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    Spectrometer
    291.
    发明专利
    Spectrometer 有权
    光谱仪

    公开(公告)号：JP2014032155A

    公开(公告)日：2014-02-20

    申请号：JP2012174240

    申请日：2012-08-06

    Applicant: Hamamatsu Photonics Kk ,  浜松ホトニクス株式会社

    Inventor： SHIBAYAMA KATSUMI ,  YOSHINO TAKAFUMI

    IPC: G01J3/02

    CPC classification number: G01J3/02 ,  G01J3/0256 ,  G01J3/0291 ,  G01J3/04 ,  G01J3/18 ,  G01J3/28

    Abstract: PROBLEM TO BE SOLVED: To provide a spectrometer capable of satisfying both of ensuring of electric connection between a photodetector and outer wiring and stabilization of a position relation between a spectroscopic part and the photodetector.SOLUTION: A spectrometer 1A comprises: a package 2 having a stem 4 and a cap 5; an optical unit 10A disposed on the stem 4; and a lead pin 3 penetrating through the stem 4. The optical unit 10A has: a spectroscopic part 21 for dispersing light incident from a light incidence part 6 of the cap 5 and reflecting it; a photodetector 30 for detecting the light dispersed and reflected by the spectroscopic part 21; a support 40 for supporting the photodetector 30 so that space is formed between the photodetector and the spectroscopic part 21; a protrusion 11 protruding from the support 40; and wiring electrically connected to the photodetector 30. The protrusion 11 is disposed in a position with which the stem 4 comes into contact. The lead pin 3 is electrically connected to a second terminal part of wiring disposed in the protrusion part 11.

    Abstract translation: 要解决的问题：提供能够满足光电检测器和外部布线之间的电连接的稳定性以及分光部和光电检测器之间的位置关系的稳定性的光谱仪。解析：光谱仪1A包括：具有 杆4和帽5; 设置在杆4上的光学单元10A; 以及穿过杆4的引导销3.光学单元10A具有：用于分散从盖5的光入射部6入射的光并将其反射的分光部21; 用于检测由分光部21分散和反射的光的光电检测器30; 用于支撑光电检测器30的支撑件40，使得在光电检测器和分光部件21之间形成空间; 从支撑件40突出的突起11; 以及电连接到光电检测器30的布线。突起11设置在杆4接触的位置。 引线引脚3电连接到布置在突出部分11中的布线的第二端子部分。

    The spectral module
    292.
    发明专利
    The spectral module 有权

    公开(公告)号：JP5335729B2

    公开(公告)日：2013-11-06

    申请号：JP2010085204

    申请日：2010-04-01

    Applicant: 浜松ホトニクス株式会社

    Inventor： 勝己 柴山 ,  隆文 能野

    IPC: G01J3/18 ,  G01J3/36 ,  G02B5/08 ,  G02B5/18

    CPC classification number: G01J3/021 ,  G01J3/02 ,  G01J3/0202 ,  G01J3/0256 ,  G01J3/0262 ,  G01J3/0291 ,  G01J3/18 ,  G01J3/36

    Abstract: A spectroscopic module 1 is provided with a spectroscopic unit 8 and a photodetector 9 in addition to a spectroscopic unit 7 and a photodetector 4 and thus can enhance its detection sensitivity for light in a wide wavelength range or different wavelength regions of light. A light-transmitting hole 4b is disposed between light detecting portions 4a, 9a, while a reflection unit 6 is provided so as to oppose a region R in a light-absorbing substrate 2, whereby the size can be kept from becoming larger. Ambient light La is absorbed by the region R in the substrate 2. Any part of the light La transmitted through the region R in the substrate 2 is reflected to the region R by the unit 6 formed so as to oppose the region R, whereby stray light can be inhibited from being caused by the incidence of the light La.

    Inclined structure, manufacturing method for inclined structure and spectroscopic sensor
    293.
    发明专利
    Inclined structure, manufacturing method for inclined structure and spectroscopic sensor 有权
    嵌入式结构和光谱传感器的制造方法

    公开(公告)号：JP2013040896A

    公开(公告)日：2013-02-28

    申请号：JP2011179646

    申请日：2011-08-19

    Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

    Inventor： YOSHIZAWA TAKAHIKO

    IPC: G01J3/26 ,  G01J3/28 ,  G02B5/26 ,  G02B5/28

    CPC classification number: G01J3/0256 ,  B81B2201/047 ,  B81B2203/0384 ,  G01J1/0488 ,  G01J3/36 ,  G01J2003/1213 ,  G02B5/201 ,  G02B5/285 ,  H01L29/06 ,  H01L31/02165 ,  H01L31/02327 ,  H01L31/02366 ,  H01L31/18

    Abstract: PROBLEM TO BE SOLVED: To manufacture a minute inclined structure.SOLUTION: A manufacturing method for an inclined structure includes the steps of: (a) forming a sacrificial film on a substrate; (b) forming a first film which includes a first part connected to the substrate, a second part located on the sacrificial film, and a third part located between the first part and the second part, and which has a region having a film thickness thinner than the first part at a part of the third part or at a boundary part between the second part and the third part; (c) removing the sacrificial film; and (d) bending the first film at the region having the thin film thickness and inclining the second part of the first film to the substrate, after the step (c).

