Wax-flux composition containing a succinimide salt of an alkylaryl
sulfonic acid for soldering
    24.
    发明授权
    Wax-flux composition containing a succinimide salt of an alkylaryl sulfonic acid for soldering 失效
    含有用于焊接的烷基芳基磺酸的琥珀酰亚胺盐的蜡助剂组合物

    公开(公告)号:US4028143A

    公开(公告)日:1977-06-07

    申请号:US627992

    申请日:1975-11-03

    CPC classification number: H05K3/3489 B23K35/3613 C08K5/42

    Abstract: Wax-flux compositions for use in low-temperature soldering processes comprise (A) a major amount of a wax and (B) an effective amount to cause fluxing, at or below the soldering temperature of the piece to be soldered, of a wax-soluble product obtained by first reacting an aliphatic hydrocarbon-substituted succinic acid or derivative thereof which is capable of forming carboximide bonds with an alkylene polyamine to form a carboximide and then reacting said carboximide with an alkylaryl sulfonic acid. A process for soldering electrical components to a printed circuit board comprises (A) applying a molten wax-flux composition as described above to the metal pattern side of the board, (B) allowing the wax-flux composition to solidify, (C) trimming the components leads, and (D) soldering the components to the printed circuit board.

    Abstract translation: 用于低温焊接工艺的蜡 - 助焊剂组合物包括(A)主要量的蜡和(B)在待焊接件的焊接温度下或低于待焊接件的焊接温度下产生助熔剂的有效量, 通过首先使能够与亚烷基多胺形成羧酰亚胺键的脂肪族烃取代的琥珀酸或其衍生物反应以形成甲酰亚胺,然后使所述的亚胺酰亚胺与烷基芳基磺酸反应而获得的可溶性产物。 用于将电气部件焊接到印刷电路板的工艺包括(A)将如上所述的熔融蜡 - 助熔剂组合物涂覆到板的金属图案侧,(B)使蜡 - 助熔剂组合物固化,(C)修整 组件导线,(D)将组件焊接到印刷电路板。

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