公开(公告)号：US10126462B2

公开(公告)日：2018-11-13

申请号：US14982518

申请日：2015-12-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: G01V8/12 ,  G01V13/00

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a sensor chip, a light-emitting device, a transparent molding material and a non-transparent molding material, wherein the sensor chip comprises a sensor region; the light-emitting device is located on the sensor chip and is electrically coupled to the sensor chip; the transparent molding material at least covers a light-emitting surface of the light-emitting device; and the non-transparent molding material isolates the transparent molding material from the sensor region.

公开(公告)号：US10094797B2

公开(公告)日：2018-10-09

申请号：US15605825

申请日：2017-05-25

Applicant: STMicroelectronics Pte Ltd.

Inventor： Olivier Le Neel ,  Ravi Shankar ,  Suman Cherian ,  Calvin Leung ,  Tien-Choy Loh ,  Shian-Yeu Kam

IPC: H01L29/84 ,  G01N27/22 ,  H01L25/065 ,  H01L29/78 ,  G01L9/12 ,  G01K7/18 ,  G01K7/20 ,  G01L19/00 ,  G01K7/16 ,  H01L25/00 ,  H01L27/02 ,  G01K7/01 ,  G01D21/02

Abstract: A semiconductor-based multi-sensor module integrates miniature temperature, pressure, and humidity sensors onto a single substrate. Pressure and humidity sensors can be implemented as capacitive thin film sensors, while the temperature sensor is implemented as a precision miniature Wheatstone bridge. Such multi-sensor modules can be used as building blocks in application-specific integrated circuits (ASICs). Furthermore, the multi-sensor module can be built on top of existing circuitry that can be used to process signals from the sensors. An integrated multi-sensor module that uses differential sensors can measure a variety of localized ambient environmental conditions substantially simultaneously, and with a high level of precision. The multi-sensor module also features an integrated heater that can be used to calibrate or to adjust the sensors, either automatically or as needed. Such a miniature integrated multi-sensor module that features low power consumption can be used in medical monitoring and mobile computing, including smart phone applications.

公开(公告)号：US20180229334A1

公开(公告)日：2018-08-16

申请号：US15950719

申请日：2018-04-11

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang JIN ,  Yun LIU

IPC: B23K35/36 ,  B23K35/02

CPC classification number: B23K35/3618 ,  B23K35/0227 ,  B23K35/0266 ,  B23K35/3613

Abstract: The present disclosure is directed to a solder wire that includes a core having both a rosin flux and a thermoset material. The solder wire being configured to provide an oxide removing rosin flux to an electrical component, a solder alloy to the electrical component, and a protective layer to the solder alloy in a single soldering step.

公开(公告)号：US10038108B2

公开(公告)日：2018-07-31

申请号：US15340216

申请日：2016-11-01

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan ,  Laurent Herard ,  Yong Jiang Lei

IPC: H01L31/12 ,  G06M7/00 ,  H01L31/0203 ,  H01L31/18 ,  G01S7/481 ,  H01L31/153 ,  H01L25/00

CPC classification number: H01L31/0203 ,  G01S7/481 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/46 ,  H01L25/50 ,  H01L31/125 ,  H01L31/153 ,  H01L31/173 ,  H01L31/18

Abstract: One or more embodiments are directed to system in package (SiP) for optical devices, such as proximity sensing or optical ranging devices. One embodiment is directed to an optical sensor package that includes a substrate, a sensor die coupled to the substrate, a light-emitting device coupled to the substrate, and a cap. The cap is positioned around side surfaces of the sensor die and covers at least a portion of the substrate. The cap includes first and second sidewalls, an inner wall having first and second side surfaces and a mounting surface, and a cover in contact with the first and second sidewalls and the inner wall. The first and second side surfaces are transverse to the mounting surface, and the inner wall includes an opening extending into the inner wall from the mounting surface. A first adhesive material is provided on the sensor die and at least partially within the opening, and secures the inner wall to the sensor die.

公开(公告)号：US20180122728A1

公开(公告)日：2018-05-03

申请号：US15858999

申请日：2017-12-29

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/433 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/29294 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01047

Abstract: One or more embodiments are directed to a semiconductor package that includes an integrated heatsink and methods of forming same. In one embodiment, the semiconductor package includes a semiconductor die coupled to a first surface of a die pad. A heatsink is coupled to a second surface of the die pad. Encapsulation material is located around the die and die pad and over a portion of the heatsink. A bottom portion of the heatsink may remain exposed from the encapsulation material. Furthermore, a portion of the heatsink may extend from a side of the encapsulation material.

