公开(公告)号：US20080108332A1

公开(公告)日：2008-05-08

申请号：US11953141

申请日：2007-12-10

Applicant: Linyi TIAN ,  Yang Zhao ,  Qian Sun

Inventor： Linyi TIAN ,  Yang Zhao ,  Qian Sun

IPC: H04Q7/38

CPC classification number: H04L67/24 ,  H04L41/0803 ,  H04L41/18 ,  H04L51/04

Abstract: A method for subscribing for presence information, wherein: a delegated watcher client or an application server sends a subscription message of a watcher client to a presence server; when determining that the subscription message is a delegated subscription, the presence server processes the message according to delegation authorization rules; when determining that the subscription message is a non-delegated subscription, the presence server processes the message in non-delegated subscription mode; and the presence server saves the subscription relation obtained by processing the message. The present invention further provides a system for subscribing for presence information and a presence server. By employing the present invention, the subscription mode of the presence information may be made more flexible.

Abstract translation: 一种用于订阅存在信息的方法，其中：委派的观察者客户端或应用服务器向观众服务器发送观察者客户端的订阅消息; 当确定订阅消息是委托订阅时，呈现服务器根据委托授权规则处理该消息; 当确定订阅消息是非委派订阅时，呈现服务器以非委托订阅模式处理消息; 并且存在服务器保存通过处理消息而获得的订阅关系。 本发明还提供一种用于订阅存在信息和存在服务器的系统。 通过采用本发明，可以使存在信息的订阅模式更加灵活。

公开(公告)号：US07295029B2

公开(公告)日：2007-11-13

申请号：US11242296

申请日：2005-10-03

Applicant: Yang Zhao

Inventor： Yang Zhao

IPC: G01R31/02 ,  G01R31/26

CPC classification number: H01L21/50 ,  H01L21/76898 ,  H01L23/10 ,  H01L23/13 ,  H01L23/481 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/16 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/1627

Abstract: A chip-scale packaged IC is made by bonding one or more singulated die chips (from an IC wafer) to a common substrate, such as a single cap wafer (or a portion thereof) and cutting (singulating) the substrate to yield individual, chip-scale packaged ICs. Alternatively, each die chip is bonded to an individual, pre-cut cap. Electrically conductive paths extend through the cap wafer, between wafer contact pads on the surface of the cap and electrical contact points on the IC wafer. Optionally, the cap wafer contains one or more die. The IC wafer can be fabricated according to a different technology than the cap wafer, thereby forming a hybrid chip-scale packaged IC. Optionally, additional “upper-level” cap wafers (with or without die) can be stacked to form a “multi-story” IC.

Abstract translation: 通过将一个或多个分离的芯片（从IC晶片）粘合到诸如单盖晶片（或其一部分）的公共基板上并切割（分割）基板来制造芯片级封装的IC，以产生单独的， 芯片级封装IC。 或者，每个芯片芯片被结合到单独的预切割盖。 导电路径延伸穿过盖晶片，在盖的表面上的晶片接触焊盘和IC晶片上的电接触点之间。 可选地，盖晶片包含一个或多个管芯。 可以根据与盖晶片不同的技术来制造IC晶片，从而形成混合芯片级封装IC。 可选地，可以堆叠另外的“上层”盖晶片（具有或不具有裸片）以形成“多层”IC。

公开(公告)号：US07206383B2

公开(公告)日：2007-04-17

申请号：US11017182

申请日：2004-12-20

Applicant: Yang Zhao ,  Xu Xiaodong

Inventor： Yang Zhao ,  Xu Xiaodong

IPC: G21K1/02

CPC classification number: G21K1/04

Abstract: A collimator includes a pair of first plate members which define an X-ray passing aperture by a spacing between their opposed end faces, a second plate member which is movable in a direction parallel to a moving direction of the first plate members, a pair of third plate members which are movable symmetrically with each other in a direction perpendicular to the moving direction of the first plate member and which define an X-ray passing aperture by a spacing between their opposed end faces, and a fourth plate member which is movable in a direction parallel to the moving direction of the third plate members.

Abstract translation: 准直器包括一对第一板构件，其通过在相对的端面之间的间隔限定X射线通过孔;第二板构件，其可在平行于第一板构件的移动方向的方向上移动;一对 第三板构件，其在与第一板构件的移动方向垂直的方向上彼此对称地移动，并且通过其相对的端面之间的间隔限定X射线通过孔;以及第四板构件， 平行于第三板构件的移动方向的方向。

公开(公告)号：US20060216856A1

公开(公告)日：2006-09-28

申请号：US11088633

申请日：2005-03-24

Applicant: Yang Zhao

Inventor： Yang Zhao

IPC: H01L21/00

CPC classification number: H01L21/50 ,  H01L21/76898 ,  H01L23/10 ,  H01L23/481 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/1627 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A wafer-level packaged IC is made by attaching a cap wafer to the top of an IC wafer before cutting the IC wafer, i.e. before singulating the plurality of die on the IC wafer. The cap wafer is mechanically attached and electrically connected to the IC wafer, then the die are singulated. Electrically conductive paths extend through the cap wafer, between wafer contact pads on the top surface of the cap and electrical contact points on the IC wafer. Optionally, the cap wafer contains one or more die. The IC wafer can be fabricated according to a different technology than the cap wafer, thereby forming a hybrid wafer-level package. Optionally, additional “upper-level” cap wafers (with or without die) can be stacked to form a “multi-story” IC.

