Abstract:
A grease-like silicone composition comprising at least a liquid organopolysiloxane comprising siloxane units represented by the formula R2SiO2/2, siloxane units represented by the formula RSiO3/2, and siloxane units represented by the formula R3SiO1/2 and a thickening agent. A grease-like silicone composition is provided that is capable of containing a large amount of thickening agent and possesses superior heat resistance.
Abstract:
The invention relates to a food-grade high-temperature lubricant, more particularly a high-temperature oil and a high-temperature grease, comprising the following components: a) at least one oil selected from a trimellitic ester or a mixture of different trimellitic esters, alkylaromatics, preferably an aliphatically substituted naphthalene, or estolides; b) a hydrogenated or fully hydrogenated polyisobutylene or a mixture of hydrogenated or fully hydrogenated polyisobutylene; and c) additives individually or in combination. In the case of the high-temperature grease, a thickener is added.
Abstract:
A composition for a lubricating fast-setting epoxy compound comprising substantially equal amounts of an epoxy base and an epoxy accelerator. The epoxy base comprises: a first micro-crystalline filler, a first talc, a hardenable epoxide containing liquid; and a titanium oxide. The epoxy base can also include a flatting agent. The epoxy accelerator comprises: a second micro-crystalline filler, a second talc, a methylamino accelerator, and a hydrocarbon resin. The epoxy accelerator can also include a modified aliphatic amine, an acrylic resin, a coloring agent, or combinations thereof.
Abstract:
A thermally conductive silicone grease composition comprising at least the following components: an organopolysiloxane (A) represented by the following general formula: [wherein R1 designates identical or different univalent hydrocarbon groups; X designates identical or different univalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: —R2—SiR1a(OR3)(3-a) (wherein R1 designates the previously mentioned groups; R2 designates oxygen atoms or alkylene groups; R3 designates alkyl groups; and ‘a’ is an integer ranging from 0 to 2); and ‘m’ and ‘n’ are integers equal to or greater than 0, respectively]; a thermally conductive filler (B); and an organopolysiloxane (C) having silicon-bonded hydrogen atoms on both molecular terminals and in the molecular chains; is characterized by excellent resistance to heat and reduced oil bleeding.
Abstract:
A grease-like silicone composition comprising at least a liquid organopolysiloxane comprising siloxane units represented by the formula R2SiO2/2, siloxane units represented by the formula RSiO3/2, and siloxane units represented by the formula R3SiO1/2 and a thickening agent. A grease-like silicone composition is provided that is capable of containing a large amount of thickening agent and possesses superior heat resistance.
Abstract:
To provide a highly reliable heat-dissipating silicone grease composition having stable thermoconductive properties over a long period of time, which does not exude oil, and which does not lead to contact defects. The heat-dissipating silicone grease composition, comprising: (A) 100 weight parts of an organopolysiloxane having a thixotropicity degree null of 1.03-1.50 and a viscosity at 25null C. of 100-1,000,000 mm2/s, and (B) 100-2,000 weight parts of a thermoconductive inorganic filler having an) average particle diameter of 0.1-100 micrometers.
Abstract:
A grease composition having high thermal conductivity and excellent dispensation suitability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 mum; wherein the aluminum powder is a mixture of fine metallic aluminum powder having an average size of 0.5 to 5 mum and coarse metallic aluminum powder having an average particle size of 10 to 40 mum; and a semiconductor device utilizing the aforesaid grease composition.
Abstract:
A thermally conductive silicone grease composition comprising at least the following components: an organopolysiloxane (A) represented by the following general formula : [wherein R 1 designates identical or different univalent hydrocarbon groups; X designates identical or different univalent hydrocarbon groups or alkoxysilyl-containing groups of the following general formula: -R 2 -SiR 1 a (OR 3 ) (3-a) (wherein R 1 designates the previously mentioned groups; R 2 designates oxygen atoms or alkylene groups; R 3 designates alkyl groups; and 'a' is an integer ranging from 0 to 2); and 'm' and 'n' are integers equal to or greater than 0, respectively]; a thermally conductive filler (B); and an organopolysiloxane (C) having silicon-bonded hydrogen atoms on both molecular terminals and in the molecular chains; is characterized by excellent resistance to heat and reduced oil bleeding.
Abstract:
A greasy silicone composition which comprises: (A) a liquid organopolysiloxane comprising 80 to 96.5 mol% siloxane units represented by the formula R2SiO2/2, 1.0 to 10.0 mol% siloxane units represented by the formula RSiO3/2, and 0.25 to 10.0 mol% siloxane units represented by the formula R3SiO1/2 (in the formulae, R's are the same or different and each is a monovalent hydrocarbon group); and (B) a thickener. The composition can contain the thickener in a large amount and has excellent heat resistance.
Abstract:
The invention relates to thermally conductive greases that may contain carrier oil(s), dispersant(s), and thermally conductive particles, wherein the thermally conductive particles are a mixture of at least three distributions of thermally conductive particles, each of the at least three distributions of thermally conductive particles having an average (D 50 ) particle size which differs from the other average particle sizes by at least a factor of five. The thermally conductive greases of the invention exhibit desirable rheological behavior during installation/ application and during use of devices involving these materials.