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公开(公告)号：JP2005101085A
公开(公告)日：2005-04-14
申请号：JP2003330160
申请日：2003-09-22
Inventor： URAGAMI HIROSHI , DENTO KATSUNORI , HIRATA SHIGERU , ASHIDA GOSHI
Abstract: PROBLEM TO BE SOLVED: To solve the problem wherein traces of a gate are produced on a lens unit when an optical element, such as an LED chip or the like, is sealed up with resin to form an optical element, and the traces deteriorate the characteristics, dimensional accuracy, and quality level of external appearance of the optical element.
SOLUTION: Chips 4 mounted on lead frames 1 are housed in cavities 19 and sealed up with resin to form optical electronic parts through a resin sealing device. The resin sealing device comprises a cavity 19 whose inner bottom confronts the light emitting face of the chip 4, a female mold 18 where the capacity 19 is provided, a male mold 10 confronting the female mold 18, a fixing mechanism 14 fixing the lead frame 1 to the male mold 10, a resin passage 17 communicating with the cavity 19 through the intermediary of a gate 23 when the female mold 18 and the male mold 10 are clamped, and a plunger 21. When the female mold and the male mold are clamped together, a die matching surface PL is formed at a part opposite to the light emitting face of the chip 4 in the cavity 19, and molten resin 24 which is formed by melting a resin tablet 22 is injected by the plunger 21 into the cavity 19 through the gate 23.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题为了解决当诸如LED芯片等的光学元件用树脂密封以形成光学元件时在透镜单元上产生栅极的迹线的问题，并且 痕迹会降低光学元件的外观的特性，尺寸精度和质量水平。
解决方案：安装在引线框架1上的芯片4容纳在空腔19中并用树脂密封，以通过树脂密封装置形成光学电子部件。 树脂密封装置包括一个空腔19，其内底面对着芯片4的发光面，设有容量19的阴模18，与阴模18相对的阳模10，固定机构14， 如图1所示，在阴模10上，当阴模18和阳模10被夹持时，通过门23与腔19连通的树脂通路17和柱塞21.当阴模和阳模为 夹在一起的模具匹配表面PL形成在空腔19中的与芯片4的发光面相对的部分处，并且通过熔化树脂片22形成的熔融树脂24被柱塞21注入到腔 19通过大门23.版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2005081695A
公开(公告)日：2005-03-31
申请号：JP2003316273
申请日：2003-09-09
Inventor： NIHEI SATOSHI , MITANI HIRONOBU , MIYAKAGE TAKAYUKI
Abstract: PROBLEM TO BE SOLVED: To solve the following problem: when a resin is molded by making a substrate which has flexibility and in which an electronic component and an outside connection electrode part are formed to a package substrate by using conventional resin molding molds, in clamping the molds, when a resin material is injected/packed in a cavity with a package part engaged, gaps are formed between mold surfaces and the substrate to generate defective molding such as burrs.
SOLUTION: In the resin molding molds 11 and 12, projections 15 (15a and 15b) for preventing the burrs formed on the mold surfaces 13 and 16 using the characteristics of the package substrate 1 having flexibility are formed. In clamping the molds 11 and 12, the projections 15 are inserted into the substrate 2 engaged with the molds 11 and 12, and the resin material 19 is injected/packed in each cavity 14 or 17 without forming the gaps between the substrate 2 and the mold surfaces 13 and 16, so that the leakage of the resin material 19 to a cavity peripheral part (package peripheral part) can efficiently be prevented.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 解决以下问题：通过使用常规的树脂模塑成型制造具有柔性的基板并且将电子部件和外部连接电极部形成于封装基板的树脂成型时 在夹持模具时，当树脂材料被注入/包装在具有接合的封装部分的空腔中时，在模具表面和基板之间形成间隙以产生诸如毛刺的不良模制。 解决方案：在树脂成型模具11和12中，形成用于防止使用具有柔性的封装基板1的特性在模具表面13和16上形成的毛刺的突起15（15a和15b）。 在夹持模具11和12时，将突起15插入到与模具11和12接合的基板2中，并且树脂材料19被注入/包装在每个空腔14或17中，而不形成基板2和 模具表面13和16，从而可以有效地防止树脂材料19泄漏到空腔周边部分（封装周边部分）。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2005028704A
公开(公告)日：2005-02-03
申请号：JP2003195541
申请日：2003-07-11
Inventor： TAKEHARA KATSUNAO , URAGAMI HIROSHI , NAKAGAWA TAKERU , MIURA MUNEO , AMAKAWA TAKESHI
Abstract: PROBLEM TO BE SOLVED: To provide a mold for molding a resin constituted so as to make the clamping pressure to a substrate proper and uniform even if the substrate is made large-sized and the irregularity of thickness or the like occurs in the substrate, and a resin molding method.