Abstract translation: 在切割IC晶片之前，即在IC晶片上分离多个管芯之前，将盖晶片附接到IC晶片的顶部，制造晶片级封装IC。 盖晶片被机械地附接并电连接到IC晶片，然后将管芯单片化。 导电路径延伸穿过盖晶片，在盖的顶表面上的晶片接触焊盘和IC晶片上的电接触点之间。 可选地，盖晶片包含一个或多个管芯。 可以根据与盖晶片不同的技术来制造IC晶片，从而形成混合晶片级封装。 可选地，可以堆叠另外的“上层”盖晶片（具有或不具有裸片）以形成“多层”IC。

公开(公告)号：US20060068195A1

公开(公告)日：2006-03-30

申请号：US11133780

申请日：2005-05-19

Applicant: Arun Majumdar ,  Tao Tong ,  Yang Zhao ,  Lance Delzeit ,  Ali Kashani

Inventor： Arun Majumdar ,  Tao Tong ,  Yang Zhao ,  Lance Delzeit ,  Ali Kashani

IPC: B32B5/16 ,  B32B37/00 ,  C04B37/00

CPC classification number: B82Y30/00 ,  B32B37/00 ,  H01L23/373 ,  H01L2924/0002 ,  Y10T428/25 ,  H01L2924/00

Abstract: A carbon nanostructure adhesive for adhering two surfaces together, including: an array of vertically aligned carbon nanostructures on a first surface; and a second surface positioned adjacent to the vertically aligned carbon nanostructures such that the vertically aligned carbon nanostructures adhere the first and second surfaces together by van der Waals forces.

Abstract translation: 一种用于将两个表面粘合在一起的碳纳米结构粘合剂，包括：在第一表面上的垂直排列的碳纳米结构阵列; 以及邻近垂直排列的碳纳米结构定位的第二表面，使得垂直排列的碳纳米结构通过范德华力将第一和第二表面粘合在一起。

公开(公告)号：US06995615B2

公开(公告)日：2006-02-07

申请号：US10850504

申请日：2004-05-20

Applicant: Yang Zhao

Inventor： Yang Zhao

IPC: H03F3/08

CPC classification number: H03F3/082

Abstract: Current-mode preamplifiers are provided. In accordance with an embodiment, a current-mode preamplifier includes a transistor, that acts as an input stage for the preamplifier, and a pair of current mirrors. The transistor includes a gate connected to the input of the preamplifier, a source connected to a first voltage supply rail, and a drain. The first current mirror, which is connected to a second voltage supply rail, includes an input connected to the drain of the first transistor, and an output. The second current mirror, which is connected to the first voltage supply rail, includes an input connected to the output of the first current mirror, a first output connected to the input of the preamplifier, and a second output connected to the output of the preamplifier.

Abstract translation: 提供电流模式前置放大器。 根据实施例，电流模式前置放大器包括用作前置放大器的输入级的晶体管和一对电流镜。 晶体管包括连接到前置放大器的输入端的栅极，连接到第一电压供应轨道的源极和漏极。 连接到第二电压源的第一电流镜包括连接到第一晶体管的漏极的输入端和输出端。 连接到第一电压源的第二电流镜包括连接到第一电流镜的输出的输入端，连接到前置放大器的输入端的第一输出端和连接到前置放大器的输出端的第二输出端 。

公开(公告)号：US20050274187A1

公开(公告)日：2005-12-15

申请号：US11125759

申请日：2005-05-10

Applicant: Yang Zhao ,  Yongyao Cai

Inventor： Yang Zhao ,  Yongyao Cai

IPC: G01P15/08 ,  G01P15/00

CPC classification number: G01P15/18 ,  G01P15/008

Abstract: A thermal accelerometer device that allows up to three axes of acceleration sensing. The thermal accelerometer includes a substantially planar substrate, a cavity formed in the substrate, a heater element, and at least first and second temperature sensing elements. The heater element is suspended over the cavity, and the first and second temperature sensing elements are disposed along the X or Y axis in the substrate plane on opposite sides of and at equal distances from the heater element. The thermal accelerometer employs differential temperatures detected by the temperature sensing elements to provide indications of acceleration in the X or Y directions. Further, the thermal accelerometer employs a common mode temperature detected by the temperature sensing elements to provide an indication of acceleration along a Z axis perpendicular to the X and Y axes.