公开(公告)号：US20180053861A1

公开(公告)日：2018-02-22

申请号：US15802271

申请日：2017-11-02

Applicant: STMicroelectronics Pte Ltd. ,  STMicroelectronics R&D Limited

Inventor： Yonggang JIN ,  David LAWSON ,  Colin CAMPBELL ,  Anandan RAMASAMY

IPC: H01L31/0216 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/101 ,  H01L31/02

CPC classification number: H01L31/02165 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/02162 ,  H01L31/02164 ,  H01L31/02327 ,  H01L31/1013 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: Embodiments of the present disclosure are directed to optical packages having a package body that includes a light protection coating on at least one surface of a transparent material. The light protection coating includes one or more openings to allow light to be transmitted to the optical device within the package body. In one embodiment, the light protection coating and the openings allow substantially perpendicular radiation to be directed to the optical device within the package body. In one exemplary embodiment the light protection coating is located on an outer surface of the transparent material. In another embodiment, the light protection coating is located on an inner surface of the transparent material inside of the package body.

公开(公告)号：US09768216B2

公开(公告)日：2017-09-19

申请号：US14535423

申请日：2014-11-07

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Dave Alexis Delacruz ,  David Gani

IPC: H01L27/146 ,  G03B17/02 ,  G03B29/00 ,  G03B3/10

CPC classification number: H01L27/14625 ,  G03B3/10 ,  G03B17/02 ,  G03B29/00 ,  H01L27/14618 ,  H01L27/14685

Abstract: An image sensor device may include an interconnect layer, an image sensor IC on the interconnect layer, and a barrel adjacent the interconnect layer and having first electrically conductive traces. The image sensor device may include a liquid crystal focus cell carried by the barrel and having cell layers, and second electrically conductive contacts. A pair of adjacent cell layers may have different widths. The image sensor device may include an electrically conductive adhesive body coupling at least one of the second electrically conductive contacts to a corresponding one of the first electrically conductive traces.

公开(公告)号：US20170263565A1

公开(公告)日：2017-09-14

申请号：US15068741

申请日：2016-03-14

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Loic Pierre Louis RENARD ,  Raquel FUNDAN

IPC: H01L23/552 ,  H01L21/78 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L21/4871 ,  H01L21/4875 ,  H01L21/78 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/45565 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/45664 ,  H01L2924/00014

Abstract: An integrated circuit (IC) package includes a substrate and an IC die carried by the substrate. An encapsulated body is over the IC die. At least one grounding wire is within the encapsulated body and has a proximal end coupled to the substrate and a distal end exposed on an outer surface of the encapsulated body. An electrically conductive shield layer is on the outer surface of the encapsulated body and in contact with the exposed distal end of the at least one grounding wire.

公开(公告)号：US09698105B2

公开(公告)日：2017-07-04

申请号：US15251209

申请日：2016-08-30

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/34 ,  H01L23/00 ,  H01L23/373 ,  H01L23/498 ,  H01L23/367 ,  H01L23/31 ,  H01L21/48 ,  H01L23/538 ,  H01L21/56 ,  H01L21/78 ,  H01L23/18

CPC classification number: H01L23/562 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/4871 ,  H01L21/4882 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/78 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/18 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/3511

Abstract: A method includes forming a molded panel that includes a number of integrated circuits, fan-out components and stiffeners embedded in an encapsulation material. A redistribution layer is formed over the integrated circuits and the fan-out components. The redistribution layer is electrically coupled to contacts of the integrated circuits. The molded panel is singulated to form electronic devices. Each electronic device each an integrated circuit that is separated from a fan-out component by a portion of the encapsulation material and a stiffener separated from the fan-out component by a second portion of the encapsulation material.

公开(公告)号：US20170186674A1

公开(公告)日：2017-06-29

申请号：US15019617

申请日：2016-02-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49568 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49513 ,  H01L23/49562 ,  H01L23/49582 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/29294 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/85 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/01047

Abstract: One or more embodiments are directed to a semiconductor package that includes an integrated heatsink and methods of forming same. In one embodiment, the semiconductor package includes a semiconductor die coupled to a first surface of a die pad. A heatsink is coupled to a second surface of the die pad. Encapsulation material is located around the die and die pad and over a portion of the heatsink. A bottom portion of the heatsink may remain exposed from the encapsulation material. Furthermore, a portion of the heatsink may extend from a side of the encapsulation material.