Abstract:
A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.
Abstract:
A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.
Abstract:
Provided is a multilayer-wired substrate for mobile electric equipment, wherein the multilayer-wired substrate is very strong, includes a larger elastically deformable region and a higher elasticity than those of the conventional structure, and can be curved. The multilayer-wired substrate is a multilayer-wired substrate including one or more insulating layers. At least one insulating layer of the substrate is made of a material in which the mechanical characteristic in an in-plane direction component exhibits anisotropy.
Abstract:
Method of production of glass fabric that does not exhibit surface hairiness, that is sufficiently close-woven, with which printed circuits with a high degree or rigidity can be realized, as well at supply of a glass fabric, prepreg and print circuits. Glass fabric (40) woven from warp yarn (20) and weft yarn (30) containing multiple glass filaments; in relation to the warp yarn (20) and the weft yarn (30), at least one of the two has not undergone twisting and the profile of its glass filament has been flattened. Since between warp yarn (20) and weft yarn (30), at least one of the two has not undergone twisting, it is possible to limit the surface hairiness and at the same time to obtain that the fabrics arm separated and uniformly distributed during the weaving operation also without performing a specific treatment of uniform fibers redistribution. Moreover, since between warp yarn (20) and weft yarn (30), the filament F of at least one of the two has a flattened profile, the spacing between the filaments F is closer, the degree of distribution of the fibers of the glass fabric is higher and the rigidly of the printed circuit laminate is greater.
Abstract:
The present invention is a method and apparatus for providing an electrical substrate. The electrical substrate comprises a dielectric layer having a surface roughness of no greater than 6.0 microns. A first conductive layer is attached to the dielectric layer. In one embodiment, the dielectric layer comprises a laminate that comprises a cloth having a uniform weave and a resin that is consistently impregnated within the uniform weave. A removable layer may be attached to the laminate and removed prior to metallizing of the first conductive layer. Various embodiments are described.
Abstract:
The reinforcing fibers in a printed circuit board laminate are arranged in an ordered manner to leave fiber-free zones for the formation of holes. The holes may be oblong to enhance the connection to electrical leads of components mounted on the printed circuit board. The holes may be oriented with their long dimensions transverse to the side of an electrical component, and the electrical component may have its leads correspondingly oriented, to improve wiring flexibility and allow more direct wiring paths.
Abstract:
Method of production of glass fabric that does not exhibit surface hairiness, that is sufficiently close-woven, with which printed circuits with a high degree of rigidity can be realized, as well as supply of a glass fabric, prepreg and printed circuits. Glass fabric (40) woven from warp yarn (20) and weft yarn (30) containing multiple glass filaments; in relation to the warp yarn (20) and the weft yarn (30), at least one of the two has not undergone twisting and the profile of its glass filament has been flattened. Since between warp yarn (20) and weft yarn (30), at least one of the two has not undergone twisting, it is possible to limit the surface hairiness and at the same time to obtain that the fibers are separated and uniformly distributed during the weaving operation also without performing a specific treatment of uniform fibers redistribution. Moreover, since between warp yarn (20) and weft yarn (30), the filament F of at least one of the two has a flattened profile, the spacing between the filaments F is closer, the degree of distribution of the fibers of the glass fabric is higher and the rigidity of the printed circuit laminate is greater.