公开(公告)号：JP2003309385A

公开(公告)日：2003-10-31

申请号：JP2002113236

申请日：2002-04-16

Applicant: Sony Corp ,  ソニー株式会社

Inventor： ORIHASHI MASAKI ,  KAYAMA TAKASHI ,  OGASAWARA JUNICHI ,  OKAYAMA KATSUMI ,  KOBAYASHI KAORU ,  KIMURA KEIICHI

IPC: H05K7/20 ,  H01L23/34 ,  H01L23/36

Abstract: PROBLEM TO BE SOLVED: To provide a heat radiation device and an electronic equipment, capable of efficiency radiating the heat generated from a heating element by a block.
SOLUTION: A heat radiating device 30, which is arranged in a casing 20 of an electronic equipment 10, is the device for radiating heat generated from a heating element in the casing 20. The device is provided with a sheet-like heat conductor 35 which is thermally in tight arranged to the heating element in the casing 20; and a graphite block 37 mounted in the casing 20 and thermally connected to the heat conductor 35, which radiates heat of the heating element.
COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供一种散热装置和电子设备，其能够有效地散发由加热元件产生的热量。 解决方案：布置在电子设备10的壳体20中的散热装置30是用于辐射从壳体20中的加热元件产生的热量的装置。该装置设置有片状热 导体35，其热密封地布置到壳体20中的加热元件; 以及石墨块37，其安装在壳体20中并热连接到热导体35，其辐射加热元件的热​​量。 版权所有（C）2004，JPO

公开(公告)号：JP2003154467A

公开(公告)日：2003-05-27

申请号：JP2001353846

申请日：2001-11-19

Applicant: SONY CORP

Inventor： KAYAMA TAKASHI ,  SEKINE JUNICHI ,  KOBAYASHI HIROTAKA

IPC: B23K20/10 ,  B23K101/38 ,  B23K103/08 ,  H01M2/30 ,  H05K1/18

Abstract: PROBLEM TO BE SOLVED: To provide an electric connection device which can omit any soldering work, reduce the size thereof, and reliably and electrically connect take-out electrodes of a battery to a conductive part of a circuit board. SOLUTION: An ultrasonic oscillation providing unit 600 is formed on an end face 610 of a horn 440 surrounded by a first side surface part 701 and a second side surface part 702 facing each other, and a third side surface part 703 and a fourth side surface part 704 facing each other which are formed across the first side surface part 701 and the second side surface part 702. The ultrasonic oscillation providing unit 600 has a plurality of projection parts 630 for ultrasonic welding which are arranged on an end face part 610 at equal intervals. The plurality of projection parts 630 for ultrasonic welding adjacent to the third side surface part 703 and the fourth side surface part 704 in the plurality of projection parts 630 for ultrasonic welding are arranged along the line forming an acute angle to the ultrasonic transverse oscillation given from the horn 440 to the take-out electrodes 50 and 52.

公开(公告)号：JP2003123413A

公开(公告)日：2003-04-25

申请号：JP2001310237

申请日：2001-10-05

Applicant: SONY CORP ,  NIPPON KEIKI WORKS

Inventor： KAYAMA TAKASHI ,  SHINOSAWA HIDETOSHI

IPC: G11B21/02 ,  H02K3/26 ,  H02K33/18

Abstract: PROBLEM TO BE SOLVED: To provide a head actuator and a magnetic recording and reproducing device in which the size and thickness of the head and arm are reduced and rotational torque is made large when a magnetic head and an arm are rotated with a prescribed angle. SOLUTION: A driving coil 60 is constituted of by laminating a plurality of wiring pattern layers L1 to L4. A plurality of wiring sections 70 to 73 are formed on each wiring pattern layer. Each wiring section is provided with a plurality of driving wiring patterns 110 which generate rotary driving force for a rotor 40 by magnetic interactions between first and second magnetic sections M1 and M2 when electrically energized and a connection wiring pattern 120 which electrically connects the sections 110. The current direction in the sections 110 of the sections 70 to 73 in each wiring pattern layer and the current direction of an adjacent driving wiring pattern 110 are made identical.

