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公开(公告)号:US12064396B2
公开(公告)日:2024-08-20
申请号:US17513565
申请日:2021-10-28
Applicant: Fresenius Kabi Deutschland GmbH
Inventor: Karin Platenkamp , Craig L. Sandford , Koos L. Hakvoort
CPC classification number: A61J1/1468 , A61J1/10 , A61J1/1475 , A61J1/18 , A61J1/201 , A61J1/2037 , A61J1/2048 , A61M1/0209 , C08K5/10 , C08K5/11 , C08K5/12 , C08K2201/014 , C08K2201/019 , C08K5/10 , C08L27/06
Abstract: A container for blood or a blood component is provided, the container comprising one or more container walls defining an interior chamber, the container walls comprising one or more layers, the layers comprising or consisting of a composition comprising one or more polymeric materials and at least one extractable agent selected from the group consisting of a terephthalate ester, a cyclohexane dicarboxylic acid ester, a citrate ester, and a polyol ester, wherein the container further comprises one or more additional components, wherein the container comprises less than about 3% (w/w) of di-2-ethylhexyl phthalate (DEHP), preferably wherein the container comprises less than about 3% (w/w) of phthalates. Thereby, improved blood products are provided in which the DEHP or overall phthalate content is reduced.
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公开(公告)号:US12037488B1
公开(公告)日:2024-07-16
申请号:US18639612
申请日:2024-04-18
Applicant: Hubei Choice Technology Co., Ltd.
Inventor: De Wu , Shengquan Wang , Shuhang Liao , Junxing Su
CPC classification number: C08L63/00 , C08K3/04 , C08K3/36 , C08K2201/014 , C08L2207/322
Abstract: The disclosure provides a liquid molding compound and preparation method thereof, belonging to the technical field of semiconductor packaging. The liquid molding compound includes: the following components in mass fraction, a filler 83%-88%, an epoxy resin 6%-9%, a curing agent 6%-9%, a colorant 0.1%-0.2%, an accelerator 0.1%-0.3%, and a paraffin oil 0.3%-0.6%; by adding paraffin oil that has a small surface activity, paraffin oil does not participate in the reaction between epoxy resin and curing agent, is easily compatible with epoxy resin, and easy to precipitate under heating conditions. The precipitated paraffin oil forms a spacer layer between the colloid surface and the thermal release tape. The paraffin oil of the spacer layer has almost no adhesion to the acrylic adhesive on the thermal release tape, so the thermal release tape can be easily removed at a certain temperature to achieve the effect of no residual adhesive.
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公开(公告)号:US20240228776A1
公开(公告)日:2024-07-11
申请号:US18558256
申请日:2022-05-05
Applicant: BYK-Chemie GmbH
Inventor: Robert Arechederra
CPC classification number: C08L77/00 , C08K3/105 , C08K2201/014 , C08L2201/08
Abstract: The present invention relates a composition comprising a polyamide and a modified polysaccharide, a three-dimensional object comprising the same and a use and method for stabilizing a polyamide against heat.
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304.
公开(公告)号:US12024632B2
公开(公告)日:2024-07-02
申请号:US17469052
申请日:2021-09-08
Applicant: Konica Minolta, Inc.
Inventor: Natsumi Kiriishi , Koji Daifuku , Takayuki Suzuki , Kiyoshi Fukusaka
IPC: C09B67/20 , C08K5/41 , C08K5/521 , C08K5/5333 , C09B67/22 , G02B1/04 , G02B5/20 , H01L27/146
CPC classification number: C09B67/0063 , C08K5/41 , C08K5/521 , C08K5/5333 , C09B67/0033 , G02B1/04 , G02B5/208 , H01L27/1462 , C08K2201/014
Abstract: A near infrared absorbing composition includes a near infrared absorber. The near infrared absorber contains at least one of Ingredient (A) and Ingredient (B). Ingredient (A) consists of a first compound having a first structure represented by General Formula (I), a second compound having a second structure represented by General Formula (II), and a copper ion. Ingredient (B) consists of a first copper complex in which the first compound is coordinated and a second copper complex in which the second compound is coordinated. In General Formula (I), R1 represents an alkyl group containing 1-20 carbons or an aryl group containing 6-20 carbons, and may further have a substituent. In General Formula (II), R2 represents an alkyl group containing 1-20 carbons or an aryl group containing 6-20 carbons, and may further have a substituent.
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公开(公告)号:US20240209207A1
公开(公告)日:2024-06-27
申请号:US18554844
申请日:2022-03-17
Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
Inventor: Takahiko SUMINO , Yuuki SATO
CPC classification number: C08L79/08 , C08K13/04 , C08K3/04 , C08K2003/265 , C08K2003/343 , C08K7/06 , C08K2201/014 , C08L2203/30
Abstract: A thermoplastic polyimide resin composition containing 30 to 60 mass % of a thermoplastic polyimide resin (A), 5 to 50 mass % of carbon fiber (B), 5 to 20 mass % of a fluorine resin (C), and 1 to 40 mass % of an inorganic filler (D), and a molded product including the thermoplastic polyimide resin composition.
