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公开(公告)号：US20230389450A1
公开(公告)日：2023-11-30
申请号：US18305268
申请日：2023-04-21
Applicant: STMICROELECTRONICS S.r.l. , COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
Inventor： Paolo Giuseppe CAPPELLETTI , Gabriele NAVARRO
CPC classification number: H10N70/231 , G11C13/0004 , G11C13/0069 , H10N70/8413 , H10N70/8828 , G11C2013/008
Abstract: Phase-change memory cells and methods of manufacturing and operating phase-change memory cells are provided. In at least one embodiment, a phase-change memory cell includes a heater and a stack. The stack includes at least one germanium layer or a nitrogen doped germanium layer, and at least one layer of a first alloy including germanium, antimony, and tellurium. A resistive layer is located between the heater and the stack.
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公开(公告)号：US20230384837A1
公开(公告)日：2023-11-30
申请号：US18183464
申请日：2023-03-14
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Federico RIZZARDINI , Lorenzo BRACCO
IPC: G06F1/16 , H04M1/02 , G06F1/3246 , G01C1/00
CPC classification number: G06F1/1677 , H04M1/0245 , G06F1/3246 , G01C1/00 , G01C9/08
Abstract: The present disclosure is directed to a device and method for lid angle detection that is accurate even if the device is activated in an upright position. While the device is in a sleep state, first and second sensor units measure acceleration and angular velocity, and calculate orientations of respective lid components based on the acceleration and angular velocity measurements. Upon the device exiting the sleep state, a processor estimates the lid angle using the calculated orientations, sets the estimated lid angle as an initial lid angle, and updates the initial lid angle using, for example, two accelerometers; two accelerometers and two gyroscopes; two accelerometers and two magnetometers; or two accelerometers, two gyroscopes, and two magnetometers.
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公开(公告)号：US11823750B2
公开(公告)日：2023-11-21
申请号：US17244450
申请日：2021-04-29
Applicant: STMicroelectronics (Alps) SAS , STMicroelectronics S.r.l.
Inventor： Philippe Sirito-Olivier , Giovanni Luca Torrisi
CPC classification number: G11C16/3454 , G11C16/105 , G11C16/26 , G11C16/30 , G11C17/00
Abstract: A method for writing into a one-time programmable memory of an integrated circuit includes attempting, by a memory control circuit of the integrated circuit, to write data in at least one first register of the one-time programmable memory; verifying, by the memory control circuit, whether the data has been correctly written in the at least one first register; and, in case the data has not been correctly written in the at least one first register, attempting, by the memory control circuit, to write the data in at least one second register of the one-time programmable memory.
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公开(公告)号：US20230367342A1
公开(公告)日：2023-11-16
申请号：US17741994
申请日：2022-05-11
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Carmela MARCHESE , Rossella BASSOLI
IPC: G05F1/10
CPC classification number: G05F1/10
Abstract: A method and apparatus for performing dynamic current scaling of an input current of a voltage regulator are provided. The method and apparatus allow tuning current consumption in various applications, calculating a duration of an activity phase in which various algorithms are executed and activating dynamic current scaling of a regulator if the activity duration is shorter than a programmable threshold. A controller receives a threshold for an activity duration and a window size in which to evaluate the activity duration.
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公开(公告)号：US20230361737A1
公开(公告)日：2023-11-09
申请号：US18303931
申请日：2023-04-20
Applicant: STMicroelectronics S.r.l.
Inventor： Gaetano Cosentino
CPC classification number: H03F3/45475 , H03F3/45273 , H03F1/483 , H03F1/086
Abstract: A circuit an amplifier stage that amplifier stage includes a positive amplifier branch and a negative amplifier branch and has current flow paths therethrough cascaded in a flow line for a core current for the amplifier stage between a supply node and a ground node. The positive and negative amplifier branches have respective input nodes configured to receive an input signal applied therebetween. A current mirror loop can be coupled to the respective input nodes of the positive and negative amplifier branches and provides an adjustable high-impedance bias source for the core current for the amplifier stage. In addition to, or instead of the current mirror loop, the circuit can include stability network having a gain bandwidth range. The amplifier stage is configured to short-circuit the output signal from the amplifier stage within the gain bandwidth range based on an output voltage setting signal.
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Patent Agency Ranking
326.发明公开公开(公告)号：US20230361010A1
公开(公告)日：2023-11-09
申请号：US18140194
申请日：2023-04-27
Applicant: STMicroelectronics S.r.l.
