Liquid molding compound and preparation method thereof

    公开(公告)号:US12037488B1

    公开(公告)日:2024-07-16

    申请号:US18639612

    申请日:2024-04-18

    Abstract: The disclosure provides a liquid molding compound and preparation method thereof, belonging to the technical field of semiconductor packaging. The liquid molding compound includes: the following components in mass fraction, a filler 83%-88%, an epoxy resin 6%-9%, a curing agent 6%-9%, a colorant 0.1%-0.2%, an accelerator 0.1%-0.3%, and a paraffin oil 0.3%-0.6%; by adding paraffin oil that has a small surface activity, paraffin oil does not participate in the reaction between epoxy resin and curing agent, is easily compatible with epoxy resin, and easy to precipitate under heating conditions. The precipitated paraffin oil forms a spacer layer between the colloid surface and the thermal release tape. The paraffin oil of the spacer layer has almost no adhesion to the acrylic adhesive on the thermal release tape, so the thermal release tape can be easily removed at a certain temperature to achieve the effect of no residual adhesive.

    Recyclable Epoxy-Anhydride Polymer
    308.
    发明公开

    公开(公告)号:US20240199807A1

    公开(公告)日:2024-06-20

    申请号:US18532599

    申请日:2023-12-07

    Abstract: A crosslinked polymeric composition comprising the following components: (i) a matrix comprising an epoxy-anhydride crosslinked polymer containing a multiplicity of ester linkages resulting from reaction between epoxy-containing and anhydride-containing molecules; and (ii) a hydroxy-containing solid filler component integrated into component (i) and engaged in dynamic reversible covalent crosslinking with component (i) by a reversible exchange reaction between the ester linkages and hydroxy groups in the hydroxy-containing solid filler; wherein the crosslinked polymeric composition behaves as a thermoset up to a temperature X and behaves as a processible thermoplastic at a temperature greater than X. Also described herein is a method for producing the above composition comprising combining and mixing the following components: (a) epoxy-containing molecules, (b) anhydride-containing molecules, (c) a hydroxy-containing solid filler, and (d) a catalyst that promotes curing between epoxy and anhydride groups, followed by heating of the resultant mixture to a temperature of least 100° C.

    Electrically Conductive Compositions for Battery Electrode Plates

    公开(公告)号:US20240158604A1

    公开(公告)日:2024-05-16

    申请号:US18281605

    申请日:2022-03-16

    CPC classification number: C08K3/04 C08K2201/001 C08K2201/006 C08K2201/014

    Abstract: Aspects of the disclosure relate to a composition including: from about 35 wt % to about 70 wt % of at least one polyethylene polymer; from about 25 wt % to about 55 wt % of at least one graphite filler; and from about 2 wt % to about 15 wt % of a carbon powder filler having a BET surface area of at least 50 square meters per gram (m2/g). The polyethylene polymer has a density of at least 0.94 gram per cubic centimeter (g/cm3), a melt flow rate (MFR) of at least 10 g per 10 minutes (g/10 min) measured at 190° C. and 21.6 kilogram (kg), and an Environmental Stress-Cracking Resistance (ESCR) of at least 500 hours. The composition has a volume electrical resistivity of less than 5 ohm·centimeter (ohm·cm) and a MFR of at least 4 g/10 min measured at 280° C. and 21.6 kg.

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