperature data, and applying a delay to the temperature data. The method further includes reducing an operating parameter of the processor chip, such as operating frequency, in response to the estimated temperature of the external surface of the device.

公开(公告)号：EP3105785B1

公开(公告)日：2017-11-22

申请号：EP15706331.4

申请日：2015-02-09

Applicant: Qualcomm Incorporated

Inventor： MITTAL, Arpit ,  LOKE, Alvin Leng Sun ,  SAEIDI, Mehdi ,  DRENNAN, Patrick

IPC: H01L23/367 ,  H01L49/02 ,  H01L23/522

CPC classification number: H05K1/0204 ,  H01C1/01 ,  H01C1/08 ,  H01C1/084 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/5228 ,  H01L28/20 ,  H01L28/24 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.

公开(公告)号：EP3105785A1

公开(公告)日：2016-12-21

申请号：EP15706331.4

申请日：2015-02-09

Applicant: Qualcomm Incorporated

Inventor： MITTAL, Arpit ,  LOKE, Alvin Leng Sun ,  SAEIDI, Mehdi ,  DRENNAN, Patrick

IPC: H01L23/367 ,  H01L49/02 ,  H01L23/522

CPC classification number: H05K1/0204 ,  H01C1/01 ,  H01C1/08 ,  H01C1/084 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/5228 ,  H01L28/20 ,  H01L28/24 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit.

Abstract translation: 金属散热片用于散热集成电路电阻。 电阻器可以使用线路层的前端，例如氮化钛层形成。 金属区域（例如，在第一金属层中）位于电阻器上方以形成散热器。 连接到金属区域的热柱的区域也位于电阻器上方。 金属区域可以连接到集成电路的基板，以提供出集成电路外的低阻抗热路径。

公开(公告)号：EP3044651A1

公开(公告)日：2016-07-20

申请号：EP14784135.7

申请日：2014-09-12

Applicant: Qualcomm Incorporated

Inventor： MITTAL, Arpit

IPC: G06F3/01 ,  G06K9/00 ,  G06F3/00

CPC classification number: G06F3/017 ,  G06F3/005 ,  G06K9/00355

Abstract: Methods and apparatuses of the present disclosure are presented for recognizing a gesture of a gesture object in a plurality of recorded data objects, with the recorded data objects being recorded over time. In some embodiments, a method includes computing at least one set of gesture angles using the plurality of recorded data objects, wherein each of the gesture angles in the at least one set comprises an angle measurement between two positions of the gesture object, the two positions recorded in successive data objects in the plurality of recorded data objects, and recognizing the gesture based on the at least one set of gesture angles. In some embodiments, the method includes recognizing the gesture is based further on comparing the at least one set of gesture angles to a gesture model.