公开(公告)号：US11521977B2

公开(公告)日：2022-12-06

申请号：US17471824

申请日：2021-09-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kiseok Lee ,  Chan-Sic Yoon ,  Augustin Hong ,  Keunnam Kim ,  Dongoh Kim ,  Bong-Soo Kim ,  Jemin Park ,  Hoin Lee ,  Sungho Jang ,  Kiwook Jung ,  Yoosang Hwang

IPC: H01L27/108 ,  H01L27/24 ,  H01L27/22

Abstract: A method of manufacturing a semiconductor memory device and a semiconductor memory device, the method including providing a substrate that includes a cell array region and a peripheral circuit region; forming a mask pattern that covers the cell array region and exposes the peripheral circuit region; growing a semiconductor layer on the peripheral circuit region exposed by the mask pattern such that the semiconductor layer has a different lattice constant from the substrate; forming a buffer layer that covers the cell array region and exposes the semiconductor layer; forming a conductive layer that covers the buffer layer and the semiconductor layer; and patterning the conductive layer to form conductive lines on the cell array region and to form a gate electrode on the peripheral circuit region.

公开(公告)号：US20220170792A1

公开(公告)日：2022-06-02

申请号：US17365592

申请日：2021-07-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungho Jang ,  Jungchul Lee ,  Jinseob Kim ,  Gwangsik Park ,  Minhwan Seo ,  Janghwi Lee ,  Wondon Joo ,  Jiyoung Chu ,  Daehoon Han

IPC: G01J3/28 ,  G01J3/02 ,  G01J3/04 ,  G01J3/24

Abstract: Provided is a hyperspectral imaging (HSI) apparatus. The HSI apparatus includes: a first slit plate configured to introduce an output beam; a first aspherical mirror configured to reflect the introduced output beam; a first grating having a planar reflective surface, the first grating configured to generate a plurality of first split beams by splitting the output beam after being reflected by the first aspherical mirror; and a first camera configured to detect the plurality of first split beams.