LIGHT-EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:EP3869557A1

    公开(公告)日:2021-08-25

    申请号:EP19873767.8

    申请日:2019-10-17

    Inventor: LEE, Chung Hoon

    Abstract: A light emitting device and a method for fabrication the light emitting device are provided. The method for manufacturing a light emitting device including forming a plurality of first light emitting cells and a plurality of second light emitting cells on one surface of a first substrate, providing a second substrate to face the first and second light emitting cells, selectively bonding the first light emitting cells onto the second substrate, and cutting the second substrate to a mounting unit including at least two first light emitting cells.

    METHOD FOR TRANSFERRING LIGHT-EMITTING DIODES FOR DISPLAY, AND DISPLAY DEVICE

    公开(公告)号:EP3926680A1

    公开(公告)日:2021-12-22

    申请号:EP20755148.2

    申请日:2020-02-13

    Inventor: LEE, Chung Hoon

    Abstract: In a method for transferring light-emitting diodes according to an embodiment, a wafer, having a substrate, semiconductor layers disposed on the substrate and bump pads disposed on the semiconductor layers and aligned in a plurality of light-emitting diode regions, is prepared, the wafer is divided into a plurality of light-emitting diodes which maintain an adjacent positional relationship, the light-emitting diodes are attached to transfer tape on a support substrate such that the positional relationship of the light-emitting diodes is maintained and the substrate side faces the transfer tape, a circuit board on which pads are aligned is prepared, the support substrate and circuit board are brought into close contact with each other such that the bump pads on some light-emitting diodes among the plurality of light-emitting diodes come into contact with the pads on the circuit board, the some light-emitting diodes are bonded to the pads by applying heat to the bump pads and pads, and the light-emitting diodes bonded to the pads are separated from the transfer tape.

    DISPLAY DEVICE
    26.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:EP3879574A1

    公开(公告)日:2021-09-15

    申请号:EP19881294.3

    申请日:2019-11-07

    Inventor: LEE, Chung Hoon

    Abstract: A display device is provided. The display device comprises: a flexible substrate; a plurality of light emitting diodes arranged on the substrate and spaced apart from each other; and a light shielding layer filled between the light emitting diodes and partially covering each of the light emitting diodes to define individual light emission surfaces, wherein the distances between the light emission surfaces are equal to each other.

    LIGHT-EMITTING DIODE UNIT FOR DISPLAY COMPRISING PLURALITY OF PIXELS AND DISPLAY DEVICE HAVING SAME

    公开(公告)号:EP3709364A1

    公开(公告)日:2020-09-16

    申请号:EP17931562.7

    申请日:2017-11-08

    Abstract: A light-emitting diode unit for a display, according to one embodiment, comprises a plurality of pixels, each pixel including: a first light-emitting cell, a second light-emitting cell, and a third light-emitting cell respectively including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; pads electrically connected to the first through third light-emitting cells so as to independently drive the first through third light-emitting cells; a second wavelength converter for converting a wavelength of light emitted from the second light-emitting cell; and a third wavelength converter for converting a wavelength of light emitted from the third light-emitting cell, wherein the third wavelength converter converts a wavelength of light to a longer wavelength than the second wavelength converter, the second light-emitting cell has a larger area than the first light-emitting cell, and the third light-emitting cell has a larger area than the second light-emitting cell. It is possible to easily mount the light-emitting cells on the circuit board by using the light-emitting diode unit for a display, comprising the plurality of pixels.

    ADHESIVE-TYPE INSECT TRAP
    28.
    发明公开

    公开(公告)号:EP3566575A1

    公开(公告)日:2019-11-13

    申请号:EP18738570.3

    申请日:2018-01-08

    Abstract: An adhesive-type insect trap is provided. One embodiment of the present invention provides an adhesive-type insect trap comprising: a body having a hole for insertion of an adhesive sheet; a light source mounting unit disposed on the body; and a cover which is detachably mounted on the body and has a through-hole in at least a part thereof, wherein the adhesive sheet comprises a sticky substance and a sheet, the body comprises a guide unit by which the adhesive sheet is guided, and the cover comprises a light refraction unit therein or on a surface thereof.

    ADHESIVE-TYPE INSECT TRAP
    29.
    发明公开

    公开(公告)号:EP3566574A1

    公开(公告)日:2019-11-13

    申请号:EP18738568.7

    申请日:2018-01-05

    Abstract: The present invention provides an adhesive-type insect trap. The adhesive-type insect trap according to one embodiment comprises: a main body having an adhesive sheet insertion hole; a light source mounting unit disposed on the main body; and a cover which is detachably mounted on the main body and has a through-hole in at least a part thereof, wherein the adhesive sheet comprises a sticky substance and a sheet, the main body comprises a guide unit by which the adhesive sheet is guided, and the main body may further comprise an adhesive sheet support unit for supporting the adhesive sheet.

    MULTI-WAVELENGTH LIGHT EMITTING ELEMENT AND METHOD FOR MANUFACTURING SAME

    公开(公告)号:EP4113606A1

    公开(公告)日:2023-01-04

    申请号:EP21760138.4

    申请日:2021-02-25

    Abstract: Alight emitting element according to an embodiment comprises: a short-wavelength light emitting unit; a long-wavelength light emitting unit; and a coupling layer which couples the short-wavelength light emitting unit to the long-wavelength light emitting unit, wherein each of the short-wavelength light emitting unit and the long-wavelength light emitting unit comprises a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, the active layer of the long-wavelength light emitting unit contains more indium (In) than that of the short-wavelength light emitting unit, and the short-wavelength light emitting unit emits light having a wavelength shorter than that of the long-wavelength light emitting unit.

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