    Abstract translation: 要解决的问题：制造分钟倾斜结构。 解决方案：倾斜结构的制造方法包括以下步骤：（a）在基板上形成牺牲膜; （b）形成第一膜，其包括连接到所述基板的第一部分，位于所述牺牲膜上的第二部分和位于所述第一部分和所述第二部分之间的第三部分，并且所述第三部分具有薄膜厚度更薄的区域 比第一部分在第三部分的一部分或第二部分和第三部分之间的边界部分处; （c）去除牺牲膜; 以及（d）在步骤（c）之后，在具有薄膜厚度的区域上弯曲第一膜并将第一膜的第二部分倾斜到基板。 版权所有（C）2013，JPO＆INPIT

    Monitorable spectrometer
    296.
    发明专利
    Monitorable spectrometer 审中-公开
    可监测光谱仪

    公开(公告)号：JP2012098050A

    公开(公告)日：2012-05-24

    申请号：JP2010243381

    申请日：2010-10-29

    Applicant: Mitaka Koki Co Ltd ,  三鷹光器株式会社

    Inventor： YAMAZAKI TOSHIO

    IPC: G01N21/27 ,  G02B5/04

    CPC classification number: G01J3/0256 ,  G01J3/0208 ,  G01J3/021 ,  G01J3/0237 ,  G01J3/0243 ,  G01J3/0264 ,  G01J3/04 ,  G01J3/2823 ,  G01N21/31 ,  G01N2021/1793 ,  G02B27/1066 ,  G02B27/143

    Abstract: PROBLEM TO BE SOLVED: To downsize a spectrometer capable of monitoring a measurement object.SOLUTION: A monitorable spectrometer includes a first optical path L1 from a measurement object Sm to a spectroscopic body 25 via an optical system 30 and a slit part 23 of a slit mirror block 21, and a second optical path L2 from the measurement object Sm to a two-dimensional imaging device 40 via the optical system 30 and a mirror surface 22 of the slit mirror block 21. The slit part 23 and the spectroscopic body 25 integrally constitute a spectroscopic part 20.

    Abstract translation: 要解决的问题：减小能够监测测量对象的光谱仪。 解决方案：可监视光谱仪包括经由光学系统30的测量对象Sm到分光镜主体25的第一光路L1和狭缝镜块21的狭缝部23和来自测量的第二光路L2 将物体Sm经由光学系统30和狭缝镜块21的镜面22与二维成像装置40连接。狭缝部23和分光镜25一体地构成光谱部20。 ）2012，JPO＆INPIT

    Spectroscopic module and its manufacturing method
    300.
    发明专利
    Spectroscopic module and its manufacturing method 审中-公开
    光谱模块及其制造方法

    公开(公告)号：JP2009300417A

    公开(公告)日：2009-12-24

    申请号：JP2008311020

    申请日：2008-12-05

    Applicant: Hamamatsu Photonics Kk ,  浜松ホトニクス株式会社

    Inventor： SHIBAYAMA KATSUMI ,  YOSHINO TAKAFUMI ,  KASAHARA TAKASHI ,  ITO MASASHI ,  UI ANNA

    IPC: G01J3/18 ,  G01J3/36 ,  G02B7/00

    CPC classification number: G01J3/02 ,  G01J3/0208 ,  G01J3/0243 ,  G01J3/0256 ,  G01J3/0259 ,  G01J3/0286 ,  G01J3/0297 ,  G01J2003/1213 ,  G02B5/1814 ,  G02B7/025 ,  Y10T156/10

    Abstract: PROBLEM TO BE SOLVED: To provide a spectroscopic module manufacturing method and a spectroscopic module capable of making light appropriately incident onto a main body part. SOLUTION: A photo-detection unit 10 constituted by pasting a photo-detection element 5 and a light transmission plate 56 to each other is pasted to the front surface 2a of a substrate 2 by an optical plastic agent 63 in the method for manufacturing the spectroscopic module 1. Since a light passage hole 50 of the photo-detection element 5 is covered with the light transmission plate 56 at this time, the optical plastic agent 63 is prevented from entering the light passage hole 50. Since the light passage hole 50 is formed in a semiconductor substrate 91 after the semiconductor substrate 91 provided with a photo-detection part 5a and the light transmission plate 56 are pasted to each other at the preparation of the photo-detection unit 10, it is possible to reliably prevent anything that could cause the occurrence of refraction, scattering, etc. from entering the light passage hole 50. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种能够适当地入射到主体部分上的光的光谱模块制造方法和分光模块。 解决方案：通过将光检测元件5和透光板56彼此粘贴而构成的光检测单元10通过光学塑料剂63粘贴到基板2的前表面2a上， 由于光检测元件5的光通过孔50此时被透光板56覆盖，所以防止光学塑料剂进入光通路孔50.由于光通过 在准备光电检测单元10时，在设置有光检测部分5a和透光板56的半导体基板91彼此粘贴之后，在半导体基板91中形成孔50，可以可靠地防止 任何可能导致折射，散射等进入光通过孔50的物体。（C）2010，JPO＆INPIT

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