公开(公告)号：JP2003079124A

公开(公告)日：2003-03-14

申请号：JP2001269208

申请日：2001-09-05

Applicant: Nippon Keiki Works Ltd ,  Sony Corp ,  ソニー株式会社 ,  株式会社日本計器製作所

Inventor： KAYAMA TAKASHI ,  KATAOKA YASUHIRO ,  SHINOSAWA HIDETOSHI

IPC: G11B21/02 ,  H02K3/26 ,  H02K33/18

Abstract: PROBLEM TO BE SOLVED: To provide a head actuator and a magnetic recording/reproducing apparatus whose size and thickness can be reduced when a magnetic head and an arm are turned at a prescribed angle, whose rotation torque can be increased, and which have simple structures.
SOLUTION: A wiring pattern 80 of a laminate coil 60 has first drive wiring pattern portions 110 facing N-poles of a drive magnet and second drive wiring pattern portions 120 facing the S-poles of the drive magnet. The first drive wiring pattern portions 110 and the second drive wiring pattern portions 120 are formed in radial directions of a rotor 40. Current flow directions in the first drive wiring patterns 110 are opposite to the current flow directions in the second drive wiring patterns 120.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：提供一种磁头致动器和磁记录/再现装置，当磁头和臂以规定的角度转动时，可以减小其尺寸和厚度，其旋转扭矩可以增加，并且具有简单的结构 。 解决方案：层压线圈60的布线图案80具有面向驱动磁体的N极的第一驱动布线图形部分110和面向驱动磁体的S极的第二驱动布线图形部分120。 第一驱动布线图案部分110和第二驱动布线图案部分120沿转子40的径向方向形成。第一驱动布线图案110中的电流流动方向与第二驱动布线图案120中的当前流动方向相反。

公开(公告)号：JP2003017246A

公开(公告)日：2003-01-17

申请号：JP2001195124

申请日：2001-06-27

Applicant: Sony Corp ,  ソニー株式会社

Inventor： KAYAMA TAKASHI ,  OSAKO JUNICHI ,  AMANO SHUNJI

IPC: H05B33/06 ,  G09F9/00 ,  G09F9/30 ,  G09F9/40 ,  H01L27/32 ,  H01L51/50 ,  H05B33/14 ,  H05B33/26

Abstract: PROBLEM TO BE SOLVED: To provide an electrical connection device in which a second substrate can be simply removed from a first substrate and repairing can be made and cost reduction can be achieved without using ACF in the case in which the second substrate such as a flexible printed circuit board is electrically connected to the organic electroluminescent element formed on the first substrate, and a display having the electrical connection device.
SOLUTION: This is an electrical connection devices 300, 301 in which a second substrate 50 is electrically connected to the organic electroluminescent element 80 formed on a first substrate 121, and comprises a first connection electrode part 200 which is made of a first Ni film 310 that is electrically connected to the electrode of the organic electroluminescent element and a first Au membrane 320 that is laminated on the first Ni film 310 and a second connection electrode part 201 which is made of a second Ni film 330 laminated on the first Au film 320 of the first connection electrode part 200 and a second Au film 340 that is laminated on the second Ni film 330 and is electrically connected to the second substrate 50.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：提供一种电连接装置，其中可以从第一基板简单地移除第二基板并且可以进行修理，并且可以在不使用ACF的情况下实现成本降低，其中第二基板例如柔性 印刷电路板电连接到形成在第一基板上的有机电致发光元件，以及具有电连接装置的显示器。 解决方案：这是一种电连接装置300,301，其中第二基板50电连接到形成在第一基板121上的有机电致发光元件80，并且包括由第一Ni膜310制成的第一连接电极部分200 电连接到有机电致发光元件的电极和层叠在第一Ni膜310上的第一Au膜320和由层叠在第一Au膜320上的第二Ni膜330制成的第二连接电极部201 并且层压在第二Ni膜330上并与第二基板50电连接的第二Au膜340。

公开(公告)号：JP2002367579A

公开(公告)日：2002-12-20

申请号：JP2001173023

申请日：2001-06-07

Applicant: Sony Corp ,  ソニー株式会社

Inventor： KAYAMA TAKASHI ,  OKAYASU YOSHISADA

IPC: H01M2/30 ,  H01M2/10

CPC classification number: Y02E60/12

Abstract: PROBLEM TO BE SOLVED: To provide a battery device and electronic equipment having the battery device, capable of enhancing electric reliability in the case where taking out electrodes of a battery body are directly electrically joined to electrodes of a board by ultrasonic bonding.
SOLUTION: This battery device has the battery body 34 arranged inside a case, taking out electrodes 50, 52 of a battery comprising the battery body 34; and the board 36 arranged inside the case. The taking out electrodes 50, 52 of the battery having a joining part for being directly electrically joined to electrodes 42, 44 of the board 36 by ultrasonic bonding, and the arranging distances of projecting parts 75 of a recessed and projecting part 73 of the joining part are made wider with approaching to the end part of a region 71 of the joining part from the center of the region 71 of the joining part.
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：提供具有电池装置的电池装置和电子设备，其能够通过超声波接合将取出电池主体的电极直接电连接到电路板的情况下提高电气可靠性。 解决方案：该电池装置具有布置在壳体内部的电池体34，取出包括电池体34的电池的电极50,52; 并且布置在壳体内的板36。 电池的取出电极50,52具有通过超声波接合与基板36的电极42,44直接电接合的接合部以及接合部的凹凸部92的突出部75的配置距离 从接合部的区域71的中心接近接合部的区域71的端部，使部分变宽。