Inventor： Riccardo VILLA
IPC: H01L23/495 , H01L23/31 , H01L23/36 , H01L21/56
CPC classification number: H01L23/49568 , H01L23/3121 , H01L23/36 , H01L21/56 , H01L23/49517
Abstract: A semiconductor chip or die is arranged on a first surface of a thermally conductive die pad of a substrate such as a leadframe. An encapsulation of insulating material in molded onto the die pad having the semiconductor die arranged on the first surface. At the second surface of the die pad, opposite the first surface, the encapsulation borders on the die pad at a borderline around the die pad. A recessed portion of the encapsulation is provided, for example, via laser ablation, at the borderline around the die pad. Thermally conductive material such as metal material is filled in the recessed portion of the encapsulation around the die pad. The surface area of the thermally conductive die pad is augmented by the filling of thermally conductive material in the recessed portion of the encapsulation thus improving thermal performance of the device.
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公开(公告)号：US11810839B2
公开(公告)日：2023-11-07
申请号：US17674697
申请日：2022-02-17
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Cristina Somma
IPC: H01L23/495 , H01L23/498
CPC classification number: H01L23/49503 , H01L23/4952 , H01L23/49575 , H01L23/49816
Abstract: One or more embodiments are directed to semiconductor packages and methods in which one or more electrical components are positioned between a semiconductor die and a surface of a substrate. In one embodiment, a semiconductor package includes a substrate having a first surface. One or more electrical components are electrically coupled to electrical contacts on the first surface of the substrate. A semiconductor die is positioned on the one or more electrical components, and the semiconductor die has an active surface that faces away from the substrate. An adhesive layer is on the first surface of the substrate and on the one or more electrical components, and the semiconductor die is spaced apart from the one or more electrical components by the adhesive layer. Wire bonds are provided that electrically couples the active surface of the semiconductor die to the substrate.
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公开(公告)号：US11809740B1
公开(公告)日：2023-11-07
申请号：US17663847
申请日：2022-05-18
Applicant: STMicroelectronics S.r.l.
Inventor： Walter Girardi
CPC classification number: G06F3/0655 , G06F3/0671 , G11C7/1036 , G11C29/00
Abstract: A circuit for reading or writing a RAM includes a shift register coupled to the RAM, a test data input, and a test data output. The circuit further includes a control circuit configured to generate a pulse every N clock cycles, each pulse triggering a RAM access operation transferring data between the shift register and the RAM, N being equal to a data width of the RAM divided by a parallel factor, the parallel factor being a number of pins in either the test data input or the test data output configured for parallel data loading.
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公开(公告)号：US11808650B2
公开(公告)日：2023-11-07
申请号：US17063147
申请日：2020-10-05
Applicant: STMicroelectronics S.r.l.
Inventor： Alberto Pagani , Federico Giovanni Ziglioli , Bruno Murari
CPC classification number: G01L5/0038 , F16B31/028 , G01L1/18 , G01L1/20 , G01L5/243
Abstract: A pressure sensing device may include a body configured to distribute a load applied between first and second parts positioned one against the other, and a pressure sensor carried by the body. The pressure sensor may include a support body, and an IC die mounted with the support body and defining a cavity. The IC die may include pressure sensing circuitry responsive to bending associated with the cavity, and an IC interface coupled to the pressure sensing circuitry.
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330.发明公开公开(公告)号：US20230353052A1
公开(公告)日：2023-11-02
申请号：US18300945
申请日：2023-04-14
Applicant: STMicroelectronics S.r.l
Inventor： Alessandro Nicolosi , Alessandra Farina , Edoardo Bonizzoni
CPC classification number: H02M3/158 , H02M1/0009 , H02M1/083
Abstract: A control module, for a resonant switched-capacitor converter with an inductor, includes a controller stage, an input stage generating a control signal indicating a control quantity, a delay stage generating a duration signal indicating a time quantity, and a circuit indicating zero crossings of the inductor current. If the control quantity is variable, the input stage clamps the control quantity to a control threshold. When in normal mode, the controller stage controls the converter to carry out a phase sequence with timings that depend on the zero crossings and the time quantity, so the converter generates an output current that depends on the time quantity and is prevented from dropping below a minimum current. If the output voltage reaches an upper threshold, the controller stage switches into pulse-skipping mode to suspend the phase sequence, and resumes the phase sequence after the output voltage drops to a lower threshold.
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