Abstract:
A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.
Abstract:
A method and an apparatus for controlling a dormancy mode of the portable terminal by minimizing the dormancy mode entry delay of the display in power-off state are provided. The method includes starting, when the application processor and the communication processor stop data communication in display power-off state, a dormancy mode timer, checking, when the dormancy mode timer expires, a dormancy mode flag indicating communication channel state, and entering, when the dormancy mode flag indicates a communication channel connection release state, the dormancy mode, wherein the dormancy mode timer counts a number of segments constituting a maximum standby time for entering the dormancy mode.