SOLUTION: The lower mold 1 of the mold for molding the resin is provided with an underside holder 3, two underside blocks 4 placed on the underside holder 3, the pot block 5 fitted in the through-hole of the underside holder 3 and the space between the underside blocks 4 and the pressure sensors 8 arranged between the underside holder 3 and the underside blocks 4. An upper side holder 11, the piezoelectric element 20 fixed to the recessed part 18 of the upper side holder 11 and the cavity block 12 fixed to the under surface of the piezoelectric element 20 are provided to the upper mold 2 opposed to the lower mold 1. The clamping forces applied to respective substrates 10L and 10R are detected by the pressure sensors 8. When the clamping pressures are less than a target value, voltage is applied to the piezoelectric element 20 to protrude an end surface and the back surface of the cavity block 12 is pressed by the end surface to set the clamping pressures to the target value.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：为了提供一种用于模制树脂的模具，其被构造成使得即使基板被制成大尺寸并且在厚度等的不规则性发生在衬底上的适当且均匀的夹持压力 基板和树脂模制方法。 解决方案：用于模制树脂的模具的下模具1设置有下侧支架3，放置在下侧支架3上的两个下侧块4，安装在下侧支架3的通孔中的罐块5 以及下侧挡块4和布置在下侧支架3和下侧挡块4之间的压力传感器8之间的空间。上侧支架11，固定在上侧支架11的凹部18上的压电元件20， 固定到压电元件20的下表面的块体12设置在与下模具1相对的上模2上。施加到各个基板10L和10R的夹紧力由压力传感器8检测。当夹紧压力较小时 电压被施加到压电元件20以突出端面，并且空腔12的后表面被端面按压以将夹紧压力设定为目标值。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2005001205A
公开(公告)日：2005-01-06
申请号：JP2003166023
申请日：2003-06-11
Inventor： OKADA MASATOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a mold for molding a resin, constituted so as to suppress the occurrence of wrinkles in a film for use in molding the resin, and a resin molding method.
SOLUTION: The mold for molding the resin is equipped with a lower mold 1, the upper mold 2 opposed thereto, the film 3 provided between both molds under tension, the cavity 7 provided to the upper mold 2, the protruded parts 11 provided on the side of a feed-out roll 8 in the lower mold 1, the recessed parts 13 provided in the upper mold 2 so as to be opposed to the protruded parts 11 and the edge parts 14 with blades partially provided to the ridgelines of the protruded parts 11 and the recessed parts 13. Notches 16 are formed to the film 3 by fitting the protruded parts 11 and the recessed parts 13 at the time of mold clamping. By this constitution, the notches are formed so as to hold the region corresponding to the molding of the resin performed hereinafter when the molds 1 and 2 are clamped after the molding of the resin, mold opening and the feed of the film are successively performed. Accordingly, the tension applied to the film is uniformized not only to eliminate produced wrinkles 15 but also suppress the occurrence of new wrinkles 15.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：提供一种用于模制树脂的模具，其构成为抑制用于模塑树脂的膜中的皱纹的发生和树脂模制方法。 解决方案：用于模塑树脂的模具配备有下模具1，与其相对的上模具2，在张力下设置在两个模具之间的薄膜3，设置在上模具2上的模腔7，突出部分11 设置在下模具1中的送出辊8的侧面上，设置在上模具2中的与凹部11相对的凹部13和具有部分地设置在凸条11的棱线 突出部11和凹部13.通过在合模时嵌合突出部11和凹部13，在薄膜3上形成切口16。 通过这种结构，形成凹口，以便在树脂模制之后夹紧模具1和2时保持与下文进行的树脂模制相对应的区域，模具开口和薄膜的进料连续进行。 因此，施加到膜上的张力是均匀的，不仅消除产生的皱纹15，而且抑制新皱纹的发生15.版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2004311855A
公开(公告)日：2004-11-04
申请号：JP2003106052
申请日：2003-04-10
Inventor： TAMURA KOJI
Abstract: PROBLEM TO BE SOLVED: To solve a problem that the clamping operation of a mold can not stably performed when resin seal molding with the conventional mold structure which elastic supports and receives corresponding to a substrate on which electronic parts are mounted by using a mold for resin seal molding of electronic parts.
