Abstract:
A microfluidic circuit element comprising a microfluidic channel, in which the microfluidic channel has nano interstices formed at both sides thereof and having a height less than that of the center of the channel, gives more driving force of the microfluidic channel and provides stable flow of a fluid.
Abstract:
The presently disclosed subject matter provides functional perfluoropolyether (PFPE) materials for use in fabricating and utilizing microscale devices, such as a microfluidic device. The functional PFPE materials can be used to adhere layers of PFPE materials to one another or to other substrates to form a microscale device. Further, the presently disclosed subject matter provides a method for functionalizing the interior surface of a microfluidic channel and/or a microtiter well. Also the presently disclosed subject matter provides a method for fabricating a microscale structure through the use of a sacrificial layer of a degradable material.
Abstract:
The invention relates to a microsystem which is intended to receive beads and to position said beads precisely at determined locations in the microsystem. The inventive microsystem consists of a container (3) comprising a cavity (4) which is equipped with blocking elements (5). According to the invention, the blocking elements are used to arrange and stack the beads in the spaces therebetween, said spaces forming the aforementioned determined locations. The invention also comprises a cover (7) which is hermetically fixed to the container (3) and inlet (8) and outlet (9) means which enable a fluid to flow into the cavity (4). The invention also relates to the production and use of said bead-filled microsystem.
Abstract:
A micro fluid system support unit includes a first support body (2), a first adhesive layer (1a) arranged on the surface of the first support body (2), a first hollow filament group consisting of a plurality of hollow filaments (501 to 508) arranged with an arbitrary shape on the surface of the first adhesive layer (1a), a second hollow filament group consisting of a plurality of hollow filaments (511 to 518) arranged in the direction orthogonal to the first hollow filament group, a second adhesive layer (1b) arranged on the surface of the second hollow filament group, and a second support body (6) arranged on the surface of the second adhesive layer (1b). The first and the second hollow filament group constitute a flow passage layer.
Abstract:
The present invention provides a micro-fluidic device (104), comprising: - a semiconductor substrate; - at least one micro-reactor (105) in said semiconductor substrate; - one or more micro-fluidic channels (101) in said semiconductor substrate, connected to said at least one micro-reactor (105); - a cover layer (106) bonded to the semiconductor substrate (900) for sealing the one or more micro-fluidic channels (101); and - at least one through-substrate trench (100) surrounding said at least one micro-reactor (105) and the one or more micro-fluidic channels (101).
Abstract:
An additive manufacturing process includes forming an object material stack using sheet materials without use of binder material between the sheet materials and forming features of the cross-sectional layers of a 3D object in the corresponding sheet materials. Another process involves forming features of the cross-sectional layers of a 3D object in soot layers of a laminated soot sheet. A manufactured article includes three or more glass layers laminated together without any binder material between the glass layers. At least one of the glass layers is composed of silica or doped silica, and at least one feature is formed in at least one of the glass layers.
Abstract:
A microfluidic device (100, 200, 300, 400, 500, 600, 700) includes at least a semiconductor chip (110) having a main chip surface. The microfluidic device further includes an encapsulation body (120) embedding the semiconductor chip, the encapsulation body having a main body surface (121). A microfluidic component (130) extends over the main chip surface and over the main encapsulation body surface and traverses an outline (110a) of the main chip surface.