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公开(公告)号:US20240209180A1
公开(公告)日:2024-06-27
申请号:US18556578
申请日:2022-03-29
Applicant: NICHIAS CORPORATION
Inventor: Katsumi WATANABE
CPC classification number: C08K3/346 , C08J5/18 , C08K3/22 , C08K3/36 , F16J15/102 , C08J2327/18 , C08K2003/2227 , C08K2201/014
Abstract: Provided is a fluorine resin sheet for a gasket capable of exhibiting stable sealability while suppressing deformation in the direction to the periphery even under a high-temperature condition when processed into a gasket shape.
The fluorine resin sheet for a gasket comprises a fluorine resin and an inorganic filler, wherein the content proportion of the fluorine resin is less than 60 vol %, and the inorganic filler includes calcined clay having a porosity of 13% or less, and the calcined clay is preferably calcined kaolin.-
公开(公告)号:US20240199849A1
公开(公告)日:2024-06-20
申请号:US18285469
申请日:2022-03-31
Applicant: IDEMITSU KOSAN CO.,LTD.
Inventor: Misako MATSUDA , Kenichi MITSUHASHI , Shuya NAGAYAMA
CPC classification number: C08K5/43 , C08J5/18 , C08K5/1345 , C08K5/42 , C08K5/526 , C08K5/527 , C08L69/00 , C08J2369/00 , C08J2469/00 , C08J2483/04 , C08K2201/014 , C08L2205/025 , C08L2205/03
Abstract: The present invention relates to a polycarbonate-based resin composition including: a polycarbonate-based resin (A); and a perfluoroalkylsulfonimide (B) represented by the following formula (1), wherein the polycarbonate-based resin (A) has a branching ratio of 0.30 mol % or more and 3.0 mol % or less, which is calculated from the expression “(number of moles of structural unit derived from branching agent)/(number of moles of structural unit derived from dihydric phenol+number of moles of structural unit derived from branching agent+number of moles of terminal unit)×100,” and wherein a content of the perfluoroalkylsulfonimide (B) is 0.05 part by mass or more and 2.0 parts by mass or less with respect to 100 parts by mass of the polycarbonate-based resin (A).
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公开(公告)号:US20240199807A1
公开(公告)日:2024-06-20
申请号:US18532599
申请日:2023-12-07
Applicant: UT-Battelle, LLC
Inventor: Amit K. NASKAR , Jiho SEO , Sargun Singh ROHEWAL , Michael TOOMEY , Logan T. KEARNEY , Joshua T. DAMRON
CPC classification number: C08G65/2615 , C08G65/2642 , C08K5/00 , C08K11/005 , C08K2201/014
Abstract: A crosslinked polymeric composition comprising the following components: (i) a matrix comprising an epoxy-anhydride crosslinked polymer containing a multiplicity of ester linkages resulting from reaction between epoxy-containing and anhydride-containing molecules; and (ii) a hydroxy-containing solid filler component integrated into component (i) and engaged in dynamic reversible covalent crosslinking with component (i) by a reversible exchange reaction between the ester linkages and hydroxy groups in the hydroxy-containing solid filler; wherein the crosslinked polymeric composition behaves as a thermoset up to a temperature X and behaves as a processible thermoplastic at a temperature greater than X. Also described herein is a method for producing the above composition comprising combining and mixing the following components: (a) epoxy-containing molecules, (b) anhydride-containing molecules, (c) a hydroxy-containing solid filler, and (d) a catalyst that promotes curing between epoxy and anhydride groups, followed by heating of the resultant mixture to a temperature of least 100° C.
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公开(公告)号:US20240158604A1
公开(公告)日:2024-05-16
申请号:US18281605
申请日:2022-03-16
Applicant: SHPP GLOBAL TECHNOLOGIES B.V.
Inventor: Norberto SILVI , Paul Scott LONG , Walter THOMPSON , Matthew NIEMEYER , Scott DAVIS
IPC: C08K3/04
CPC classification number: C08K3/04 , C08K2201/001 , C08K2201/006 , C08K2201/014
Abstract: Aspects of the disclosure relate to a composition including: from about 35 wt % to about 70 wt % of at least one polyethylene polymer; from about 25 wt % to about 55 wt % of at least one graphite filler; and from about 2 wt % to about 15 wt % of a carbon powder filler having a BET surface area of at least 50 square meters per gram (m2/g). The polyethylene polymer has a density of at least 0.94 gram per cubic centimeter (g/cm3), a melt flow rate (MFR) of at least 10 g per 10 minutes (g/10 min) measured at 190° C. and 21.6 kilogram (kg), and an Environmental Stress-Cracking Resistance (ESCR) of at least 500 hours. The composition has a volume electrical resistivity of less than 5 ohm·centimeter (ohm·cm) and a MFR of at least 4 g/10 min measured at 280° C. and 21.6 kg.
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310.
公开(公告)号:US20240150548A1
公开(公告)日:2024-05-09
申请号:US18279003
申请日:2022-02-03
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Patricia J. Tegeder , Martin Engler , Ricardo Mizoguchi Gorgoll , Jens Eichler , Stefanie Wildhack
IPC: C08K3/38 , C08G65/333 , C08G77/46 , C08K9/02 , C08L71/02
CPC classification number: C08K3/38 , C08G65/33303 , C08G77/46 , C08K9/02 , C08L71/02 , C08K2003/385 , C08K2201/014 , C08L2203/20
Abstract: A curable composition comprises oxidized boron nitride particles and a polyaziridine. Each oxidized boron nitride particle comprises a hydrated boron oxide surface layer disposed on a boron nitride core. A method of curing and a cured reaction product are also disclosed.
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