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公开(公告)号：US20220122891A1
公开(公告)日：2022-04-21
申请号：US17562802
申请日：2021-12-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Wonhyuk LEE , JEONGYUN LEE , Yongseok LEE , Bosoon KIM , SANGDUK PARK , Seungchul OH , YOUNGMOOK OH
IPC: H01L21/8234 , H01L21/762 , H01L27/088 , H01L29/08
Abstract: A semiconductor device includes a device isolation layer provided on a substrate, the device isolation layer defining first and second sub-active patterns, first and second gate electrodes crossing the first and second sub-active patterns, respectively, and an isolation structure provided on the device isolation layer between the first and second sub-active patterns. The first and second sub-active patterns extend in a first direction and are spaced apart from each other in the first direction. The device isolation layer includes a diffusion break region disposed between the first and second sub-active patterns. The isolation structure covers a top surface of the diffusion break region.
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公开(公告)号：US20200014781A1
公开(公告)日：2020-01-09
申请号：US16482401
申请日：2018-01-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongseok LEE , Minsu JUNG , Seungjae BAE , Jongkyun IM , Jina MOCK , Jinyoung PARK
IPC: H04M1/02
Abstract: Disclosed is an electronic device comprising: a housing including a first plate, a second plate and a lateral member for covering a gap between the first plate and the second plate; a touch screen display exposed through a first part of the first plate; a sensor exposed through the first plate; a wireless communication circuit arranged inside the housing; and a processor which is arranged inside the housing and is electrically connected to the touch screen display, the sensor and the wireless communication circuit. In addition, other embodiments are possible.
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公开(公告)号：US20170200651A1
公开(公告)日：2017-07-13
申请号：US15405420
申请日：2017-01-13
Applicant: Samsung Electronics Co., Ltd.
Inventor： Wonhyuk LEE , JEONGYUN LEE , Yongseok LEE , Bosoon KIM , SANGDUK PARK , Seungchul OH , YOUNGMOOK OH
IPC: H01L21/8234 , H01L21/762 , H01L29/08 , H01L27/088
CPC classification number: H01L21/823481 , H01L21/76224 , H01L21/823418 , H01L21/823431 , H01L21/823456 , H01L21/823814 , H01L27/088 , H01L27/0886 , H01L29/0847
Abstract: A semiconductor device includes a device isolation layer provided on a substrate, the device isolation layer defining first and second sub-active patterns, first and second gate electrodes crossing the first and second sub-active patterns, respectively, and an isolation structure provided on the device isolation layer between the first and second sub-active patterns. The first and second sub-active patterns extend in a first direction and are spaced apart from each other in the first direction. The device isolation layer includes a diffusion break region disposed between the first and second sub-active patterns. The isolation structure covers a top surface of the diffusion break region.
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公开(公告)号：US20140253799A1
公开(公告)日：2014-09-11
申请号：US14197777
申请日：2014-03-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Heecheul MOON , Yongseok LEE , Jongchul CHOI
IPC: H04N5/225
CPC classification number: H04N5/2252 , H04M1/0264 , H04N5/2253 , H04N5/2257
Abstract: An electronic device including a camera module and a bracket for supporting the camera module provides for a slimmer construction and better absorption of the impact of external forces. The camera module includes a camera lens module, a housing having an opening and containing the camera lens module, and a camera window for covering the opening of the housing. The bracket includes a region for supporting at least a portion of the housing.
Abstract translation: 包括相机模块和用于支撑相机模块的支架的电子装置提供了更细小的结构并更好地吸收外力的影响。 相机模块包括相机镜头模块，具有开口的壳体并且容纳相机镜头模块，以及用于覆盖壳体的开口的相机窗口。 支架包括用于支撑壳体的至少一部分的区域。
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公开(公告)号：US20250095974A1
公开(公告)日：2025-03-20
申请号：US18767424
申请日：2024-07-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yongseok LEE , Jong Min LEE , Taekyoon PARK , Chae Sun KIM , Hae Rang ROH
Abstract: A substrate processing method includes collecting a plurality of pieces of optical emission spectrometry data including a wavelength, intensity of the wavelength, and time using optical emission spectrometry on a plurality of substrates, selecting a selected wavelength band having a high correlation with an endpoint of an etching process from the plurality of pieces of optical emission spectrometry data, preprocessing the plurality of pieces of optical emission spectrometry data to generate a selected dataset, generating a principal component analysis model using the selected dataset, generating a probability distribution model capable of clustering data of the principal component analysis model, and performing the etching process on a process substrate using the principal component analysis model and the probability distribution model.