公开(公告)号：JP2002313481A

公开(公告)日：2002-10-25

申请号：JP2001119779

申请日：2001-04-18

Applicant: SONY CORP ,  OMRON TATEISI ELECTRONICS CO

Inventor： KAYAMA TAKASHI ,  KATAOKA YASUHIRO ,  SEKIGUCHI TOSHIKAZU ,  TAKAMORI MEGUMI ,  UCHIDA TSUYOSHI ,  HENMI YUKINOBU

IPC: H01R13/52

Abstract: PROBLEM TO BE SOLVED: To provide an electrical connecting device capable of easily performing an electrical connection only by pushing, opening and connecting when electrically connecting to an external connection object part of equipment and preventing deterioration of electrical connection by preventing entering of dust and refuse by automatically closing an opening part when the connection object part is not electrically connected and electronic equipment having the electrical connecting device. SOLUTION: This device is provided with a main body 110 which is fixed within a casing 12 of equipment 10 corresponding to a position of the opening part 200 of the equipment 10 and is for electrically connecting the external connection object part, a shutter 101 for closing the opening part 200 so as to be openable/closable and opening the opening part 200 when inserting the external connection object part into the opening part 200 and an energizing member 330 for energizing the shutter 101 and closing the opening part 200 by the shutter 101 in a state of the external connection object part removed from the opening part 200.

公开(公告)号：JP2002184375A

公开(公告)日：2002-06-28

申请号：JP2000379154

申请日：2000-12-13

Applicant: SONY CORP

Inventor： KAYAMA TAKASHI ,  OKAYASU YOSHISADA ,  TOMURA KIYOSHI ,  AMANO SHUNJI ,  OSAKO JUNICHI

IPC: H01M2/10

Abstract: PROBLEM TO BE SOLVED: To provide a cell enabled to make the size small and thin and to reduce the cost, with improved reliability of electric connection, and to provide an electronic device using the cell. SOLUTION: The electronic device comprises a case 200, a cell body 34 arranged inside the case 200 having electrode taking out parts 50, 52, lands 42, 44 arranged inside the case 200 electrically connecting the electrode taking out parts 50, 52, and a solder part 200 arranged at an opening 300 which is formed to the electrode taking out parts 50, 52 electrically and mechanically connecting the electrode taking out part 50, 52 with the lands 42, 44.

公开(公告)号：JP2002169483A

公开(公告)日：2002-06-14

申请号：JP2000368664

申请日：2000-12-04

Applicant: SONY CORP

Inventor： OMI MOTOSUKE ,  KAYAMA TAKASHI ,  KOTAKE RYOTA ,  OZAKI YUJI ,  AMANO SHUNJI ,  OSAKO JUNICHI

IPC: H05B33/06 ,  G09F9/00 ,  G09F9/30 ,  G09F9/40 ,  H01L27/32 ,  H01L51/50 ,  H05B33/12 ,  H05B33/14

Abstract: PROBLEM TO BE SOLVED: To provide a display device, an electronic appliance and a method for manufacturing a display device such that the conductive connecting part of a flexible wiring board can be electrically surely connected to a conductive metal film on the substrate where an organic electroluminescent element is formed and that the above electric connection can be performed even in the vicinity of the organic electroluminescent element. SOLUTION: The device is equipped with an organic electroluminescent element formed on a first substrate 121, a conductive metal film 170 formed in the position on the first substrate 121 not overlapping with the organic electroluminescent element, a second substrate 50 having a plurality of holes and a conductive connecting part 220 in the surrounding part forming the holes, and a solder part 330. The solder part 330 is supplied into the holes of the second substrate 50 before the second substrate 50 is adhered to the first substrate 121 and is fused to electrically connect the conductive metal film 170 on the first substrate 121 to the conductive connecting part 220 of the second substrate 50 to electrically connect the organic electroluminescent element to the second substrate 50.

公开(公告)号：JP2002160932A

公开(公告)日：2002-06-04

申请号：JP2000351406

申请日：2000-11-17

Applicant: SONY CORP

Inventor： TAKASHIMA KOICHIRO ,  KAYAMA TAKASHI ,  OGASAWARA JUNICHI ,  ASAKI TAMAO ,  SAITO WATARU ,  KATAOKA YASUHIRO

IPC: G02F1/1333 ,  C03B33/023 ,  C03B33/033 ,  C03B33/07 ,  C03C19/00 ,  C03C21/00 ,  G09F9/30

Abstract: PROBLEM TO BE SOLVED: To provide a method of producing a glass plate which has high strength and is capable of reducing thickness, provide the glass substrate and provide an electronic device having the glass plate. SOLUTION: The method of producing the glass substrate 95 comprises the steps of a ST1 for cutting wherein the glass substrate 95 in a predetermined size is obtained by cutting a glass base member 80, a ST4 for finishing wherein a cut surface of the severed glass substrate 95 is finished and a ST5 for chemically strengthening wherein the finished glass substrate 95 is chemically strengthened.