公开(公告)号：US09570380B2

公开(公告)日：2017-02-14

申请号：US14870721

申请日：2015-09-30

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Fabio Vito Coppone ,  Agatino Minotti ,  Francesco Salamone

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L23/49562 ,  H01L21/565 ,  H01L21/566 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/06 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/84 ,  H01L2924/00

Abstract: An electronic device comprising: a semiconductor die integrating an electronic component; a leadframe housing the semiconductor die; a protection body, which surrounds laterally and at the top the semiconductor die and, at least in part, the leadframe structure, defining a top surface, a bottom surface, and a thickness of the electronic device; and a conductive lead electrically coupled to the semiconductor die. The conductive lead is modelled in such a way as to extend throughout the thickness of the protection body for forming a front electrical contact accessible from the top surface of the electronic device, and a rear electrical contact accessible from the bottom surface of the electronic device.

Abstract translation: 一种电子设备，包括：集成电子部件的半导体管芯; 引线框架，其容纳半导体管芯; 保护体，其横向地和顶部包围半导体管芯，并且至少部分地围绕引线框架结构，限定电子器件的顶表面，底表面和厚度; 以及电连接到半导体管芯的导电引线。 导电引线被模制成能够延伸到保护体的整个厚度上，以形成从电子器件的顶表面可接近的前电接触，以及可从电子器件的底表面接近的后电接触。

公开(公告)号：US20160099200A1

公开(公告)日：2016-04-07

申请号：US14750920

申请日：2015-06-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Laura Ceriati ,  Paolo Crema ,  Agatino Minotti

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L24/32 ,  C22C21/02 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49562 ,  H01L23/49579 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/13091 ,  H01L2924/17724 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Described herein is a semiconductor device provided with: a die of semiconductor material; a lead frame, defining a support plate, which is designed to carry the die, and leads, which are designed to be electrically coupled to the die; and a package, of encapsulating material, which is designed to encapsulate the die and partially coming out of which are the leads. The lead frame has as constituent material an aluminum alloy comprising a percentage of silicon ranging between 1% and 1.5%.

Abstract translation: 这里描述的是一种半导体器件，其具有：半导体材料的管芯; 引线框架，限定被设计成承载芯片的支撑板和被设计成电耦合到管芯的引线; 以及封装材料的封装，其被设计成封装模具并部分地从其中引出。 引线框架具有作为构成材料的铝合金，其包含1％至1.5％之间的硅的百分比。