Abstract translation: 一种允许三个加速度感测轴的热加速度计装置。 热加速度计包括基本平坦的基板，形成在基板中的空腔，加热器元件以及至少第一和第二温度感测元件。 加热器元件悬挂在空腔上，并且第一和第二温度感测元件沿着基板平面中的X或Y轴设置在与加热器元件相对的相对侧并且距离加热器元件等距离处。 热加速度计采用由温度感测元件检测的差分温度来提供X或Y方向上的加速度指示。 此外，热加速度计采用由温度感测元件检测的共模温度来提供沿着与X轴和Y轴垂直的Z轴的加速度的指示。

公开(公告)号：US20050274180A1

公开(公告)日：2005-12-15

申请号：US11146993

申请日：2005-06-07

Applicant: Yang Zhao ,  Albert Leung ,  Michael Rebeschini ,  Gregory Pucci ,  Alexander Dribinsky ,  Yongyao Cai

Inventor： Yang Zhao ,  Albert Leung ,  Michael Rebeschini ,  Gregory Pucci ,  Alexander Dribinsky ,  Yongyao Cai

IPC: G01P15/00

CPC classification number: G01P15/008

Abstract: A thermal accelerometer device that provides a compensation for sensitivity variations over temperature. The thermal accelerometer includes signal conditioning circuitry operative to receive analog signals representing a differential temperature is indicative of a sensed acceleration. The signal conditioning circuitry includes serially connected A-to-D and D-to-A converters, which implement a temperature dependent function and process the received signals to provide a compensation for sensitivity variations over a range of ambient temperature. To provide a ratiometric compensation for variations in power supply voltage, a buffered voltage proportional to the supply voltage is provided as a reference voltage to the D-to-A converter. The thermal accelerometer includes a self-test circuit for verifying the integrity of a heater, temperature sensors, and circuitry included within the device.

Abstract translation: 一种热敏加速度计装置，可提供对温度敏感度变化的补偿。 热加速度计包括信号调节电路，其操作以接收表示差分温度的模拟信号，其指示感测到的加速度。 信号调理电路包括串行连接的A到D和D到A转换器，其实现温度依赖功能并处理接收到的信号以提供在环境温度范围内的灵敏度变化的补偿。 为了提供电源电压变化的比例补偿，将与电源电压成比例的缓冲电压作为参考电压提供给D转换器。 热加速度计包括用于验证加热器，温度传感器和包括在装置内的电路的完整性的自检电路。

公开(公告)号：US06795752B1

公开(公告)日：2004-09-21

申请号：US09705996

申请日：2000-11-03

Applicant: Yang Zhao ,  Adrian Paul Brokaw ,  Michael E. Rebeschini ,  Albert M. Leung ,  Gregory P. Pucci ,  Alexander Dribinsky

Inventor： Yang Zhao ,  Adrian Paul Brokaw ,  Michael E. Rebeschini ,  Albert M. Leung ,  Gregory P. Pucci ,  Alexander Dribinsky

IPC: G01P1500

CPC classification number: G01P15/008 ,  G01P15/08 ,  G01P15/12

Abstract: An integrated convective accelerometer device. The device includes a thermal acceleration sensor having a thermopile and a heater element; control circuitry for providing closed-loop control of the thermopile common-mode voltage; an instrumentation amplifier; clock generation circuitry; voltage reference circuitry; a temperature sensor; and, output amplifiers. The device can be operated in an absolute or ratiometric mode. Further, the device is formed in a silicon substrate using standard semiconductor processes and is packaged in a standard integrated circuit package.

Abstract translation: 一体化对流加速度计装置。 该装置包括具有热电堆和加热元件的热​​加速度传感器; 用于提供热电堆共模电压的闭环控制的控制电路; 仪表放大器; 时钟发生电路; 电压参考电路; 温度传感器; 和输出放大器。 该设备可以以绝对或比例模式运行。 此外，使用标准半导体工艺在硅衬底中形成器件，并封装在标准集成电路封装中。

公开(公告)号：US6064067A

公开(公告)日：2000-05-16

申请号：US59732

申请日：1998-04-13

Applicant: Yang Zhao ,  Dan Hu

Inventor： Yang Zhao ,  Dan Hu

IPC: G01N21/62

CPC classification number: G01J1/0266 ,  G01J1/0411 ,  G01J1/0422

Abstract: An infrared collector employs a concentrator formed of a plurality of spatially related gradient-indexed (GRIN) lenses and a photodetector, interconnected by optical fibers. Since the GRIN lenses are arranged on a hemispherical shell, the concentrator is relatively insensitive to the direction of the incoming infrared radiation. Optical fibers are used to connect the GRIN lenses to a photodetector, whereby assembly is simplified. The infrared detector in the collector of the present invention has a size that is significantly smaller than those used in conventional collectors. The concentrator has high optical gain, and therefore, is particularly well adapted for use in low-power portable systems. The arrangement is useful as a node in an infrared data network.

Abstract translation: 红外线收集器使用由多个空间相关的梯度指数（GRIN）透镜和由光纤互连的光电检测器形成的集中器。 由于GRIN透镜布置在半球形壳体上，集中器对于进入的红外辐射的方向相对不敏感。 光纤用于将GRIN透镜连接到光电检测器，从而简化组装。 本发明的集电体中的红外线检测器的尺寸明显小于常规收集器中使用的尺寸。 集中器具有高光学增益，因此特别适用于低功率便携式系统。 该布置作为红外数据网络中的节点是有用的。