Solid state fingerprint sensor packaging apparatus and method
    21.
    发明公开
    Solid state fingerprint sensor packaging apparatus and method 失效
    固态指纹传感器封装设备和方法

    公开(公告)号:EP0889521A2

    公开(公告)日:1999-01-07

    申请号:EP98305195.4

    申请日:1998-06-30

    CPC classification number: G06K9/00053

    Abstract: A planar, capacitive-type, rectangular, and multi-pixel fingerprint sensing array is mounted on the horizontal and generally rectangular top-surface of a dome that extends upward generally from the center of a horizontally disposed and generally rectangular silicon substrate member. The dome is formed by four upward extending and inclined, or tapered, side wall surfaces, at least one wall surface of which carries electrical circuit paths that electrically connected to the various circuit elements of the sensing array. A generally rectangular, encircling and wall-like card carrier assembly includes a generally horizontal upper-surface having a generally centered opening through which only the dome and sensing array project upward. The bottom-surface of the card carrier assembly is mounted to edge portions of the silicon substrate member in a manner to surround and protect all but the upward extending dome. A flexible membrane or laminate is sealed to the top-surface of the card carrier assembly to form a flexible surface over the sensing array. The card carrier assembly includes circuit path having an external portion and having an internal portion that connects to the wall-mounted internal electrical circuit paths, the external portion providing external connection to the internal sensing array.

    Abstract translation: 平面电容型,矩形和多像素指纹感测阵列安装在穹顶的水平且大致矩形的顶表面上,该顶表面大体上从水平设置的且通常为矩形的硅衬底构件的中心向上延伸。 圆顶由四个向上延伸且倾斜的或锥形的侧壁表面形成,其至少一个壁表面承载电连接到感测阵列的各个电路元件的电路径。 大致矩形的环绕壁状卡片组件包括大致水平的上表面,该上表面具有大致居中的开口,仅圆顶和感测阵列仅通过该开口向上突出。 卡载体组件的底表面以围绕并保护除向上延伸的圆顶以外的所有部分的方式安装到硅基底构件的边缘部分。 将柔性膜或层压件密封到卡载体组件的顶表面以在感测阵列上形成柔性表面。 卡载体组件包括具有外部部分并具有连接到壁挂式内部电路径的内部部分的电路路径,外部部分提供到内部感测阵列的外部连接。

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