Abstract:
A method of manufacturing a semiconductor device includes forming a first plurality of recessed regions in a substrate, the substrate having a protruded active region between the first plurality of recessed regions and the protruded active region having an upper surface and a sidewall, forming a device isolation film in the first plurality of recessed regions, the device isolation film exposing the upper surface and an upper portion of the sidewall of the protruded active region, and performing a first plasma treatment on the exposed surface of the protruded active region, wherein the plasma treatment is performed using a plasma gas containing at least one of an inert gas and a hydrogen gas in a temperature of less than or equal to about 700° C.
Abstract:
An organometallic compound represented by Formula 1: wherein, in Formula 1, M, A11 to A13, L11, R11 to R15, X11, Y11 to Y17, b13 to b15, and n11 are the same as described in the specification.
Abstract:
An organometallic compound represented by Formula 1: wherein in Formula 1, groups and variables are the same as described in the specification.
Abstract:
An organometallic compound represented by Formula 1: M(L1)n1(L2)n2 Formula 1 wherein in Formula 1, M, L1, L2, n1, and n2 are the same as described in the specification.
Abstract:
A headset includes a first speaker; a second speaker; a connector connecting the first speaker and the second speaker; and a switch configured to generate different electrical signals according to states in which the first speaker and the second speaker move close to and away from each other, wherein the electrical signals are used to selectively control an output of contents that is being output from the headset.
Abstract:
A semiconductor device may include a substrate including, lower bit line structures from a first region to a second region adjacent to the first region and extending in a second direction perpendicular to the first direction, a second gate structure on the second region of the substrate to be spaced apart from the lower bit line structure, a first offset spacer on a first sidewall corresponding to an end of each of the lower bit line structures in the second direction, a second offset spacer and a first spacer sequentially arranged on a sidewall of the second gate structure, an insulation liner layer at least disposed a surface of the first offset spacer, and a capping pattern covering the lower bit line structures and an upper portion of the second gate structure. The first offset spacer and the insulation liner layer include silicon nitride.
Abstract:
Provided is an organometallic compound represented by Formula 1, an organic light-emitting device including the same, and an electronic apparatus including the organic light-emitting device.
M(L1)n1(L2)n2
M, L1, L2, n1, and n2 in Formula 1 are the same as described in the present specification.
Abstract:
A base station device includes a communication circuit configured to receive a first signal from an external base station device and transmit a second signal to a user equipment, by using a plurality of antennas, and a processor configured to obtain resource allocation information of the external base station device based on the first signal, identify whether an interference cell occurs, and generate the second signal when the interference cell occurs, the second information including resource allocation information of the interference cell.