SOLUTION: A mold structure is provided with an elastic member 37 by using a mold base 10, not a holder base 14, as a base end. A main block 18 is directly elastic supported and received by the elastic member 37. Especially, the clamping operation in the mold for resin seal molding of electronic parts can be performed.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题为了解决当使用弹性支撑和传递的常规模具结构的树脂密封成型时模具的夹紧操作不能稳定地执行的问题，该模具结构通过使用 模具用于树脂密封成型的电子零件。 解决方案：通过使用模具座10而不是保持器底座14作为基端，模具结构设置有弹性构件37。 主块18由弹性构件37直接弹性地支撑和接收。特别地，可以执行用于电子部件的树脂密封成型的模具中的夹紧操作。 版权所有（C）2005，JPO＆NCIPI
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Patent Agency Ranking
公开(公告)号：JP2004310343A
公开(公告)日：2004-11-04
申请号：JP2003101550
申请日：2003-04-04
Inventor： KATAGIRI SHO
Abstract: PROBLEM TO BE SOLVED: To provide an external appearance inspection method for a substrate sealed with the resin, which can effectively solve various problems of an external appearance inspection in response to the external appearance inspections with stability using an external appearance inspection mechanism, which externally inspects an anomalous formation and an anomalous external appearance of a resin surface formation of the substrate sealed with the resin by using an image process. SOLUTION: The external appearance inspection method executes a defect inspection on an independent surrounding area 33 and an independent top surface 32, which are automatically generated as independent inspection areas from a surrounding area 6 and a top surface 5 of a resin surface formation P, in order to implement the external appearance inspection method for the resin surface formation P of the substrate sealed with the resin 4 , which is a substrate 1 formed with a resin formation 2, by using the external appearance inspection mechanism. COPYRIGHT: (C)2005,JPO&NCIPI
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298.发明专利
公开(公告)号：JP2004230707A
公开(公告)日：2004-08-19
申请号：JP2003021900
申请日：2003-01-30
Inventor： KAWAKUBO KAZUTERU , WATANABE SO
CPC classification number: H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/181 , H01L2924/00014 , H01L2224/85 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a method for sealing and molding an electronic component with a resin capable of efficiently solve the problems on resin molding such as resin burrs on a face 10 where a chip is not mounted, inferiority of a wire and excessive use of the resin by closely sticking the face where the chip is not mounted for a lead frame mounted with a semiconductor chip being the electronic component and a release film without any gap and surely, and an apparatus therefor.
SOLUTION: In the method for sealing and molding the electronic component with the resin, when upper and lower molds 1 and 2 are clamped, a sliding member 21 is moved upward from a part approximately just below a plurality of the chips 8 and the wires 9 inserted and mounted in a cavity forming part 5, and a required amount of a molten resin 13 on the top face of the sliding member 21 is also elevated therewith to immerse and wrap a plurality of the number of the chips 8 and the wires 9 and it is compression-molded by a required pressure to closely stick without gap and surely the face 10 where the chip is not mounted of the lead frame 7 mounted with the chips 8 being the electronic components and the release film 4.
COPYRIGHT: (C)2004,JPO&NCIPIAbstract translation: 要解决的问题：提供一种用能够有效地解决在不安装芯片的面10上的树脂毛刺等树脂成形树脂成型问题的树脂进行密封和成型的方法，丝线不良 并且通过将未安装芯片的面紧密地粘贴在安装有作为电子部件的半导体芯片的引线框架和没有任何间隙的释放膜的过度使用以及其装置。 解决方案：在使用树脂密封和模制电子部件的方法中，当上模具1和下模具2被夹紧时，滑动构件21从大致刚好在多个芯片8的下方的部分向上移动， 插入并安装在空腔形成部分5中的电线9和滑动构件21的顶面上所需量的熔融树脂13也被提升，以便将多个芯片8和 电线9通过所需的压力进行压缩成型，密封地无间隙地密封，并且可靠地安装有安装有芯片8的引线框架7的芯片未被安装的面10是电子部件和脱模膜4.
版权所有（C）2004，JPO＆NCIPI
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公开(公告)号：JP2004207424A
公开(公告)日：2004-07-22
申请号：JP2002373606
申请日：2002-12-25
Inventor： KAWAMURA KOICHI , IWATA YASUHIRO , HARADA AKIYUKI
IPC: H01L21/301
Abstract: PROBLEM TO BE SOLVED: To improve productivity of preparations by enabling effective production of a package 2 (preparations) when a fabricated substrate 1 is cut off and each package 2 is separated and formed by using cut-off equipment of a substrate. SOLUTION: Firstly, the fabricated substrate 1 is transferred to a platform 14 installed in the cutting-off equipment and sucked and fixed. In the state that the substrate 1 is sucked and fixed, the cleavage site 9 of the substrate 1 is cut by using a shearing blade 17. Each package 2 is separated and formed from the substrate 1. Secondly, each of the packages 2 cut from the substrate 1 is sucked and engaged by using transport mechanism G installed in the cutting-off equipment. In the state that each of the packages 2 is sucked and engaged, steam is jetted against each of the packages 2, thereby cleaning it. Pressure-feeding of the air is performed to the cleaned package 2, thereby drying it. COPYRIGHT: (C)2004,JPO&NCIPI
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