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Patent Agency Ranking
26.发明公开公开(公告)号：US20240267448A1
公开(公告)日：2024-08-08
申请号：US18597064
申请日：2024-03-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jaehong JUNG , Gyeongtae KIM , Yongseok LEE , Jinman KIM , Souksu JANG , Hyeyeong CHOI , Jiwoo LEE
CPC classification number: H04M1/0264 , G03B17/561 , H04N23/51
Abstract: An electronic device is disclosed herein. The device includes a housing including a first opening formed in a surface thereof, a camera at least partially disposed in the housing, such that a lens of the camera is aligned with the first opening, a camera bracket including a flange structure disposed in the housing and spaced apart from the surface of the housing at a predetermined interval, a protruding structure extending from the flange structure into a space defined between the camera and an inner wall of the first opening to surround at least part of the camera, wherein the flange structure includes a first through-hole, and the protruding structure includes a recess, and wherein the protruding structure and the inner wall of the first opening form a microphone hole in communication with the recess and part of the first opening, an adhesive member disposed between the flange structure and an inner surface of the housing, the adhesive member including a passage, wherein one side of the passage is connected to the recess, and an opposite side of the passage is connected to the first through-hole, and a microphone element disposed in the housing and aligned with the first through-hole.
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公开(公告)号：US20240237248A1
公开(公告)日：2024-07-11
申请号：US18617729
申请日：2024-03-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Heecheul MOON , Yongseok LEE , Gyeongtae KIM , Sangmin KIM
Abstract: An electronic device includes a housing which forms an outer appearance of the electronic device and includes a frame including a step and a cover member which faces the step of the frame, a support member between the step and the cover member and is bonded to the frame and the cover member, and adhesive members which bond the support member to the housing. The adhesive members include a first adhesive member which includes a cushion layer and bonds the support member to the frame, at the step, and a second adhesive member which bonds the support member and the cover member to each other.
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公开(公告)号：US20220404868A1
公开(公告)日：2022-12-22
申请号：US17821710
申请日：2022-08-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongseok LEE , Taewon PARK , Chankeun SONG , Jongkyun IM , Minsu JUNG , Youngjae HUE , Byounguk YOON
IPC: G06F1/16
Abstract: An electronic device including a foldable housing including a first housing, a second housing, and a connection structure; a flexible display; a first plate including at least a portion disposed on a lower end of a first area of the display and a first periphery; a second plate including at least a portion disposed on a lower end of a second area of the display, and a second periphery; and a protection layer. When the electronic device is in an unfolded state, the first periphery and the second periphery are configured to be in contact with the display. When the electronic device pivots from the unfolded state to a folded state, the first periphery and the second periphery are configured to be spaced apart from the display, and the protection layer is configured to cover an area of the display exposed between the first periphery and the second periphery.
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公开(公告)号：US20210184337A1
公开(公告)日：2021-06-17
申请号：US17253483
申请日：2019-06-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sunghyup LEE , Yongseok LEE , Seungki CHOI , Jungsik PARK , Heeseok JUNG , Kyoungho KIM , Sangmin KIM , Yongyoun KIM , Seunghoon LEE
Abstract: An electronic device comprises: a front housing including a display on a front surface; a rear housing located on a rear surface of the front housing; an antenna clip coupled to the rear housing, wherein the antenna clip may comprise: a coupling body coupled to one end of the rear housing; a first contact portion extending from the coupling body and electrically connected to an external radiator, and a second contact portion electrically connected to a circuit board between the front housing and the rear housing. Other various embodiments may be possible.
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公开(公告)号：US20180070482A1
公开(公告)日：2018-03-08
申请号：US15688065
申请日：2017-08-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seungki CHOI , Yongseok LEE , Seungjun PARK , Jungsik PARK , Soyoung LEE
CPC classification number: H05K9/002 , H04R9/02 , H04R31/006 , H04R2209/022 , H04R2499/11 , H05K5/0017 , H05K9/0075
Abstract: An electronic device is provided. The electronic device includes a housing including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side member configured to enclose at least a portion of a space between the first surface and the second surface, a first electronic component positioned inside the housing and comprising magnets disposed to emit a magnetic flux in the first direction or the second direction, a second electronic component positioned inside the housing and comprising at least one magnet disposed to emit a magnetic flux in the first direction or the second direction and being disposed beside one side surface of the first electronic component in a substantially vertical direction to the first direction or the second direction, and a shield structure disposed between the first electronic component and the second electronic component.
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